- CEO
- Xiu Zhang
- Full Time Employees
- 3,219
- Sector
- Producer manufacturing
- Industry
- Industrial machinery
- Address
- No. 66, Chongsheng Road Qingdao SD China 266114
- IPO Date
- Aug 7, 2020
- Business
- Qingdao Gaoce Technology Co., Ltd. (688556.SS) researches, develops, manufactures, and sells cutting equipment and consumables for hard and brittle materials, primarily serving the photovoltaic, semiconductor, silicon carbide, sapphire, and magnetic materials industries; core products include photovoltaic cutting equipment such as loop cutting machines, single crystal cutting machines, grinding and polishing machines, diamond wire slicers, diamond wires, looped diamond wires, and diamond grinding tools; semiconductor cutting equipment; silicon carbide slicers, thinning and chamfering machines, and special diamond wires; sapphire and magnetic material cutting equipment; silicon wafer equipment like squaring machines, chamfering machines, and multi-wire croppers; plus cutting processing services with 63 GW operational capacity for large-size silicon wafers (182-210 mm, 110-155 µm thick) and total planned capacity of 102 GW across sites in Yibin, Leshan, and Yancheng. Founded in 2006 and headquartered at No. 66 Chongsheng Road, Qingdao High-tech Industrial Development Zone, Shandong, China, the company operates through wholly-owned subsidiaries including Changzhi Gaoce New Material Technology Co., Ltd., Huguan Gaoce New Material Technology Co., Ltd., Luoyang Gaoce Precision Machinery Co., Ltd., Leshan Gaoce New Energy Technology Co., Ltd., Yancheng Gaoce New Energy Technology Co., Ltd., and Yibin Gaoce New Energy Technology Co., Ltd., supporting seven manufacturing bases focused on China with customers among the top ten global photovoltaic silicon wafer manufacturers and international clients like Adani Group. Recent developments feature a May 2025 debt-to-equity swap converting 100 million yuan of debt into a 1.08% stake in Jiangsu Runyang New Energy Technology Co., Ltd. to bolster partnership and core operations; a November 2025 announcement for a new 25 GW large-size silicon wafer project in Yibin, Sichuan, with 1 billion yuan investment as the first phase of a 50 GW initiative via a wholly-owned subsidiary; ongoing expansion of slicing capacity to 102 GW with 4.226 billion wafers produced in 2024; and sales contracts including 146 million yuan for photovoltaic cutting equipment and tools plus equipment supply to Adani Group. The company reported operating revenue of 4.474 billion yuan as of December 31, 2024, emphasizing innovations like double-station loop-wire squaring, composite grinding spindles, adjustable wheelbase slicing, 12-wire diamond wire production, and ultra-precision semiconductor slicing.