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    Electronic technology

  3. •

    Semiconductors
Semiconductor Manufacturing International Corp.

Semiconductor Manufacturing International Corp.

2.36
THB
-0.18
(-7.09%)
3.23TMarket Cap
Nov 13Next Earn
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
- -
Basic EPS, GAAP
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Free Cash Flow per Basic Share
- -
- -
- -
-0.01
- -
- -
- -
-0.01
- -
- -
-0.01
-0.01
-0.01
- -
Dividend per Share
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Book Value per Share
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.02
0.03
0.03
0.03
0.03
0.03
0.03
Tangible Book Value per Share
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.02
0.03
0.03
0.03
0.03
0.03
0.03
Basic Weighted Avg Shares
270,413
285,223
328,583
356,054
390,386
419,687
425,866
535,839
666,071
666,929
668,705
671,235
673,719
675,903
Sales/Revenue/Turnover
2,069
1,970
2,236
2,914
3,101
3,360
3,116
3,907
5,443
7,273
6,322
8,030
9,327
- -
Operating Margin (%)
5.77
5.92
8.85
12.01
4.24
0.3
-1.07
7.94
20.43
24.6
5.64
5.9
11.16
- -
Depreciation Expense
547
549
524
730
971
1,048
1,128
1,313
1,869
2,271
2,667
3,223
3,810
- -
Net Income, GAAP
173
153
253
377
180
134
235
716
1,702
1,818
903
493
685
- -
Effective Tax Rate (%)
2.31
8.54
3.7
- -
1.44
15.79
12.85
9.26
3.54
0.72
5.26
15.07
7.86
- -
Profit Margin (%)
8.37
7.77
11.33
12.92
5.79
3.99
7.53
18.31
31.27
24.99
14.28
6.14
7.35
- -
Working Capital
625
1,148
823
1,703
2,262
3,290
3,669
11,279
10,764
9,569
6,034
6,024
8,808
8,752
LT Debt
782
1,127
909
2,338
2,872
2,179
2,385
5,018
5,645
7,374
8,960
8,046
9,996
8,868
Total Equity
2,593
3,308
4,190
5,403
6,721
8,924
10,198
21,682
25,438
28,961
30,846
31,870
35,021
37,857
Return on Invested Capital (%)
5.16
2.88
4.23
- -
1.33
0.11
0.32
1.34
4.45
5.21
0.86
0.95
2.24
- -
Return on Capital (%)
5.73
4.75
5.9
- -
2.97
2.04
2.76
3.93
5.76
4.47
2.23
1.2
1.59
- -
Return on Common Equity (%)
7.28
5.63
7.59
9.56
3.83
2.38
3.83
6.68
10.53
10.02
4.6
2.42
3.26
- -

Capital Structure

USD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
2,601
- -
5,151
LT Borrowings
9,995
- -
8,868
LT Finance Leases
1
- -
1
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
674,735
510,365
721,998
Market Capitalization
75,726
39,459
97,347

Working Capital

USD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
15,625
- -
18,769
Cash, Cash Equivalents & STI
10,404
- -
12,791
Accounts Receivable, Net
877
- -
1,044
Inventories
3,630
- -
4,361
Total Current Liabilities
6,817
- -
10,017
Payables & Accruals
- -
- -
- -
ST Debt
2,601
- -
5,151
Deferred Revenue
- -
- -
- -

Growth Rates

USD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
26.39%
10.18%
9.89%
Free Cash Flow
76.13%
58.92%
15.91%
Net Income, GAAP
33.88%
17.59%
39.04%
Sales/Revenue/Turnover
16.62%
20.6%
16.15%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

USD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1,750
1,901
2,171
2,207
8,030
2025
- -
- -
- -
- -
9,327
2026
- -
- -
- -
- -
- -

Quarterly Earnings Per Share

USD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Quarterly Dividends Per Share

USD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Haijun Zhao
Full Time Employees
19,952
Sector
Electronic technology
Industry
Semiconductors
Address
No.18 Zhangjiang Road Shanghai SH China 201203
IPO Date
Mar 17, 2004
Website
smics.com
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Business
Semiconductor Manufacturing International Corporation (SMIC) operates as China's largest pure-play semiconductor foundry, providing integrated circuit manufacturing services at process nodes from 350nm to 7nm, including logic, mixed-signal, RF, high-voltage analog, and specialty technologies for consumer electronics, telecommunications, automotive, IoT, and power management applications; it offers supporting services such as wafer fabrication, photomask manufacturing, packaging, testing, design/IP support, and turnkey solutions across 8-inch and 12-inch fabs. Founded in 2000 and headquartered in Shanghai with incorporation in the Cayman Islands, SMIC maintains wafer fabrication facilities in Shanghai, Beijing, Tianjin, Shenzhen, Chengdu, and Wuhan, alongside backend operations like a joint-venture bumping facility in Jiangyin; it conducts sales and services in the United States, Europe, Japan, Taiwan, and Hong Kong, serving clients including Huawei, Qualcomm, Broadcom, and Texas Instruments. In recent developments, SMIC advances toward 5nm process production expected in late 2024 using DUV lithography, launches volume 14nm FinFET and 7nm capabilities, and pursues acquisition of minority stakes in subsidiary SMIC North Integrated Circuit Manufacturing (Beijing) via A-share issuance from state-backed funds including the National Integrated Circuit Industry Investment Fund to consolidate control over a key 12-inch wafer base projected at RMB12.979 billion revenue and RMB1.682 billion net profit in 2024; it faces ongoing U.S. export restrictions as a designated military end-user since 2020 while expanding capacity amid geopolitical tensions.