SÜSS MicroTec SE
SESMF
Other OTC111.40
USD
+11.85
- -
ISIN
DE000A1K0235
Return %
Stock
S&P500
1Y
146.19
26.53
3Y
417.18
76.60
5Y
229.78
80.11
Capital Structure
FRC
•
in mil. unless spec.Working Capital
FRC
•
in mil. unless spec.Growth Rates
FRC
•
in mil. unless spec.Quarterly Revenue
FRC
•
in mil. unless spec.Quarterly Earnings Per Share
FRC
•
in mil. unless spec.Quarterly Dividends Per Share
FRC
•
in mil. unless spec.- CEO
- Burkhardt Frick
- Full Time Employees
- 1,370
- Sector
- Technology
- Industry
- Semiconductors
- Address
- Schleissheimer Street 90 Garching bei München Germany 85748
- IPO Date
- Jan 4, 2002
- Website
- suss.com
- Similar Companies
- Business
- SUSS MicroTec SE develops, manufactures, markets, and services systems and equipment for microstructuring applications primarily in the semiconductor industry and related markets. The company operates through two main divisions: Advanced Backend Solutions and Photomask Solutions. Its product portfolio includes mask aligners, coaters and developers, UV projection scanners, and temporary and permanent bonders tailored for advanced packaging, microelectromechanical systems (MEMS), compound semiconductors, and 3D integration technologies. Additionally, it provides specialized cleaning and processing equipment for photomasks used in semiconductor manufacturing. Founded in 1949, SUSS MicroTec is headquartered in Garching near Munich, Germany, and serves customers across Europe, the Middle East, Africa, North America, and the Asia Pacific region. Recent major changes include the strategic divestiture of its MicroOptics division to Focuslight Technologies in early 2024, aligning the company with its focus on semiconductor equipment core business. The sale valued at approximately €75.5 million enables SUSS MicroTec to streamline operations and concentrate on core competencies. In 2024, the company also introduced the XBC300 Gen2 D2W/W2W, the first integrated hybrid bonding all-rounder platform that supports wafer-to-wafer as well as die-to-wafer bonding technologies, developed in partnership with SET Corporation, marking a significant advancement in its hybrid bonding product line. Furthermore, SUSS MicroTec has acquired inkjet printing technology from Meyer Burger to expand its lithography portfolio, enhancing process flexibility and capabilities. The company continues to focus on next-generation technologies such as 3D integration, MEMS, nanoimprint lithography, and energy-efficient semiconductor manufacturing, with a strong emphasis on AI and silicon carbide (SiC) semiconductor market demands. SUSS MicroTec employs around 1,577 people and leverages extensive research cooperation with industrial partners and institutes globally to maintain technological leadership in microstructuring solutions. Its key markets include semiconductor manufacturing, advanced packaging, MEMS, LED production, and compound semiconductors. The company maintains a broad international footprint with significant operations and customer bases across Asia-Pacific, EMEA, and the Americas. Recent business activities reflect a strategic emphasis on sales growth, margin improvement, and sustainable technological innovation to support the evolving semiconductor industry's needs. Its CEO, Burkhardt Frick, leads the company in driving these developments and aligning its product and service offerings with emerging global trends and technologies in microelectronics manufacturing.
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