Hygon Information Technology Co., Ltd. Class A
191.02
CNY
-2.28
(-1.18%)
ISIN
CNE100005PT2
Return %
Stock
S&P 500
1Y
-21.00
14.20
3Y
222.56
81.12
5Y
- -
68.34
Capital Structure
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in mil. unless spec.Working Capital
CNY
•
in mil. unless spec.Growth Rates
CNY
•
in mil. unless spec.Quarterly Revenue
CNY
•
in mil. unless spec.Quarterly Earnings Per Share
CNY
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in mil. unless spec.Quarterly Dividends Per Share
CNY
•
in mil. unless spec.Company Description
- CEO
- Chao Qun Sha
- Full Time Employees
- 3,333
- Sector
- Technology services
- Industry
- Information technology services
- Address
- Building 27 Beijing BJ China 100085
- IPO Date
- Aug 12, 2022
- Website
- hygon.cn
- Similar Companies
- Business
- Hygon Information Technology Co., Ltd. engages in the research and development, design, and sales of high-end processors and related computing components for servers and storage devices. Its product portfolio centers on central processing units (CPUs) and drive control units (DCUs) branded under Hygon, with applications spanning telecommunications, finance, Internet services, education, transportation, and large-scale data processing. The company targets domestic and regional markets, leveraging partnerships with original equipment manufacturers and ecosystem collaborators to deliver high-performance computing power, open security features, and integrated product solutions. Founding year and headquarters: established in 2014 and headquartered in Tianjin, China. Headquarters location and regional focus underpin the company’s strategic expansion into domestic high-end processor markets and continued development of AI-ready computing platforms. Main products and services: high-end processors (CPU families across 8000, 7000, 5000, and related 3000 series lines); drive control units (DCUs) for storage and data processing systems; design, R&D, and technical services related to processor architectures, security features, and ecosystem integration; customization and integration services for OEMs, system integrators, and enterprise customers; after-sales support, maintenance, and technical consultation for computing infrastructure deployments. Latest major changes: forms a continuing strategic focus on expanding domestic high-end chip capabilities to meet AI and data-processing demand, broadening OEM partnerships, and advancing product solutions that emphasize security, open interfaces, and power efficiency; ongoing market share expansion in high-end processors through collaborations with upstream and downstream tech firms and ecosystem partners; reported revenue growth momentum in early 2026 driven by AI-related demand and strengthened commercial engagement with enterprise customers and system integrators. Industry and segments: semiconductors and high-end processors; server and data-center compute solutions; related software and security-integration services; hardware and system integration for enterprise, telecommunications, finance, and public sectors. Geographic footprint: primarily operates in the domestic Chinese market, with emphasis on serving national customers and ecosystem partners; potential expansion into regional markets through OEM alliances and strategic collaborations. Subsidiaries and corporate relations: operates as an independent entity within the broader high-end processor ecosystem; maintains partnerships with upstream suppliers and downstream system integrators to deliver end-to-end computing power solutions. Notes on context: Hygon’s product focus is on high-performance CPUs and DCUs designed for servers and storage applications, with ongoing emphasis on AI workloads and secure, open-architecture offerings to address domestic demand for domestically produced high-end processors. The company emphasizes collaboration with OEMs and ecosystem partners to extend market reach and product applicability across key industry verticals.