- CEO
- Yi Feng Zhang
- Full Time Employees
- 1,549
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- No. 2, Xinfeng East Second Road Dongguan GD China 523000
- IPO Date
- Nov 11, 2020
- Business
- Guangdong Leadyo IC Testing Co., Ltd. Guangdong Leadyo IC Testing Co., Ltd. (688135.SS) provides integrated circuit testing solutions and semiconductor back-end services in China. The company offers wafer testing for 12-inch and 8-inch wafers, finished chip testing, wafer thinning and cutting, IC ribboning, and supporting services including test program and software development, chip testing and analysis, Load Board production, probe card manufacturing, and MPW engineering batch verification; it supports testing for diverse chip types such as MCU chips, MEMS sensors, AI chips, fingerprint identification and security chips, storage chips including EMMC/SSD/Nand Flash, touch control chips, and automotive-grade chips, utilizing equipment from brands like Advantest V93K/T2K/T53 series, Teradyne J750EX/M2, Chroma 3380 series, and probe stations like Precio XL and UF3000, with capabilities for high-temperature aging, burn-in, and mass production testing across package types including QFN, BGA, SOP, and CSP. Guangdong Leadyo IC Testing Co., Ltd. operates as one of China's largest independent third-party IC testing bases, serving over 200 strategic partners in fields like fingerprint identification, financial IC cards, smart home devices, tablet computers, and Beidou navigation, with monthly wafer testing capacity of approximately 120,000 pieces and finished chip testing capacity up to 300 million units. Founded in February 2010 and headquartered in Dongguan, Guangdong province, the company listed on the Shanghai Stock Exchange's Science and Technology Innovation Board in November 2020 and holds strong intellectual property with over 43 practical patents and 4 software patents. Recent developments include a major investment in July 2023 for new testing equipment to support advanced node ICs, enhancing its capabilities amid China's domestic chip substitution push, alongside a controlling shareholder's plan announced in late 2025 to potentially reduce its stake by up to 3% between November 2025 and February 2026.