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    Semiconductors
Jiangsu HHCK Advanced Materials Co., Ltd. Class A

Jiangsu HHCK Advanced Materials Co., Ltd. Class A

SSSE:688535
74.48
CNY
-4.19
(-5.33%)
26.79BMarket Cap
Oct 30Next Earn
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
1.03
1.23
1.16
1.81
2.08
1.94
2.85
3.89
4.78
3.38
2.54
2.8
3.83
- -
Basic EPS, GAAP
-0.1
-0.04
0.01
0.14
0.17
0.03
0.07
0.43
0.66
0.46
0.28
0.34
0.2
- -
Free Cash Flow per Basic Share
-0.23
-0.01
-0.16
-0.06
-0.14
0.07
0.09
-0.18
-0.1
0.02
-0.36
-0.53
-0.32
- -
Dividend per Share
0.04
0.05
0.04
0.05
0.05
0.06
0.08
0.06
0.13
0.07
0.15
0.29
0.19
0.1
Book Value per Share
0.59
0.71
0.73
0.86
1.03
1.07
1.33
1.76
3.84
4.23
8.6
8.7
15.3
15.8
Tangible Book Value per Share
0.46
0.58
0.6
0.75
0.92
0.96
1.13
1.55
3.69
4.09
8.35
8.45
7.1
7.72
Basic Weighted Avg Shares
64
64
79
62
64
69
60
64
73
90
111
119
120
133
Sales/Revenue/Turnover
66
78
91
113
133
134
172
248
347
303
283
332
458
- -
Operating Margin (%)
-6.13
0.14
5.91
11.91
11.37
3.55
6.34
15.28
16.49
13.76
6.66
7.22
1.38
- -
Depreciation Expense
5
5
5
4
5
5
6
7
10
11
12
18
31
- -
Net Income, GAAP
-6
-2
1
9
11
2
4
27
48
41
32
40
24
- -
Effective Tax Rate (%)
- -
- -
14.86
20.35
16.6
- -
8.03
14.4
11.19
2.04
6.36
8.84
- -
- -
Profit Margin (%)
-9.44
-3.1
1.17
7.84
8.11
1.75
2.37
10.94
13.71
13.6
11.18
12.08
5.29
- -
Working Capital
-26
-16
-15
19
12
28
20
30
237
230
148
168
1,139
750
LT Debt
- -
- -
- -
20
- -
10
- -
- -
- -
- -
- -
141
574
441
Total Equity
38
45
46
55
66
68
87
114
344
379
1,027
1,039
2,174
2,264
Return on Invested Capital (%)
- -
- -
-0.24
6.84
7.39
- -
1.3
16.16
17.4
11.44
4.05
3.19
- -
- -
Return on Capital (%)
- -
- -
1.2
8.73
11.25
- -
5.61
17.47
19.06
11.41
4.43
3.6
- -
- -
Return on Common Equity (%)
- -
-5.87
2.33
17.45
17.87
3.49
5.34
27.53
20.89
11.41
4.5
3.88
1.51
- -

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
99
39
16
LT Borrowings
573
523
441
LT Finance Leases
1
1
1
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
142
142
143
Market Capitalization
10,761
9,958
26,792

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
1,478
1,042
1,016
Cash, Cash Equivalents & STI
619
327
329
Accounts Receivable, Net
311
316
334
Inventories
178
188
202
Total Current Liabilities
339
282
266
Payables & Accruals
- -
- -
- -
ST Debt
99
39
16
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
59.37%
98.48%
109.15%
Free Cash Flow
-245.07%
-407.95%
-39.36%
Net Income, GAAP
133.98%
5.23%
-39.47%
Sales/Revenue/Turnover
19.11%
15.24%
38.12%
Total Cash Common Dividend
38.44%
71.76%
-34.59%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
72
83
84
92
332
2025
84
95
- -
179
458
2026
223
246
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.11
0.1
0.08
0.04
0.34
2025
0.06
0.06
- -
0.03
0.2
2026
0.09
0.18
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
0.21
- -
0.07
0.29
2025
0.01
0.01
- -
0.01
0.19
2026
0.01
0.07
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Jiang Long Han
Full Time Employees
971
Sector
Electronic technology
Industry
Semiconductors
Address
Lianyungang China
IPO Date
Apr 4, 2023
Website
hhck-em.com
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Business
Jiangsu HHCK Advanced Materials Co., Ltd. is a China-based specialty chemical and semiconductor materials manufacturer focused on the research, development, production, and sale of advanced electronic packaging materials and electronic adhesives. The company operates primarily through two core business segments: Epoxy Molding Compounds (EMC) and Electronic Adhesives. Its epoxy molding compound offerings comprise conventional epoxy molding compounds for discrete devices and standard integrated circuit packaging formats, including SOP, DIP, SOT, and TO series; high-density and fine-pitch epoxy molding compounds for QFN, QFP, and BGA packages; and advanced packaging materials, including Granular Epoxy Molding Compounds (GMC) and Liquid Epoxy Molding Compounds (LMC) formulated for High Bandwidth Memory (HBM), System-in-Package (SiP), Fan-Out Wafer-Level Packaging (FOWLP), and Panel-Level Packaging (PLP). Its electronic adhesive portfolio comprises conductive die attach adhesives; non-conductive die attach adhesives; liquid potting encapsulants; underfill adhesives; thermal conductive resins; and optical-grade clear encapsulation materials utilized in power discrete devices, MOSFETs, IGBT modules, optoelectronics, communication hardware, and automotive electronics. The company distributes its products to outsourced semiconductor assembly and test (OSAT) providers, integrated device manufacturers (IDMs), and electronics manufacturers across domestic Chinese and international markets. In recent operational and strategic developments, Jiangsu HHCK Advanced Materials Co., Ltd. has expanded its high-end semiconductor packaging footprint through the commercialization of proprietary GMC and LMC solutions for artificial intelligence hardware and HBM architectures, initiated strategic asset acquisitions and corporate reorganizations to vertically integrate specialized packaging adhesive and resin production, expanded manufacturing capacity at its primary production facilities, and deepened qualification and supply partnerships with Tier-1 semiconductor assembly leaders. Founded in 2010, Jiangsu HHCK Advanced Materials Co., Ltd. is headquartered in Lianyungang, Jiangsu Province, China.