Lontium Semiconductor Corporation Class A

Lontium Semiconductor Corporation Class A

SSSE:688486
42.73
CNY
-0.72
(-1.66%)
11.88BMarket Cap
Oct 29Next Earn
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
0.93
0.96
0.78
0.97
1.68
1.72
1.82
2.51
3.07
- -
Basic EPS, GAAP
0.13
0.3
0.25
0.25
0.6
0.49
0.58
0.78
0.93
- -
Free Cash Flow per Basic Share
0.24
0.04
0.3
0.31
-0.01
0.18
0.39
0.48
0.15
- -
Dividend per Share
- -
0.07
- -
- -
0.09
0.21
0.12
0.52
0.38
- -
Book Value per Share
1.52
0.98
1.9
2.31
1.97
2.26
7.66
7.69
8.35
8.14
Tangible Book Value per Share
1.52
0.98
1.9
2.31
1.94
2.24
7.62
7.62
7.99
7.8
Basic Weighted Avg Shares
83
84
133
140
140
140
178
185
185
185
Sales/Revenue/Turnover
77
81
105
136
235
241
323
466
568
- -
Operating Margin (%)
18.48
32.61
32.12
21.22
36.12
30.11
22.66
27.63
27.8
- -
Depreciation Expense
3
4
5
6
12
15
19
21
28
- -
Net Income, GAAP
10
25
33
35
84
69
103
144
172
- -
Effective Tax Rate (%)
17.23
8.25
7.44
4.96
4.4
1.68
2.4
5.58
1.58
- -
Profit Margin (%)
13.58
31.25
31.74
25.98
35.8
28.72
31.78
30.99
30.26
- -
Working Capital
61
69
154
186
188
229
1,327
1,321
1,389
1,277
LT Debt
- -
- -
- -
1
- -
1
1
- -
- -
- -
Total Equity
64
83
166
202
275
316
1,429
1,432
1,559
1,521
Return on Invested Capital (%)
- -
32.33
24.59
14.17
33.7
22.66
11.44
9.78
11.48
- -
Return on Capital (%)
- -
34.4
26.71
19.15
34.97
23.14
11.74
10.09
11.49
- -
Return on Common Equity (%)
- -
34.4
26.7
19.22
35.23
23.4
11.77
10.09
11.49
- -

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
- -
- -
- -
LT Borrowings
- -
- -
- -
LT Finance Leases
- -
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
187
187
187
Market Capitalization
9,908
7,680
11,881

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
1,477
1,464
1,376
Cash, Cash Equivalents & STI
1,221
1,214
1,089
Accounts Receivable, Net
76
53
61
Inventories
161
173
197
Total Current Liabilities
88
57
99
Payables & Accruals
- -
- -
- -
ST Debt
- -
- -
- -
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
82.49%
8.92%
Free Cash Flow
- -
-378.5%
-68.57%
Net Income, GAAP
- -
45.66%
19.05%
Sales/Revenue/Turnover
- -
35.1%
21.93%
Total Cash Common Dividend
- -
- -
-26.41%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
104
117
112
132
466
2025
109
138
- -
179
568
2026
128
170
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.21
0.17
0.17
0.27
0.78
2025
0.16
0.23
- -
0.26
0.93
2026
0.21
0.24
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
0.52
2025
- -
- -
- -
- -
0.38
2026
- -
- -
- -
- -
- -

Company Description

CEO
Feng Chen
Full Time Employees
256
Sector
Electronic technology
Industry
Semiconductors
Address
Hefei China
IPO Date
Feb 21, 2023
Business
Lontium Semiconductor Corporation is a fabless semiconductor design company that specializes in the development, design, and marketing of high-performance, high-speed mixed-signal integrated circuits and intellectual property solutions. Founded in 2006 and headquartered in Hefei, China, the company operates research and development centers, sales branches, and technical support offices across Hefei, Shenzhen, Shanghai, Hong Kong, and Oregon, United States. Lontium provides critical signal connectivity and processing components to global original equipment manufacturers and system integrators across consumer electronics, automotive electronics, commercial display, augmented and virtual reality, industrial computing, and telecommunications. The company's core product portfolio includes video bridge integrated circuits, comprising high-definition multimedia interface, DisplayPort, embedded DisplayPort, mobile industry processor interface, low-voltage differential signaling, and USB Type-C protocol converters supporting up to 4K and 8K ultra-high-definition video resolutions; high-speed interface and transmission chips, comprising USB 2.0, USB 3.1, and PCIe signal repeaters, re-drivers, matrix switches, hubs, and splitters; video processing and display driver integrated circuits, comprising embedded graphics processing units, image scalers, and micro-display controllers for wearable extended reality devices; and proprietary high-speed mixed-signal semiconductor intellectual property blocks built upon its ClearEdge signal integrity architecture. In recent strategic developments, Lontium has significantly expanded its operational footprint in the automotive semiconductor market through the establishment of a dedicated Automotive Chip and System Solutions Business Unit to drive adoption in smart cockpits, heads-up displays, and advanced driver-assistance systems. The company has secured AEC-Q100 automotive grade and ISO 26262 functional safety certifications across more than twenty integrated circuits, commercially deployed proprietary automotive SerDes high-speed serializer-deserializer chipsets, deepened reference design partnerships with global computing and system-on-chip providers, and expanded global channel operations through its international subsidiaries.