Maxio Technology (Hangzhou) Co., Ltd. Class A
SSSE:68844946.00
CNY
-1.78
(-3.73%)
ISIN
CNE100006ZQ5
Return %
Stock
S&P 500
1Y
-15.33
14.20
3Y
- -
81.12
5Y
- -
68.34
Capital Structure
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in mil. unless spec.Working Capital
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•
in mil. unless spec.Growth Rates
CNY
•
in mil. unless spec.Quarterly Revenue
CNY
•
in mil. unless spec.Quarterly Earnings Per Share
CNY
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in mil. unless spec.Quarterly Dividends Per Share
CNY
•
in mil. unless spec.Company Description
- CEO
- Guo Yang Li
- Full Time Employees
- 787
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- Hangzhou China
- IPO Date
- Nov 29, 2024
- Website
- maxio-tech.com
- Similar Companies
- Business
- Maxio Technology (Hangzhou) Co., Ltd. is a platform-based fabless semiconductor design enterprise that specializes in the research, development, and commercialization of data storage controller chips and AIoT signal processing and transmission chips. Founded in 2014 and headquartered in Hangzhou, Zhejiang Province, China, the company operates in the integrated circuit and semiconductor industry, providing integrated hardware, firmware, and turn-key controller solutions for consumer, industrial, automotive, and enterprise applications. The company operates across two core business segments: Data Storage Controller Chips and AIoT Signal Processing and Transmission Chips. Its product and service portfolio includes solid-state drive (SSD) controller chips supporting SATA, PCIe 3.0, PCIe 4.0, and PCIe 5.0 protocols, including the MAP1202, MAP1602, MAP1802, and MAP1808 series; embedded storage controller chips supporting eMMC and Universal Flash Storage (UFS 2.2, UFS 3.1, and UFS 4.1/5.0) architectures for mobile devices, smart terminals, and automotive electronics; AIoT perception signal processing chips for smart vision, sensing, and audio management; wired communication and network interface transmission chips; proprietary NAND flash management firmware and Agile ECC low-density parity-check (LDPC) error-correction algorithms; and complete software development kits (SDKs), reference designs, and technical validation services. The company primarily serves storage module manufacturers, personal computer and server original equipment manufacturers (OEMs), consumer electronics brands, and smart IoT device makers across domestic and international markets, with key client and partner relationships spanning Longsys, BIWIN Storage, Lexar, ADATA Technology, Apacer Technology, Innodisk, Netac, and Hikvision Storage. Maxio Technology maintains research, development, sales, and technical support branches in Shenzhen, Shanghai, Guangzhou, Suzhou, and Chengdu, and benefits from strategic shareholding and commercial alignment with Hangzhou Hikvision Digital Technology Co., Ltd. Recent major corporate developments include the completion of the company's initial public offering (IPO) and listing of its Class A ordinary shares on the Shanghai Stock Exchange Science and Technology Innovation Board (STAR Market) under ticker symbol 688449 in November 2024; the commercial deployment of its PCIe 5.0 DRAM-less SSD controllers (MAP1802 and MAP1806 series) and AI-workload optimized MAP1808 controller featuring built-in AI acceleration engines for AI PCs and edge computing terminals; the mass production and commercial smartphone adoption of its proprietary UFS 3.1 embedded storage controller platform alongside ongoing development of UFS 4.1 and UFS 5.0 solutions; the initiation of architectural R&D for next-generation PCIe Gen 6 SSD controller platforms; and the expansion of strategic ecosystem alliances with NAND flash memory producers and module manufacturers to advance high-performance enterprise and industrial storage implementations.