Smarter Microelectronics (Guangzhou) Co., Ltd. Class A

Smarter Microelectronics (Guangzhou) Co., Ltd. Class A

SSSE:688512
12.32
CNY
-0.88
(-6.67%)
-0.67EPS
7.46BMarket Cap
Oct 30Next Earn
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
0.13
0.46
1.32
0.9
1.28
1.15
1.73
1.97
Basic EPS, GAAP
-0.17
-0.21
-0.82
-0.77
-0.95
-0.96
-0.49
-0.67
Free Cash Flow per Basic Share
-0.07
-0.25
-1.17
-1.31
-0.61
-0.8
-0.82
- -
Dividend per Share
- -
0.05
- -
- -
- -
- -
0.02
0.02
Book Value per Share
0.45
0.24
3.92
3.58
4.77
3.92
3.51
3.28
Tangible Book Value per Share
0.45
0.24
3.92
3.22
4.47
3.64
3.24
3.01
Basic Weighted Avg Shares
453
453
388
396
430
457
467
469
Sales/Revenue/Turnover
60
207
514
357
552
524
807
926
Operating Margin (%)
-112.7
-48.78
100
-95.59
-67.41
-66.96
-25.24
-26.81
Depreciation Expense
1
2
2
26
28
33
34
- -
Net Income, GAAP
-79
-96
-318
-305
-409
-438
-229
-312
Effective Tax Rate (%)
- -
- -
- -
- -
- -
- -
- -
- -
Profit Margin (%)
-130.53
-46.4
-61.9
-85.49
-74
-83.67
-28.37
-33.73
Working Capital
238
141
1,503
1,214
1,422
1,234
1,412
1,327
LT Debt
- -
10
8
3
34
79
109
113
Total Equity
178
96
1,561
1,426
2,172
1,806
1,641
1,531
Return on Invested Capital (%)
- -
- -
- -
- -
- -
- -
- -
- -
Return on Capital (%)
- -
- -
- -
- -
- -
- -
- -
- -
Return on Common Equity (%)
- -
-70.17
-38.41
-20.42
-22.71
-22.04
-13.29
-18.6

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
46
120
314
LT Borrowings
87
95
95
LT Finance Leases
22
20
18
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
467
467
467
Market Capitalization
5,210
5,299
7,455

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
1,593
1,659
1,868
Cash, Cash Equivalents & STI
821
830
835
Accounts Receivable, Net
145
136
149
Inventories
476
540
660
Total Current Liabilities
180
286
541
Payables & Accruals
- -
- -
- -
ST Debt
46
120
314
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
309.06%
-9.18%
Free Cash Flow
- -
62.82%
4.97%
Net Income, GAAP
- -
44.02%
-47.76%
Sales/Revenue/Turnover
- -
44.22%
54.06%
Total Cash Common Dividend
- -
- -
429.82%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
105
149
130
140
524
2025
137
218
- -
239
807
2026
215
254
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-0.18
-0.22
-0.25
-0.3
-0.96
2025
0.01
-0.15
- -
-0.23
-0.49
2026
-0.14
-0.15
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
0.01
0.02
2026
- -
- -
- -
- -
- -

Company Description

CEO
Yang Li
Full Time Employees
244
Sector
Electronic technology
Industry
Semiconductors
Address
Guangzhou China
IPO Date
May 16, 2023
Business
Smarter Microelectronics (Guangzhou) Co., Ltd. is a fabless semiconductor design company that specializes in the research, development, and sale of radio frequency (RF) front-end integrated circuits and system-in-package modules for mobile devices and wireless communications. Founded in 2011 and headquartered in Guangzhou, China, the company operates research, development, and technical support facilities across Guangzhou, Shanghai, Shenzhen, Beijing, and Xi'an, serving global smartphone original equipment manufacturers, original design manufacturers, and Internet of Things device makers. Smarter Microelectronics develops and commercializes reconfigurable RF front-end architectures utilizing its proprietary AgiPAM technology platform, which integrates Silicon-on-Insulator and Gallium Arsenide material systems to dynamically optimize multi-band and multi-mode cellular transmission. The company's core product portfolio comprises 5G Ultra-High Band and Sub-3GHz RF front-end power amplifier modules with integrated duplexers and filters (L-PAMiD); 5G power amplifier modules with integrated filters (L-PAMiF); 4G and 5G multi-mode multi-band power amplifier modules (MMMB PAM); low-power RF transmission modules (TxM); standalone and integrated Low-Noise Amplifiers (LNAs); RF switches and antenna tuners; and Integrated Passive Device (IPD) filters. These products are incorporated into 5G and 4G smartphones, cellular IoT modules, connected automotive hardware, and wearable devices. In recent developments, Smarter Microelectronics completed its initial public offering on the Shanghai Stock Exchange Science and Technology Innovation Board (STAR Market) under ticker 688512. The company has advanced the volume commercialization of its next-generation Phase 8L 5G L-PAMiD modules, securing design wins across flagship and mid-to-high-tier smartphone lineups of major brands including Samsung, vivo, and Honor, as well as tier-one original design manufacturers such as Huaqin Technology and Wingtech Technology. To advance its technology roadmap, the company executed targeted equity financing in 2026 to fund research and development into 5G-Advanced (5G-A) RF front-end architectures, satellite communication modules, and specialized automotive-grade connectivity chipsets, while expanding operating capabilities through key regional subsidiaries such as Shanghai Shangrui.