- CEO
- Mao Jun Tong
- Full Time Employees
- 265
- Sector
- Process industries
- Industry
- Chemicals: specialty
- Address
- Shanghai China
- IPO Date
- Jul 10, 2023
- Business
- Shanghai Skychem Technology Co., Ltd., formerly known as Guangdong Skychem Technology Co., Ltd., is a China-based specialty chemical company that develops, manufactures, and markets functional wet electronic chemicals primarily for electronic circuit boards, advanced semiconductor packaging, display panels, and new energy applications. The company's product portfolio is organized into core electronic chemical categories, including: electroless copper deposition solutions and horizontal plated-through-hole chemical systems; electroplating copper additives and formulations for high-density interconnect boards, integrated circuit carrier substrates, through-silicon via, and through-glass via metallization; copper surface treatment agents, comprising micro-etching chemicals, brown oxide adhesion promoters, and anti-tarnish treatments; and specialty interface treatment chemicals engineered for polyimide, polyethylene terephthalate, and Ajinomoto Build-up Film surface metallization. Shanghai Skychem Technology Co., Ltd. serves printed circuit board fabricators, semiconductor packaging and testing providers, and electronics manufacturers across telecommunications, automotive electronics, artificial intelligence hardware, and high-performance computing sectors. Founded in 2010 and headquartered in Shanghai, China, the company operates research, development, and manufacturing facilities across mainland China—including Jiangsu and Guangdong provinces—and maintains an international operational presence through its overseas manufacturing subsidiary, Skychem Technology (Thailand) Co., Ltd. In recent developments, the company completed a corporate name change and restructuring from Guangdong Skychem Technology Co., Ltd. to Shanghai Skychem Technology Co., Ltd. in July 2025; established its overseas production base in Thailand with an initial investment of CNY 100 million to expand supply capabilities across Southeast Asia; accelerated the commercial rollout of proprietary wet chemicals for through-glass via and glass-core substrate packaging; and initiated plans to pursue an H-share secondary listing on the Hong Kong Stock Exchange to diversify capital access and accelerate global market expansion.