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    Industrial machinery
Beijing Huafeng Test & Control Technology Co. Ltd. Class A

Beijing Huafeng Test & Control Technology Co. Ltd. Class A

SSSE:688200
278.00
CNY
-19.16
(-6.45%)
105.32BMarket Cap
Oct 29Next Earn
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
0.82
1.09
1.61
1.75
2.09
4.42
5.37
3.45
4.52
6.72
- -
Basic EPS, GAAP
0.3
0.39
0.67
0.7
1.05
2.21
2.64
1.26
1.67
2.68
- -
Free Cash Flow per Basic Share
0.26
0.05
0.56
0.22
0.59
0.05
1.84
1.48
0.79
1.19
- -
Dividend per Share
0.06
0.11
0.23
0.14
0.19
0.31
0.66
0.64
0.53
0.51
- -
Book Value per Share
1.02
1.3
1.73
2.88
10.76
13.18
15.74
16.64
17.81
20.33
36.54
Tangible Book Value per Share
1.02
1.29
1.72
2.73
10.65
13.06
15.59
16.49
17.68
20.06
36.25
Basic Weighted Avg Shares
136
136
136
146
190
199
199
200
200
200
200
Sales/Revenue/Turnover
112
149
219
255
397
878
1,071
691
905
1,346
- -
Operating Margin (%)
37.2
42.3
45.94
47.83
44.99
55.35
52.24
31.19
36.63
38.29
- -
Depreciation Expense
1
2
2
3
3
8
20
24
29
33
- -
Net Income, GAAP
41
53
91
102
199
439
526
252
334
536
- -
Effective Tax Rate (%)
7.03
12.51
11.98
14.33
16.51
13.66
12.08
5.25
7.56
8.07
- -
Profit Margin (%)
36.81
35.55
41.49
40.06
50.11
49.96
49.16
36.43
36.88
39.82
- -
Working Capital
121
156
191
354
1,953
2,069
2,396
2,532
2,740
3,091
3,901
LT Debt
- -
- -
- -
- -
1
3
3
1
11
17
704
Total Equity
140
177
235
428
2,135
2,621
3,139
3,332
3,570
4,088
7,336
Return on Invested Capital (%)
- -
33.26
44.35
31.38
15.64
18.23
18.04
7.77
9.69
13.98
- -
Return on Capital (%)
- -
34.59
42.64
30.1
15.53
18.43
18.25
7.77
9.66
13.95
- -
Return on Common Equity (%)
- -
33.35
43.99
30.75
15.55
18.45
18.27
7.78
9.67
14.02
- -

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
7
7
7
LT Borrowings
- -
- -
686
LT Finance Leases
17
15
18
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
201
201
201
Market Capitalization
25,778
35,618
105,322

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
3,395
3,329
4,226
Cash, Cash Equivalents & STI
2,185
2,055
2,779
Accounts Receivable, Net
554
528
575
Inventories
300
385
455
Total Current Liabilities
304
257
325
Payables & Accruals
- -
- -
- -
ST Debt
7
7
7
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
14.07%
14.51%
Free Cash Flow
- -
742.53%
51.33%
Net Income, GAAP
- -
36.26%
60.55%
Sales/Revenue/Turnover
- -
37.43%
48.72%
Total Cash Common Dividend
- -
31.6%
-5.03%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
137
242
242
284
905
2025
198
337
- -
407
1,346
2026
272
467
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.11
0.44
0.5
0.6
1.67
2025
0.31
0.67
- -
0.74
2.68
2026
0.47
1.61
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
0.16
0.53
2025
- -
0.51
- -
- -
0.51
2026
- -
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Lin Cai
Full Time Employees
947
Sector
Producer manufacturing
Industry
Industrial machinery
Address
Beijing China
IPO Date
Feb 18, 2020
Website
hftc.com.cn
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Business
Beijing Huafeng Test & Control Technology Co. Ltd. is a China-based semiconductor automatic test equipment (ATE) manufacturer specializing in the research, development, production, and sale of advanced testing systems for analog, mixed-signal, power management, and discrete semiconductor devices. Founded in 1993 and headquartered in Beijing, China, the company operates under the AccoTEST brand and serves integrated device manufacturers (IDMs), outsourced semiconductor assembly and test (OSAT) providers, wafer foundries, and fabless semiconductor design enterprises across Greater China, Southeast Asia, East Asia, Europe, and North America. The company provides a comprehensive portfolio of semiconductor test solutions; including the flagship STS 8200 series test systems designed for analog, linear, power management, and mixed-signal integrated circuits; the high-throughput STS 8300 series platform engineered for high-density, multi-channel mixed-signal and power semiconductor testing; specialized third-generation wide-bandgap test platforms for gallium nitride (GaN) and silicon carbide (SiC) power devices; dynamic test systems for high-voltage automotive electronics and industrial power modules; as well as dedicated test heads, PXI-based testing modules, wafer sort and package test interfacing hardware, proprietary test management software, and lifecycle engineering technical support services. In recent strategic developments, the company has scaled operations at its Tianjin research and manufacturing base, broadened its international sales and customer service network across key Asian and European semiconductor markets, and introduced enhanced high-power and high-pin-count testing solutions to capture accelerating demand in electric vehicle powertrains, renewable energy power management, and complex mixed-signal System-on-Chip (SoC) applications.