- CEO
- Wen Sheng Pian
- Full Time Employees
- 2,673
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- Shanghai China
- IPO Date
- Oct 26, 2022
- Business
- Shanghai V-Test Semiconductor Tech Co., Ltd. is an independent, third-party integrated circuit testing service provider that delivers comprehensive test engineering and mass-production testing solutions across the semiconductor value chain. Founded in 2016 and headquartered in Shanghai, China, the company serves fabless chip design enterprises, integrated device manufacturers, wafer foundries, and packaging and testing houses across computing, automotive electronics, industrial control, telecommunications, and consumer electronics markets.
The company's core offerings and services comprise wafer testing (wafer probing) across 6-inch, 8-inch, and 12-inch wafer formats; finished chip testing (final testing) for packaged integrated circuits; system-level testing; burn-in and high-temperature reliability aging testing; testing program development and hardware interface design; automated optical inspection and lead scanning; chip laser marking and tape-and-reel services; semiconductor test equipment leasing; and the provision of specialized test consumables. Its testing engineering capabilities accommodate advanced fabrication processes down to 7nm and 14nm as well as mature nodes above 28nm, supporting complex chip architectures including central processing units, graphics processing units, artificial intelligence accelerators, microcontrollers, field-programmable gate arrays, system-on-chip devices, radio frequency circuits, memory modules, power management integrated circuits, and analog sensors, with specialized platforms for chiplet architectures and automotive-grade standards.
In recent corporate developments, Shanghai V-Test Semiconductor Tech Co., Ltd. has undertaken significant capital and capacity expansion initiatives to accelerate growth in high-performance computing, artificial intelligence, and automotive semiconductor testing. The company initiated the issuance of convertible corporate bonds to raise up to approximately 1.2 billion yuan to finance high-end integrated circuit testing base construction projects, optimize debt structure, and supplement operational working capital. Furthermore, the company expanded its domestic footprint by establishing a new subsidiary, Chengdu Weice Semiconductor Technology Co., Ltd., backed by a multi-phase investment plan of up to 1 billion yuan to construct an advanced semiconductor testing facility in southwestern China, while continuing capacity ramp-ups and development plans across its production and engineering bases in Shanghai, Wuxi, Nanjing, Shenzhen, and Tianjin.