Hefei Chipmore Technology Co., Ltd. Class A
SSSE:68835213.42
CNY
+0.01
(+0.07%)
ISIN
CNE1000060H9
Return %
Stock
S&P 500
1Y
2.52
14.20
3Y
16.59
81.12
5Y
- -
68.34
Capital Structure
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in mil. unless spec.Working Capital
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in mil. unless spec.Growth Rates
CNY
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in mil. unless spec.Quarterly Revenue
CNY
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in mil. unless spec.Quarterly Earnings Per Share
CNY
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in mil. unless spec.Quarterly Dividends Per Share
CNY
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in mil. unless spec.Company Description
- CEO
- Zong Ming Yang
- Full Time Employees
- 2,416
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- Hefei China
- IPO Date
- Apr 20, 2023
- Website
- chipmore.com.cn
- Similar Companies
- Business
- Hefei Chipmore Technology Co., Ltd. Class A (SSE: 688352) is a China-based outsourced semiconductor assembly and test provider engaged in the design, development, packaging, and testing of advanced integrated circuits. Founded in 2018 and headquartered in Hefei, Anhui Province, China, the company operates dual production and engineering facilities located in Hefei and Suzhou through its core operating subsidiary, Chipmore Technology (Suzhou) Co., Ltd. The company delivers end-to-end advanced packaging and testing turnkey solutions across two primary operational segments: Display Driver Integrated Circuits and Non-Display Integrated Circuits. Its core product and service portfolio comprises 8-inch and 12-inch wafer bumping services, including gold bumping, copper-nickel-gold bumping, copper pillar bumping, and tin-silver solder bumping; wafer testing and circuit probing services for analyzing electrical parameters and functional yields; wafer thinning and post-processing services, including ultra-thin back-grinding, backside metallization, laser grooving, and high-precision wafer dicing; advanced flip-chip packaging services, consisting of Chip-on-Glass, Chip-on-Film, Chip-on-Plastic, and substrate-based Flip-Chip packaging for high-density interconnects; and final testing solutions encompassing module-level electrical characterization, automated optical inspection, and tape-and-reel taping. The company specializes in packaging and testing display driver integrated circuits for active-matrix organic light-emitting diode, standard organic light-emitting diode, and thin-film transistor liquid-crystal display panels, alongside non-display integrated circuits, including power management chips, radio frequency front-end chips, capacitive and optical fingerprint identification chips, discrete power devices, and micro-electromechanical systems. These offerings target fabless semiconductor design companies and integrated device manufacturers serving consumer electronics, smartphones, ultra-high-definition televisions, wearable electronics, smart automotive displays, industrial controls, and high-performance computing systems across domestic and international markets. In recent operational and strategic developments, Hefei Chipmore Technology has accelerated its transition into a comprehensive advanced packaging and testing solutions provider under its diversified product expansion framework. The company completed construction and commercialization of its 12-inch advanced packaging and testing manufacturing base in Hefei, scaling production capacity for next-generation display driver chips. In mid-2025, the company achieved commercial mass production of its proprietary flip-chip packaging and testing process, expanding its presence in high-growth non-display application areas. To advance its technological capabilities in advanced heterogeneous packaging, the company executed a strategic capital increase in Yicheng Technology in mid-2026 to collaborate on 2.5D interposer packaging and high-density fan-out architectures. In addition, the company completed a major technical modernization project for high-density micro-pitch bumping, reducing interconnect pitch capability to six micrometers, while achieving full operational restoration and capacity utilization across its Suzhou manufacturing lines.