SK hynix Inc.
SKHYV
NASDAQ168.01
USD
+19.01
- -
CIK
0002120882
ISIN
US78392B2060
CUSIP
78392B206
Return %
Stock
S&P500
1Y
- -
18.99
3Y
- -
64.75
5Y
- -
71.84
Capital Structure
FRC
•
in mil. unless spec.Working Capital
FRC
•
in mil. unless spec.Growth Rates
FRC
•
in mil. unless spec.Quarterly Revenue
FRC
•
in mil. unless spec.Quarterly Earnings Per Share
FRC
•
in mil. unless spec.Quarterly Dividends Per Share
FRC
•
in mil. unless spec.- CEO
- Kwak Noh-jung
- Full Time Employees
- 47,639
- Sector
- Technology
- Industry
- Semiconductors
- Address
- 2091, Gyeongchung-daero, Bubal-eup Icheon-si GY South Korea 17336
- IPO Date
- Jul 10, 2026
- CIK
- 0002120882
- Website
- skhynix.com
- Similar Companies
- Business
- SK hynix Inc. manufactures and supplies memory and storage solutions, emerging as a leading global semiconductor company focused on Dynamic Random-Access Memory (DRAM), NAND flash memory, and related semiconductor materials, components, and services; the company also provides foundry services, wafer fabrication, and advanced packaging solutions to diversified technology markets. Main products and services - DRAM products: high-performance consumer and enterprise memory modules, up-to-date mobile and server DRAM, server-grade memory subsystems, DDR generations, LPDDR variants for mobile devices, and specialty DRAM designed for graphics and accelerators; includes differentiated product families to support data center, AI, and edge computing workloads - NAND flash memory: 2D and 3D NAND products for consumer electronics, solid-state drives, enterprise storage, and embedded applications; includes TLC, QLC, and enterprise-grade NAND solutions with varying endurance and performance profiles; supports client and data-center storage architectures - Foundry and wafer services: process development, lithography, and fabrication capabilities for memory and specialty semiconductors; services include wafer fabrication, packaging, and test; supports custom device manufacturing and collaboration with device designers - Memory modules and components: memory chips, modules, and subassemblies for client devices, servers, storage systems, and networking equipment; includes modules designed for high reliability and specific performance targets - System solutions and reference designs: development kits, evaluation boards, and reference architectures to accelerate integration of memory into customer products; includes software and firmware support ecosystems - Packaging and test services: advanced packaging solutions, die-level packaging, wafer-level packaging, and final test services to ensure performance, yield, and reliability - Intellectual property and technical support: access to design libraries, interface standards, and technical consulting to optimize memory performance, power, and thermal behavior Latest major company changes - Strategic partnerships and alliances: enters collaborations with major cloud and hyperscale customers to co-develop memory and storage technologies and to optimize data-center memory architectures; partners with system integrators and equipment manufacturers to expand ecosystem for AI accelerators and high-performance computing - Capital moves and corporate actions: engages in continuous capital expenditure to expand fabrication capacity and upgrade production lines; participates in strategic investment activities related to memory technology innovation and supply-chain resilience - Product introductions and platform advances: launches next-generation DRAM and NAND node offerings with improved endurance, performance, and power efficiency; debuts advanced packaging and heterogeneous integration solutions tailored for AI, automotive, and data-center workloads - Strategic expansions: accelerates global manufacturing footprint and regional supply-chain diversification, including expansions in Asia-Pacific and other key markets to bolster capacity and regional service levels - Corporate structure and governance: maintains a corporate reorganization in support of streamlined operations and improved focus on core memory businesses; enhances governance and compliance processes aligned with global standards - Operational enhancements: implements manufacturing efficiency programs, yield improvement initiatives, and supply-chain risk management measures to mitigate disruptions and improve time-to-market Additional context - Industry and segments: semiconductor memory with primary focus on DRAM and NAND; ancillary activities include packaging, test, and system integration services; serves data-center, enterprise, mobile, automotive, consumer electronics, and AI/compute markets - Target markets: cloud providers, hyperscalers, enterprise IT, OEMs, system integrators, and semiconductor customers requiring high-density, high-performance memory solutions - Geographic footprint: global operations with manufacturing and R&D in key regions (notably Asia and the Americas), sales and support networks across multiple continents - Founding year and headquarters: established as a leading memory semiconductor company; headquarters located in Seoul, South Korea - Subsidiaries and parent relationships: operates as an independent public company with global subsidiaries and affiliated entities; maintains strategic relationships with joint-venture and supplier partners to support manufacturing and distribution Note: This profile consolidates publicly disclosed information on SK hynix Inc. and reflects the company’s focus on memory technology leadership, capacity expansion, and customer-aligned innovation in DRAM, NAND, and related semiconductor services.
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