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    Electronic technology

  3. •

    Computer peripherals
Biwin Storage Technology Co., Ltd. Class A

Biwin Storage Technology Co., Ltd. Class A

SSSE:688525
159.50
CNY
-4.92
(-2.99%)
16.61EPS
28.98P/E
233.30BMarket Cap
Oct 29Next Earn
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
12.71
10.69
10.79
7.16
7.55
8.34
15.36
24.78
48.63
Basic EPS, GAAP
-1.36
0.17
0.18
0.32
0.18
-1.45
0.37
1.87
17.07
Free Cash Flow per Basic Share
-0.2
-1.99
-2.83
-2.17
-2.42
-5.53
-1
-7.64
- -
Dividend per Share
0.05
0.07
0.06
0.04
0.08
0.26
0.33
0.4
0.75
Book Value per Share
2.23
5.01
6.61
4.7
5.63
4.48
5.59
11.69
26.93
Tangible Book Value per Share
2
4.85
6.49
4.65
5.52
4.34
5.19
11.36
26.57
Basic Weighted Avg Shares
100
110
152
364
396
431
436
456
466
Sales/Revenue/Turnover
1,275
1,174
1,642
2,609
2,986
3,591
6,695
11,302
22,671
Operating Margin (%)
-3.74
5.01
2.83
7.3
4.09
-13.64
3.91
9.62
39.48
Depreciation Expense
20
21
20
27
46
63
107
169
- -
Net Income, GAAP
-136
19
27
117
71
-624
161
853
7,960
Effective Tax Rate (%)
- -
0.47
- -
0.9
- -
- -
17.92
9.97
14.65
Profit Margin (%)
-10.7
1.59
1.67
4.47
2.39
-17.39
2.41
7.55
35.11
Working Capital
26
453
746
1,316
1,921
982
1,114
4,672
17,666
LT Debt
- -
40
79
135
384
511
938
2,728
8,716
Total Equity
223
682
1,097
1,819
2,422
1,921
2,431
5,514
12,793
Return on Invested Capital (%)
- -
3.27
- -
6.68
- -
- -
2.17
8.45
41.52
Return on Capital (%)
- -
6.85
- -
7.11
- -
- -
4.94
10.33
43.85
Return on Common Equity (%)
- -
4.12
3.08
7.99
3.36
-28.71
7.43
21.73
106.18

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
4,520
6,763
7,692
LT Borrowings
2,667
5,336
8,646
LT Finance Leases
62
71
70
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
465
471
472
Market Capitalization
53,413
99,813
233,298

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
11,940
20,765
29,102
Cash, Cash Equivalents & STI
1,931
4,094
4,136
Accounts Receivable, Net
1,585
2,160
4,258
Inventories
7,868
12,069
18,168
Total Current Liabilities
7,268
10,290
11,435
Payables & Accruals
- -
- -
- -
ST Debt
4,520
6,763
7,692
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
46.32%
126.85%
Free Cash Flow
- -
174.01%
698.34%
Net Income, GAAP
- -
-77.33%
429.07%
Sales/Revenue/Turnover
- -
49.78%
68.82%
Total Cash Common Dividend
- -
96.95%
26.71%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1,727
1,714
1,584
1,670
6,695
2025
1,543
2,369
- -
4,727
11,302
2026
6,814
8,761
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.39
0.27
-0.13
-0.16
0.37
2025
-0.46
-0.06
- -
1.77
1.87
2026
6.21
9.05
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.05
0.05
0.09
0.15
0.33
2025
0.08
0.1
- -
0.13
0.4
2026
0.11
0.41
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Han He
Full Time Employees
2,852
Sector
Electronic technology
Industry
Computer peripherals
Address
Building # 4 Shenzhen GD China 518055
IPO Date
Dec 30, 2022
Website
biwin.com.cn
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Business
BIWIN Storage Technology Co., Ltd. is a Shanghai-listed semiconductor storage and memory solutions company that focuses on the research, design, packaging and testing, production, and sales of memory products. Headquartered in Shenzhen, China, and founded in 2010, the company serves a broad range of applications including embedded storage, consumer and enterprise storage, mobile storage, and automotive-grade and industrial memory solutions. Its product portfolio encompasses solid-state drives (SSDs) for client, enterprise, and data-center use; embedded storage chips; memory cards and memory modules; portable and external storage devices; and customized SSD solutions tailored to specific customer requirements, backed by in-house firmware, algorithm development, and advanced packaging and testing capabilities. Biwin maintains end-to-end vertical integration from memory chip research and development through packaging and testing to final product assembly, enabling control over quality, performance, and supply reliability. The company operates in multiple geographic regions, targeting both consumer and enterprise segments, including data centers, industrial environments, and automotive-related storage needs. Biwin distinguishes itself through a combination of chip design, packaging, testing, and software/firmware development, offering comprehensive storage solutions and customization services to global customers. Notable recent developments include strategic partnerships and collaborations to expand product ecosystems, product expansions into high-performance PCIe-based storage and memory solutions, and ongoing enhancements to packaging, testing, and supply chain capabilities to support next-generation computing platforms. Biwin’s branding and product strategy emphasize reliability, performance, and tailored storage solutions across embedded, PC, enterprise, and industrial segments, with ongoing efforts to broaden its global footprint and strengthen technology leadership in NAND flash storage.