Shanghai Orient-Chip Technology Co., Ltd. Class A

Shanghai Orient-Chip Technology Co., Ltd. Class A

SSSE:688061
41.00
CNY
+0.10
(+0.24%)
-0.52EPS
5.71BMarket Cap
Oct 29Next Earn
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
1.49
2.57
3.47
6.23
6.5
3.79
4.97
5.52
5.56
Basic EPS, GAAP
-0.08
0.3
0.52
1.45
1.48
0.08
-0.46
-0.52
-0.52
Free Cash Flow per Basic Share
0.06
-0.45
-0.21
0.14
0.09
-1.8
-2.23
-0.88
- -
Dividend per Share
0.01
0.02
0.26
0.02
0.01
0.36
0.03
0.01
0.21
Book Value per Share
1.85
2.54
3.59
5.06
22.39
22.21
21.23
20.42
19.6
Tangible Book Value per Share
1.6
2.31
3.38
4.85
22.19
22.03
18.3
17.56
16.75
Basic Weighted Avg Shares
78
77
83
86
91
120
114
113
113
Sales/Revenue/Turnover
117
199
290
537
593
455
565
624
626
Operating Margin (%)
-2.95
15.67
20.88
27.44
24.91
-10.62
-11.2
-8.39
-6.89
Depreciation Expense
5
5
6
15
22
27
39
42
- -
Net Income, GAAP
-6
23
44
125
135
10
-52
-59
-59
Effective Tax Rate (%)
- -
15.29
16.86
10.98
9.29
- -
- -
- -
- -
Profit Margin (%)
-5.4
11.51
15.07
23.27
22.77
2.11
-9.25
-9.42
-9.37
Working Capital
75
155
171
250
2,398
2,235
1,826
1,653
1,576
LT Debt
- -
30
- -
4
11
5
6
46
90
Total Equity
145
212
310
436
2,572
2,552
2,439
2,346
2,252
Return on Invested Capital (%)
- -
11.11
13.7
29.36
8.87
- -
- -
- -
- -
Return on Capital (%)
- -
11.17
14.17
30.15
8.85
- -
- -
- -
- -
Return on Common Equity (%)
- -
12.8
16.73
33.52
8.98
0.37
-2.1
-2.45
-2.5

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
52
35
43
LT Borrowings
45
72
90
LT Finance Leases
2
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
115
115
115
Market Capitalization
3,747
3,401
5,707

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
1,944
1,890
1,847
Cash, Cash Equivalents & STI
1,459
1,360
1,311
Accounts Receivable, Net
187
198
203
Inventories
164
205
198
Total Current Liabilities
292
270
271
Payables & Accruals
- -
- -
- -
ST Debt
52
35
43
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
104.27%
-3.82%
Free Cash Flow
- -
-603.55%
-60.82%
Net Income, GAAP
- -
-106.33%
12.23%
Sales/Revenue/Turnover
- -
21.43%
10.3%
Total Cash Common Dividend
- -
1,219.18%
-73.34%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
115
155
146
149
565
2025
125
168
- -
150
624
2026
131
176
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-0.04
-0.02
-0.15
-0.26
-0.46
2025
-0.12
-0.12
- -
-0.19
-0.52
2026
-0.18
-0.03
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
0.03
- -
0.03
2025
- -
- -
- -
- -
0.01
2026
- -
0.21
- -
- -
- -

Company Description

CEO
Li Quan Luo
Full Time Employees
502
Sector
Electronic technology
Industry
Semiconductors
Address
Shanghai China
IPO Date
Oct 18, 2022
Business
Shanghai Orient-Chip Technology Co., Ltd. Class A is a China-based fabless integrated circuit design and testing enterprise specializing in high-performance analog and mixed-signal semiconductor devices. Founded in 2005 and headquartered in Shanghai, China, the company engages in the research, development, custom packaging, testing, and distribution of integrated circuits, with core competencies centered on magnetic sensor chips and power management integrated circuits. The company operates across multiple core product and service categories, including magnetic sensor integrated circuits, comprising omnipolar, unipolar, and bipolar Hall effect switch sensors; linear Hall effect sensors; multi-axis magnetic angle sensors; electronic compass and 3D magnetic field sensors; magnetic latch sensors; high-precision Hall current sensors; and integrated magnetic speed and position encoders; power management integrated circuits, comprising light-emitting diode (LED) backlight drivers; LED flash drivers; high-efficiency DC-DC step-up and step-down converters; low-dropout (LDO) linear regulators; charge pump regulators; lithium-ion battery charge and protection management ICs; AC-DC power conversion chips; and USB Type-C and Power Delivery interface controllers; motor driver integrated circuits, comprising single-phase and three-phase brushless direct current (BLDC) motor drivers; voice coil motor (VCM) driver chips; and cooling fan motor driver controllers; as well as semiconductor packaging and testing services, providing wafer probing, high-density System-in-Package (SiP) testing, magnetic field calibration testing, and final quality screening services. The company caters to a diversified customer base across consumer electronics, smart home appliances, automotive electronics, industrial automation, computing peripherals, and telecommunications. Its products are widely deployed in smartphones, tablet computers, notebook PCs, wearable smart devices, automotive cockpit systems, body control modules, electric vehicle powertrain monitoring, brushless power tools, smart energy meters, and robotics. In addition to its primary design and operations base in Shanghai, the company maintains research, engineering, sales, and technical support branches in major Chinese technology hubs including Shenzhen, Wuxi, Beijing, and Chengdu, while serving international clients throughout Asia, Europe, and North America. In recent developments, Shanghai Orient-Chip Technology Co., Ltd. has accelerated its strategic shift toward automotive-grade semiconductors and industrial new energy markets. The company has expanded its portfolio of AEC-Q100-qualified automotive products, rolling out advanced magnetic angle sensor ICs, automotive current sensors, and intelligent three-phase BLDC motor pre-driver chips for electric vehicles and advanced driver-assistance systems (ADAS). The enterprise has also broadened its sensor roadmap into high-precision Tunneling Magnetoresistance (TMR) and Anisotropic Magnetoresistance (AMR) architectures to enhance measurement sensitivity and energy efficiency in complex industrial automation environments. Operationally, the company has expanded its dedicated proprietary chip testing and magnetic calibration facilities, deepened strategic supply chain collaborations with tier-one automotive module suppliers, and executed share repurchase and equity incentive programs to strengthen core research and development capabilities.