Kunshan Dongwei Technology Co., Ltd. Class A
SSSE:68870044.40
CNY
-2.17
(-4.66%)
ISIN
CNE1000051C9
Return %
Stock
S&P 500
1Y
20.16
14.20
3Y
19.58
81.12
5Y
71.06
68.34
Capital Structure
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in mil. unless spec.Growth Rates
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in mil. unless spec.Quarterly Revenue
CNY
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Company Description
- CEO
- Jianbo Liu
- Full Time Employees
- 1,654
- Sector
- Process industries
- Industry
- Industrial specialties
- Address
- East of Dongding Road Suzhou JS China 215300
- IPO Date
- Jun 15, 2021
- Website
- ksdwgroup.com
- Similar Companies
- Business
- Kunshan Dongwei Technology Co., Ltd. Kunshan Dongwei Technology Co., Ltd. (688700:SHH) is a China-based company mainly engaged in the research, development, design, production and sales of precision electroplating equipment and supporting equipment for printed circuit boards (PCB), new energy applications and general metal plating; its core products include vertical continuous plating (VCP) equipment for PCB electroplating, horizontal wet process equipment for PCB, HDI, IC substrates and lead frame etching, hardware continuous lines for galvanized, copper-plated, nickel-plated, tin-plated, gold-plated and silver-plated production in 5G communications, automotive and aerospace sectors, gantry-type and barrel plating equipment for general metal electroplating, new energy composite copper foil equipment for lithium-ion battery anode current collectors, and vacuum coating equipment such as magnetron double-sided copper plating systems integrated with horizontal electroplating lines for lithium battery copper foil production. Founded in 2005 and headquartered at No. 505 Dongding Road, Bacheng Town, Kunshan City, Suzhou, Jiangsu Province, China, the company primarily serves domestic markets with a workforce of approximately 1,390 employees and focuses on high-efficiency, environmentally friendly and intelligent solutions aligned with Industry 4.0 standards for consumer electronics, automotive boards, servers, cloud storage and aerospace applications. Recent developments include forming a copper foil equipment partnership, providing CNY 150 million in funding to a recipient company, and ongoing employee stock ownership platform activities involving potential share reductions by entities holding up to 5.42% of shares, alongside sustained recognition as a national specialized "little giant" enterprise and multiple "first set" equipment honors.