Sichuan Huafeng Technology Co., Ltd. Class A
SSSE:68862977.17
CNY
+1.66
(+2.20%)
ISIN
CNE100006KM6
Return %
Stock
S&P 500
1Y
-6.53
14.39
3Y
209.30
81.42
5Y
- -
68.62
Capital Structure
CNY
•
in mil. unless spec.Working Capital
CNY
•
in mil. unless spec.Growth Rates
CNY
•
in mil. unless spec.Quarterly Revenue
CNY
•
in mil. unless spec.Quarterly Earnings Per Share
CNY
•
in mil. unless spec.Quarterly Dividends Per Share
CNY
•
in mil. unless spec.Company Description
- CEO
- Tai Guo Liu
- Full Time Employees
- 3,986
- Sector
- Electronic technology
- Industry
- Electronic components
- Address
- Mianyang China
- IPO Date
- Jun 27, 2023
- Website
- huafeng796.com
- Similar Companies
- Business
- Sichuan Huafeng Technology Co., Ltd. is a China-based manufacturer specializing in the research, development, production, and sale of optical and electrical interconnection solutions, high-reliability connectors, and integrated cable assemblies for defense, telecommunications, enterprise computing, and industrial applications. Founded in 1958 and headquartered in Mianyang, Sichuan Province, the company operates as a specialized technology enterprise affiliated with Sichuan Changhong Electronics Holding Group Co., Ltd. The company organizes its core business into three main segments: Electrical Connectors, Optical Interconnect Products, and Cable Assembly Systems. Its comprehensive product and service portfolio comprises high-speed backplane connectors, including 56Gbps and 112Gbps PAM4 high-speed interconnect systems; circular, rectangular, and micro-miniature harsh-environment connectors; radio frequency (RF) coaxial connectors; printed circuit board (PCB) and board-to-board connectors; fiber optic connectors, active optical cables (AOC), and optical transceiver interfaces; new energy vehicle (NEV) high-voltage and low-voltage wiring harnesses; power supply connectors; integrated server backplane chassis modules; and customized interconnect cable assemblies engineered for mission-critical electronic systems. Sichuan Huafeng Technology serves tier-one manufacturers and enterprise clients across aerospace, defense electronics, 5G wireless and core network communications, artificial intelligence (AI) data center infrastructure, industrial automation, rail transit, and new energy vehicles, primarily operating across mainland China with selective export activities. In recent developments following its initial public offering on the Shanghai Stock Exchange Science and Technology Innovation Board (STAR Market) under ticker 688629, the company has scaled commercial production of its proprietary 112Gbps high-speed copper interconnect systems, commenced research and development for next-generation 224Gbps high-speed server connectors to meet accelerating AI compute cluster demands, expanded automated manufacturing capacity at its Sichuan production facilities, and deepened strategic supply partnerships across the telecommunications, AI server, and automotive electronics sectors.