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    Electronic technology

  3. •

    Semiconductors
Union Semiconductor (Hefei) Co., Ltd. Class A

Union Semiconductor (Hefei) Co., Ltd. Class A

SSSE:688403
16.48
CNY
-0.41
(-2.43%)
0.09EPS
425.52P/E
39.34BMarket Cap
Oct 31Next Earn
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
0.43
0.47
0.74
1.19
1.27
1.45
1.79
2.19
1.99
Basic EPS, GAAP
-0.16
-0.2
- -
0.21
0.24
0.23
0.19
0.19
0.09
Free Cash Flow per Basic Share
-0.57
-0.47
-0.2
-0.15
0.03
-0.98
-0.1
0.29
- -
Dividend per Share
0.02
0.04
0.04
0.03
0.02
- -
0.11
0.1
0.05
Book Value per Share
0.34
0.3
1.71
2.09
3.48
3.75
3.82
4.08
4.55
Tangible Book Value per Share
0.31
0.27
1.68
2.06
3.46
3.72
3.76
4.03
4.49
Basic Weighted Avg Shares
668
835
835
668
738
852
841
814
975
Sales/Revenue/Turnover
286
394
619
796
940
1,238
1,501
1,783
1,938
Operating Margin (%)
-23.25
-22.62
8.58
18.33
17.01
15.44
11.35
11.25
7.68
Depreciation Expense
70
100
141
171
216
282
369
419
- -
Net Income, GAAP
-107
-164
-4
140
177
196
160
155
91
Effective Tax Rate (%)
- -
- -
- -
- -
- -
- -
- -
2.69
- -
Profit Margin (%)
-37.5
-41.61
-0.65
17.63
18.86
15.83
10.64
8.68
4.69
Working Capital
-484
-771
138
-24
1,015
288
1,448
1,296
1,346
LT Debt
233
207
235
54
2
1
1,115
932
205
Total Equity
224
199
1,142
1,394
2,904
3,132
3,201
3,549
4,506
Return on Invested Capital (%)
- -
- -
- -
8.06
- -
- -
- -
3.51
- -
Return on Capital (%)
- -
- -
- -
8.29
- -
- -
- -
4.3
- -
Return on Common Equity (%)
- -
-77.52
-0.6
11.07
8.25
6.49
5.05
4.58
2.35

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
86
174
270
LT Borrowings
931
462
204
LT Finance Leases
1
1
1
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
869
931
991
Market Capitalization
14,233
13,296
39,340

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
1,593
1,696
1,876
Cash, Cash Equivalents & STI
675
658
788
Accounts Receivable, Net
359
339
439
Inventories
304
383
343
Total Current Liabilities
297
464
530
Payables & Accruals
- -
- -
- -
ST Debt
86
174
270
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
30.25%
10.87%
Free Cash Flow
- -
-1,049.29%
-381.4%
Net Income, GAAP
- -
-717.66%
-3.15%
Sales/Revenue/Turnover
- -
23.69%
18.79%
Total Cash Common Dividend
- -
2,415.48%
-9.12%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
315
358
396
431
1,501
2025
375
492
- -
488
1,783
2026
411
548
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.03
0.04
0.05
0.07
0.19
2025
0.05
0.07
- -
0.04
0.19
2026
-0.01
0.02
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
0.1
- -
- -
0.11
2025
- -
- -
- -
- -
0.1
2026
- -
0.05
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Rui Jun Zheng
Full Time Employees
1,588
Sector
Electronic technology
Industry
Semiconductors
Address
Hefei China
IPO Date
Aug 18, 2022
Website
unionsemicon.com.cn
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Business
Union Semiconductor (Hefei) Co., Ltd. is an integrated circuit packaging and testing service provider primarily engaged in outsourced semiconductor assembly and test solutions for advanced display driver integrated circuits. Founded in 2015 and headquartered in Hefei, Anhui Province, China, the company operates high-volume manufacturing facilities serving semiconductor design houses and display panel manufacturers across domestic and international markets. Its core product and service portfolio comprises front-end wafer bumping services, including 8-inch and 12-inch gold bumping, copper pillar bumping, and redistribution layer processing; wafer-level testing and circuit probing services for defect screening and electrical characterization; back-end advanced packaging solutions, including Chip-on-Glass, Chip-on-Film, and Chip-on-Plastic flip-chip assembly; and final testing, wafer grinding, dicing, and tape-and-reel packaging services. The company's packaging and testing technologies support display driver chips and related microelectronics deployed in AMOLED, OLED, and TFT-LCD displays for smartphones, ultra-high-definition televisions, laptops, tablets, automotive infotainment systems, and wearable smart devices. In recent developments, the company executed a convertible corporate bond offering to finance large-scale capacity expansion projects for 12-inch advanced-process display driver chips, focusing on expanding its 12-inch OLED gold bumping, wafer probing, and high-density Chip-on-Film packaging lines; deepened its strategic presence in the automotive electronics sector by expanding automotive-grade display driver testing capabilities; and completed a joint capital investment in affiliated semiconductor entity Hefei Xinfeng Technology Co., Ltd. to enhance supply chain integration.