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    Electronic technology

  3. •

    Semiconductors
Great Microwave Technology Co. Ltd. Class A

Great Microwave Technology Co. Ltd. Class A

SSSE:688270
46.20
CNY
-2.09
(-4.33%)
23.47BMarket Cap
Oct 27Next Earn
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
0.01
0.19
0.68
0.85
1.12
1.32
1
1.44
- -
Basic EPS, GAAP
-0.16
0.01
0.34
0.44
0.48
0.34
0.06
0.44
- -
Free Cash Flow per Basic Share
-0.07
-0.07
0.01
-0.02
-0.08
-0.18
-0.62
0.19
- -
Dividend per Share
- -
- -
- -
- -
0.14
0.15
0.09
- -
- -
Book Value per Share
0.28
0.34
1.61
2.05
6.95
7.1
7.13
7.52
7.78
Tangible Book Value per Share
0.28
0.34
1.61
2.05
6.94
7.1
7.13
7.52
7.78
Basic Weighted Avg Shares
300
300
225
224
209
213
304
300
301
Sales/Revenue/Turnover
4
55
152
191
234
281
303
432
- -
Operating Margin (%)
-1,228.17
13.59
58.02
55.62
38.58
23.71
10.93
37.57
- -
Depreciation Expense
1
3
4
6
8
16
19
22
- -
Net Income, GAAP
-49
4
77
99
101
73
20
133
- -
Effective Tax Rate (%)
- -
- -
- -
- -
- -
- -
- -
- -
- -
Profit Margin (%)
-1,226.44
7.55
50.57
51.86
43.14
26.02
6.44
30.8
- -
Working Capital
46
48
289
394
1,987
2,003
1,850
1,654
1,738
LT Debt
- -
- -
- -
- -
- -
- -
1
1
1
Total Equity
64
76
362
461
2,082
2,128
2,137
2,254
2,331
Return on Invested Capital (%)
- -
6
35.11
23.1
7.76
3.6
0.93
6.33
- -
Return on Capital (%)
- -
5.99
35.02
24.01
7.94
3.47
0.92
6.06
- -
Return on Common Equity (%)
- -
5.99
35.13
24.04
7.95
3.47
0.92
6.06
- -

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
1
1
1
LT Borrowings
- -
- -
- -
LT Finance Leases
1
1
1
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
300
300
300
Market Capitalization
26,129
31,733
23,470

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
1,819
1,847
1,879
Cash, Cash Equivalents & STI
1,121
1,108
1,165
Accounts Receivable, Net
442
502
541
Inventories
113
88
91
Total Current Liabilities
165
150
141
Payables & Accruals
- -
- -
- -
ST Debt
1
1
1
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
77.5%
5.48%
Free Cash Flow
- -
84.39%
-130.66%
Net Income, GAAP
- -
102.1%
580.76%
Sales/Revenue/Turnover
- -
23.68%
42.3%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
54
64
64
121
303
2025
73
132
- -
129
432
2026
121
98
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-0.04
0.04
0.03
0.01
0.06
2025
0.07
0.14
- -
0.1
0.44
2026
0.13
0.12
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
0.09
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Bing Zhang
Full Time Employees
270
Sector
Electronic technology
Industry
Semiconductors
Address
Building 7 and Building 8 Hangzhou ZH China 310030
IPO Date
Jan 27, 2022
Website
greatmicrowave.com
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Business
Great Microwave Technology Co., Ltd. (688270.SS) researches, develops, produces and sells integrated circuit chips and microsystems principally in China. The company offers terminal radio frequency (RF) front-end chips including power amplifiers, low noise amplifiers and RF switches; RF transceiver chips; high-speed and high-precision analog-to-digital converter/digital-to-analog converter (ADC/DAC) products; power management chips; as well as microsystems and modules such as phased array T/R components using multi-chip module and ball grid array packaging technologies. These products serve military applications in wireless communication terminals, communication radar systems and electronic power supply/distribution, alongside expanding civilian uses in mobile communication systems and satellite Internet; the company also provides related technical services. Founded in 2015 and headquartered in Hangzhou, Zhejiang Province, Great Microwave Technology operates four domestic platforms for terminal RF front-end chip design, phased array T/R components and microsystem design, high-density integrated packaging, and electrical performance testing/reliability. In recent developments, the company completed an equity buyback program announced in December 2024 by repurchasing 393,991 shares, or 0.18% of its capital, for CNY 20 million as of October 2025, reflecting confidence in its growth prospects amid projected 15% year-over-year revenue expansion driven by microwave technology demand.