Shenzhen China Micro Semicon Co., Ltd. Class A

Shenzhen China Micro Semicon Co., Ltd. Class A

SSSE:688380
32.43
CNY
-0.87
(-2.61%)
0.89EPS
73.72P/E
26.39BMarket Cap
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
2.63
4.41
1.13
3.29
1.82
1.63
2.27
2.8
3.45
Basic EPS, GAAP
0.49
0.45
0.28
2.33
0.17
-0.05
0.34
0.71
0.89
Free Cash Flow per Basic Share
0.29
-0.01
-0.05
1.07
-1.04
-0.03
0.7
0.34
- -
Dividend per Share
0.02
0.4
0.02
0.03
- -
0.41
0.25
0.25
0.31
Book Value per Share
1.55
2.5
1.59
3.89
7.96
7.42
7.48
7.94
8.06
Tangible Book Value per Share
1.55
2.04
1.49
3.79
7.88
7.35
7.41
7.87
7.99
Basic Weighted Avg Shares
67
56
335
337
349
439
402
400
398
Sales/Revenue/Turnover
175
245
378
1,109
637
714
912
1,122
1,372
Operating Margin (%)
18.2
10.84
25.73
54.83
15.66
-4.79
13.05
18.23
21.65
Depreciation Expense
2
3
3
9
17
19
22
20
- -
Net Income, GAAP
32
25
94
785
59
-22
137
284
356
Effective Tax Rate (%)
9.88
9.64
8.86
10.42
- -
- -
0.58
6.83
7.04
Profit Margin (%)
18.48
10.21
24.81
70.79
9.32
-3.08
15.01
25.32
25.91
Working Capital
70
80
420
1,141
2,982
2,748
2,786
2,902
2,753
LT Debt
2
2
6
7
12
8
5
1
3
Total Equity
104
167
536
1,311
3,188
2,972
2,993
3,177
3,228
Return on Invested Capital (%)
- -
16.28
25.64
83.31
- -
- -
4.5
8.89
10.95
Return on Capital (%)
- -
17.18
25.95
83.74
- -
- -
4.51
8.82
10.88
Return on Common Equity (%)
- -
18.54
26.66
85.01
2.64
-0.71
4.59
9.21
11.37

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
203
3
202
LT Borrowings
- -
- -
- -
LT Finance Leases
1
3
3
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
400
400
400
Market Capitalization
12,872
16,355
26,388

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
3,377
3,196
3,286
Cash, Cash Equivalents & STI
1,418
1,455
1,534
Accounts Receivable, Net
224
198
229
Inventories
342
328
334
Total Current Liabilities
475
258
533
Payables & Accruals
- -
- -
- -
ST Debt
203
3
202
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
57.55%
6.15%
Free Cash Flow
- -
-1,013.07%
-51.31%
Net Income, GAAP
- -
-21.45%
107.68%
Sales/Revenue/Turnover
- -
42.8%
23.09%
Total Cash Common Dividend
- -
224,580.71%
0.73%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
205
223
221
262
912
2025
206
297
- -
349
1,122
2026
325
401
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.07
0.04
0.17
0.06
0.34
2025
0.09
0.13
- -
0.33
0.71
2026
0.13
0.3
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
0.01
- -
0.25
2025
- -
- -
- -
0.01
0.25
2026
- -
0.3
- -
- -
- -

Company Description

CEO
Yong Yang
Full Time Employees
459
Sector
Electronic technology
Industry
Semiconductors
Address
Shenzhen China
IPO Date
Aug 5, 2022
Website
mcu.com.cn
Business
Shenzhen China Micro Semicon Co., Ltd. is a semiconductor design enterprise engaged in the research, development, design, and distribution of integrated circuits, with a core focus on microcontrollers, mixed-signal system-on-chip devices, and analog semiconductors. Founded in 2001 and headquartered in Shenzhen, China, the company operates across key integrated circuit segments, delivering chip-level hardware, embedded software, and algorithm solutions for intelligent control systems across consumer electronics, smart home appliances, industrial automation, brushless DC motor drives, automotive electronics, healthcare devices, and Internet of Things applications. The company maintains research, design, and sales operations across key semiconductor hubs in China, serving equipment manufacturers, original design manufacturers, and commercial distributors throughout domestic and international markets. The company's core product and service portfolio comprises Microcontroller Units, including 8-bit and 32-bit Arm Cortex-M and RISC-V microcontrollers, low-power general-purpose MCUs, high-noise-immunity touch-sensing MCUs, and specialized motor control processing chips; System-on-Chip and Application-Specific Integrated Circuits, including integrated BLDC motor control SoCs, lithium battery management chips, multi-electrode impedance measurement ICs, and automotive actuator SoCs; Analog and Mixed-Signal Integrated Circuits, including operational amplifiers, comparators, high-precision analog-to-digital converters, sensor signal conditioning chips, and touch-key controller ICs; Power Devices and Driver Solutions, including gate driver ICs, motor drivers, LED and display driver ICs, and discrete power MOSFETs; Non-Volatile Memory Products, including low-power serial peripheral interface NOR Flash memory chips; and Comprehensive Development Solutions, including embedded Field-Oriented Control algorithms, motor drive firmware, integrated development environments, compiler toolchains, in-circuit emulators, and turnkey system reference designs. In recent developments, Shenzhen China Micro Semicon Co., Ltd. has advanced its MCU+ strategic expansion by entering the memory market with the launch of its low-power SPI NOR Flash series and accelerating product deployment in high-reliability industrial and automotive applications. The company has broadened its automotive-grade semiconductor offerings, introducing dedicated automotive actuator SoCs, expanding AEC-Q100 qualified chipsets, and achieving ISO 26262 automotive functional safety management certification. In addition, the company has rolled out high-performance industrial-grade microcontrollers, advanced brushless DC motor control chip series, and high-density touch-sensing controller ICs, while strengthening strategic supply partnerships across home appliance and automotive supply chains.