- CEO
- Zhi Yao Yin
- Full Time Employees
- 2,963
- Sector
- Producer manufacturing
- Industry
- Industrial machinery
- Address
- No. 188, Taihua Road Shanghai SH China 201201
- IPO Date
- Jul 22, 2019
- Business
- Advanced Micro-Fabrication Equipment Inc. China (AMEC; 688012.SS) is a Shanghai-based company founded in 2004 that principally engages in the research, development, manufacture, and sale of semiconductor fabrication equipment serving the semiconductor industry and adjacent high-tech sectors including LED production, power devices, MEMS applications, and back-end wafer-level packaging. The company offers a broad portfolio of specialized products such as plasma etching tools including the Primo D-RIE, Primo AD-RIE, Primo SSC AD-RIE, Primo iDEA, Primo HD-RIE, Primo TSV, Primo Nanova, Primo Twin-Star, and Primo UD-RIE series for dielectric etching, through-silicon via (TSV) processing, and advanced nodes down to 5nm; MOCVD systems including Prismo D-BLUE, Prismo A7, Prismo HiT3, and Prismo UniMax for GaN LED and power device production where it holds a dominant market position; LPCVD equipment such as Preforma Uniflex CW; and environmental control solutions like VOC purifiers for industrial use. AMEC operates manufacturing facilities in Shanghai, Xiamen, Nanchang, and plans a new CNY3 billion (USD409 million) production base in Chengdu announced in January 2025 for high-end logic and memory chip equipment R&D and manufacturing; it maintains a global network with presence in Taiwan, Japan, Korea, Singapore, North America, and Europe, serving leading chipmakers. Recent developments include strong 2024 financial performance with revenue forecasted at CNY9 billion (up 44.7% year-over-year) driven by high-end plasma etching and thin film deposition sales, R&D spending nearly doubling to CNY2.4 billion (27% of revenue), quadrupled net earnings to CNY9.1 billion, and new product launches in 2025 such as the Ultra ECDP electrochemical de-plating equipment for wide bandgap semiconductors and Ultra Lith KrF front-end coating and developing tool delivered to a major Chinese logic wafer fabricator; the company is pursuing a multi-year strategic expansion to double its high-end semiconductor equipment market share amid robust growth in etch and thin-film deposition segments.