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    Producer manufacturing

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    Industrial machinery
Circuit Fabology Microelectronics Equipment Co.,Ltd. Class A

Circuit Fabology Microelectronics Equipment Co.,Ltd. Class A

280.50
CNY
+0.11
(+0.04%)
3.52EPS
155.77P/E
79.43BMarket Cap
Oct 28Next Earn
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
0.18
0.72
2.55
3.4
4.36
5.4
6.61
7.3
10.73
15.19
Basic EPS, GAAP
-0.06
0.14
0.6
0.78
0.94
1.13
1.43
1.23
2.21
3.53
Free Cash Flow per Basic Share
-0.31
-0.04
-0.29
-0.91
-0.9
-0.27
-1.25
-1.05
0.04
- -
Dividend per Share
- -
- -
- -
- -
0.02
0.2
0.01
0.8
0.37
- -
Book Value per Share
0.43
1.24
3.73
4.51
7.71
8.68
15.46
15.66
17.52
36.32
Tangible Book Value per Share
0.43
1.24
3.73
4.51
7.7
8.6
15.37
15.56
17.43
36.24
Basic Weighted Avg Shares
121
121
79
91
113
121
125
131
131
131
Sales/Revenue/Turnover
22
87
202
310
492
652
829
954
1,408
1,992
Operating Margin (%)
-46.7
24.35
27.45
21.09
22.44
21.89
24.01
18.67
24.27
28.42
Depreciation Expense
1
1
2
3
6
11
17
17
17
- -
Net Income, GAAP
-7
17
48
71
106
137
179
161
290
463
Effective Tax Rate (%)
- -
15.3
13.33
10.62
8.59
7.96
8.06
6.06
12.07
13.27
Profit Margin (%)
-30.87
19.81
23.55
22.91
21.57
20.94
21.63
16.85
20.59
23.23
Working Capital
24
106
323
364
808
882
1,825
1,777
1,921
4,822
LT Debt
- -
- -
- -
- -
5
- -
1
1
1
1
Total Equity
39
113
338
409
931
1,049
2,032
2,063
2,308
5,251
Return on Invested Capital (%)
- -
19.55
19.33
14.7
14.32
13.06
11.59
7.92
13.61
12.51
Return on Capital (%)
- -
22.48
21.07
18.72
15.64
13.56
11.58
7.83
13.19
12.54
Return on Common Equity (%)
- -
22.75
21.16
19.04
15.85
13.79
11.64
7.85
13.27
12.56

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
23
20
11
LT Borrowings
- -
- -
- -
LT Finance Leases
1
1
1
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
132
132
145
Market Capitalization
17,723
25,479
79,430

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
2,664
2,943
5,996
Cash, Cash Equivalents & STI
763
897
3,690
Accounts Receivable, Net
897
1,033
1,084
Inventories
771
778
960
Total Current Liabilities
744
930
1,175
Payables & Accruals
- -
- -
- -
ST Debt
23
20
11
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
49.53%
11.92%
Free Cash Flow
- -
42.49%
-103.63%
Net Income, GAAP
- -
35.88%
80.42%
Sales/Revenue/Turnover
- -
36.2%
47.61%
Total Cash Common Dividend
- -
3,785.32%
-53.56%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
198
251
268
236
954
2025
242
412
- -
475
1,408
2026
515
591
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.3
0.47
0.42
0.04
1.23
2025
0.39
0.69
- -
0.69
2.21
2026
0.83
1.31
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
0.8
- -
- -
0.8
2025
- -
- -
- -
- -
0.37
2026
- -
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Lin Fang
Full Time Employees
804
Sector
Producer manufacturing
Industry
Industrial machinery
Address
No.2800, Chuangxin Avenue Hefei AN China 230000
IPO Date
Apr 1, 2021
Website
cfmee.cn
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Business
Circuit Fabology Microelectronics Equipment Co.,Ltd. specializes in the research, development, and advanced manufacturing of high-precision direct imaging and direct writing lithography systems. Its comprehensive product portfolio includes state-of-the-art direct imaging equipment and integrated automatic line systems for printed circuit boards (PCBs), alongside pan-semiconductor direct writing lithography equipment and corresponding automated production lines, as well as various other laser direct imaging solutions. The company's innovative direct writing lithography technology is integral to diverse processes such as integrated circuit mask creation, IC manufacturing, MEMS chip fabrication, flat panel display production, sophisticated advanced packaging, and biochip direct writing lithography, catering to research and mass production across various micro-nano lithography domains. Simultaneously, its direct imaging equipment addresses critical needs in IC carrier boards, flexible and rigid-flex boards, high-density interconnect (HDI) boards, multi-layer boards, and solder mask processes, supporting both automation and smart factory initiatives within the PCB sector. Circuit Fabology Microelectronics Equipment is recognized as the world's largest supplier of PCB direct imaging equipment by revenue in 2024, holding approximately 15.0% of the global market share. As of mid-2025, it stands as the only global entity reportedly offering commercialized lithography products across PCB, IC substrates, advanced packaging, and mask-making applications. Serving the broader electronic information industry, the company was established in June 2015 and is headquartered in Hefei, China.