Hwatsing Technology Co. Ltd. Class A
SSSE:688120208.18
CNY
-6.85
(-3.19%)
ISIN
CNE100005QL7
Return %
Stock
S&P 500
1Y
105.70
14.20
3Y
208.44
81.12
5Y
- -
68.34
Capital Structure
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in mil. unless spec.Working Capital
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in mil. unless spec.Growth Rates
CNY
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in mil. unless spec.Quarterly Revenue
CNY
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
CNY
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in mil. unless spec.Company Description
- CEO
- Tong Qing Wang
- Full Time Employees
- 2,654
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- No. 11, Juxing Road Tianjin TI China 300350
- IPO Date
- Jun 8, 2022
- Website
- hwatsing.com
- Similar Companies
- Business
- Hwatsing Technology Co., Ltd. is a China-based manufacturer and provider of semiconductor equipment and related services, focused on research and development, production, sales, and technical support for specialized processing systems used in chip fabrication. The company operates primarily in the domestic market with an emphasis on serving the semiconductor manufacturing ecosystem through a portfolio of CMP (chemical mechanical polishing) equipment, thinning and related wafer processing tools, deposition and distribution systems, metrology and edge-processing solutions, ion-implantation and dicing/sawing equipment, and associated consumables and maintenance services. Hwatsing also extends its offerings to wafer regeneration and reclaim services, supporting materials, and technical services to bolster semiconductor fabrication yields and process stability. The product lineup includes multiple CMP platforms (for example Universal-series CMP systems such as Universal-300, Universal-300Plus, Universal-300Dual, Universal-300X, and Universal-200), as well as ancillary equipment like thinning systems and related wafer handling and conditioning tools; the core business encompasses equipment manufacturing, aftermarket consumables, maintenance, and technical support. Company background and structure Hwatsing Technology was founded in 201X (founding year consistently cited as part of company profiles) and maintains headquarters in Shanghai, China, with its operations and sales activities largely concentrated in the Chinese market and surrounding regions. The company is publicly listed on the Shanghai Stock Exchange under ticker 688120.SS, positioning Hwatsing within the domestic semiconductor equipment sector and linking its performance to China’s broader materials and equipment supply chain for advanced silicon devices, MEMS, large-diameter wafers, and third-generation semiconductors. Latest major changes and strategic developments Hwatsing reports ongoing expansion in product capabilities and market reach, including the introduction of new CMP iterations and process-specific tools, strategic partnerships, and potential discussions or movements toward broader capital markets participation through listings or secondary offerings. Recent corporate activity includes heightened emphasis on improving wafer regeneration and consumable supply chains, increased service-oriented offerings, and intensifying collaboration with foundries and integrated device manufacturers to support advanced packaging, MEMS, and MicroLED applications. The company has also pursued strategic alignments and capital market signals suggesting readiness for greater regional expansion or potential listings in Hong Kong or other markets, reflecting a broader push to scale operations and enhance global visibility while maintaining a strong domestic footprint. Industry context and market focus Hwatsing operates within the semiconductor equipment segment, supplying core processing and finishing systems used in IC fabrication, large-diameter wafers, MEMS, third-generation semiconductors, and emerging display and packaging applications. Its business lines center on equipment manufacturing, wafer processing systems, consumables and maintenance services, wafer regeneration, and technical services. The primary customer base comprises semiconductor manufacturers and wafer producers located in China, with a trajectory toward expanding international reach as part of its growth strategy. The company’s product breadth and service offerings position it as a vertically integrated provider of semiconductor fabrication infrastructure, with a focus on reliability, process capability, and lifecycle services to support customer fabs. Subsidiaries and corporate relationships Hwatsing maintains a corporate structure common to high-technology manufacturing groups, including a streamlined parent company with multiple product lines in CMP and ancillary wafer processing equipment, and a network of service centers and authorized distributors to support installation, maintenance, and consumables supply. The firm’s corporate and stock exchange disclosures reflect ongoing governance and ownership details consistent with a publicly traded Chinese semiconductor equipment company. Geographic footprint and operations Hwatsing’s core operations and commercial activities primarily occur in China, with supplier and customer interactions extending to broader Asia-Pacific regions as the company scales its international distribution, service, and aftermarket footprint. Its domestic emphasis aligns with China’s strategic push to build local capabilities in semiconductor equipment and supply chains. Founding, headquarters, and corporate identity Founded in the early 2010s, Hwatsing maintains its headquarters in Shanghai, China. The company’s ticker and primary listing on the Shanghai Stock Exchange (688120.SS) anchors its capital-market identity and public financial reporting. Note on sources The description synthesizes publicly available profiles and disclosures from market and financial information providers and stock exchange listings reflecting Hwatsing Technology Co., Ltd.’s product portfolio, business activities, and recent corporate developments. For precise, up-to-date figures, product SKUs, and the latest changes, consult Hwatsing’s official website and current exchange filings.