Hangzhou SDIC Microelectronics, Inc. Class A

Hangzhou SDIC Microelectronics, Inc. Class A

SSSE:688130
21.65
CNY
+0.54
(+2.56%)
-0.22EPS
3.40BMarket Cap
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
0.61
0.49
2.41
2.01
1.08
1.49
1.18
1.44
1.69
Basic EPS, GAAP
0.07
0.09
1.22
0.9
0.21
-0.24
-0.09
-0.35
-0.22
Free Cash Flow per Basic Share
0.14
0.17
0.68
0.59
0.12
0.38
-0.17
-0.53
- -
Dividend per Share
- -
- -
- -
- -
- -
0.12
- -
- -
- -
Book Value per Share
0.23
0.38
1.63
4
10.82
10.49
10.47
10.25
10.26
Tangible Book Value per Share
0.23
0.37
1.63
3.99
10.8
10.48
8.97
9.02
9.06
Basic Weighted Avg Shares
82
121
82
86
103
85
114
120
118
Sales/Revenue/Turnover
50
60
197
173
111
127
135
174
199
Operating Margin (%)
14.38
22.49
55.68
45.3
19.31
-20.15
-25.03
-37.42
-25.27
Depreciation Expense
- -
- -
- -
3
4
4
7
13
- -
Net Income, GAAP
6
11
100
77
22
-20
-10
-42
-26
Effective Tax Rate (%)
- -
12.58
9.48
8.54
- -
- -
- -
- -
- -
Profit Margin (%)
11.31
18.58
50.71
44.61
19.92
-16.05
-7.62
-24.28
-13.12
Working Capital
17
29
131
357
1,301
1,262
1,074
1,074
1,068
LT Debt
- -
- -
3
2
1
- -
8
4
3
Total Equity
19
31
134
363
1,310
1,271
1,265
1,239
1,240
Return on Invested Capital (%)
- -
39.53
113.86
30.29
- -
- -
- -
- -
- -
Return on Capital (%)
- -
47.96
120.16
30.75
- -
- -
- -
- -
- -
Return on Common Equity (%)
- -
44.96
121.72
31.14
2.64
-1.58
-0.81
-3.37
-2.09

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
13
2
2
LT Borrowings
- -
- -
- -
LT Finance Leases
4
3
3
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
121
121
121
Market Capitalization
2,531
2,464
3,399

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
1,139
1,112
1,111
Cash, Cash Equivalents & STI
792
893
876
Accounts Receivable, Net
29
31
37
Inventories
61
68
74
Total Current Liabilities
65
40
44
Payables & Accruals
- -
- -
- -
ST Debt
13
2
2
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
85.38%
-2.06%
Free Cash Flow
- -
33.61%
238.28%
Net Income, GAAP
- -
-5.07%
310.31%
Sales/Revenue/Turnover
- -
0.23%
28.73%
Total Cash Common Dividend
- -
- -
1,611.79%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
27
33
37
38
135
2025
37
42
- -
50
174
2026
46
61
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-0.02
-0.02
-0.03
-0.03
-0.09
2025
-0.08
-0.11
- -
-0.09
-0.35
2026
-0.04
0.02
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Company Description

CEO
Gui Wu Liang
Full Time Employees
226
Sector
Electronic technology
Industry
Semiconductors
Address
Hangzhou China
IPO Date
Jul 29, 2022
Business
Hangzhou SDIC Microelectronics, Inc. Class A is a fabless semiconductor design company primarily engaged in the research, development, design, and sales of high-performance analog and mixed-signal integrated circuits (ICs) and specialized microcontroller units (MCUs). The company operates across core business segments encompassing Medical Health Measurement ICs, Industrial Control and Smart Sensing ICs, and Intelligent Power and Battery Management ICs. Its product and service portfolio comprises: medical health measurement system-on-chips (SoCs), including high-precision analog-to-digital converter (ADC) chips for infrared thermometers, digital forehead and ear thermometers, electronic blood pressure monitors, body fat scales, continuous glucose monitors, and pulse oximeters; industrial control and instrument interface ICs, including digital multimeter chips, 4-20mA current transmitter ICs, smart sensor signal conditioning SoCs, pressure sensor conditioning chips, and high-precision electronic platform and bench scale ICs; high-reliability 8-bit and 32-bit mixed-signal microcontrollers integrated with high-precision analog front ends, embedded flash memory, and communication interfaces for smart home appliances, IoT devices, and industrial automation; power management and battery management ICs, including multi-cell lithium battery protection chips, low-dropout linear regulators, and precision voltage references; and custom application-specific integrated circuit (ASIC) design services paired with complete embedded firmware and hardware turnkey solutions. The company caters to original equipment manufacturers, original design manufacturers, and electronic device makers across the consumer electronics, healthcare, industrial automation, and smart metering sectors primarily throughout Greater China and broader international markets. Founded in 2005, Hangzhou SDIC Microelectronics, Inc. is headquartered in Hangzhou, Zhejiang Province, China, with operational branches and technical support centers in Shenzhen and Shanghai. In recent developments, the company has expanded its technological roadmap through the rollout of next-generation 32-bit ARM Cortex-based mixed-signal MCUs and advanced sensor conditioning chips targeting high-end industrial instruments and automotive electronics applications. The company has also pursued strategic asset acquisitions and corporate reorganizations within the semiconductor design sector to accelerate horizontal product line integration, deepened long-term supply partnerships with leading domestic medical device and industrial meter manufacturers, and upgraded its internal governance and quality management frameworks to streamline production delivery and enhance research and development execution.