Chengdu Sino-Microelectronics Tech. Co., Ltd. Class A

Chengdu Sino-Microelectronics Tech. Co., Ltd. Class A

SSSE:688709
20.65
CNY
-0.39
(-1.85%)
-0.01EPS
24.26BMarket Cap
Oct 31Next Earn
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
0.21
0.26
0.53
1
1.56
1.7
0.99
1.19
1.1
Basic EPS, GAAP
0.01
-0.02
0.07
0.32
0.52
0.57
0.2
0.24
-0.03
Free Cash Flow per Basic Share
-0.1
-0.08
-0.17
-0.37
-0.31
-0.1
-0.3
-0.94
- -
Dividend per Share
- -
0.01
0.01
- -
0.01
0.02
0.13
0.04
0.02
Book Value per Share
0.53
0.89
1.06
1.44
1.8
2.43
4.41
4.67
4.44
Tangible Book Value per Share
0.37
0.73
0.9
1.3
1.66
2.29
4.3
4.5
4.27
Basic Weighted Avg Shares
541
541
637
540
541
546
611
640
630
Sales/Revenue/Turnover
116
142
338
538
845
926
604
760
691
Operating Margin (%)
12.2
-3.13
18.92
38.16
40.12
40.27
31.61
38.89
17.73
Depreciation Expense
6
10
15
23
28
32
31
50
- -
Net Income, GAAP
4
-11
47
173
281
311
122
154
-17
Effective Tax Rate (%)
- -
- -
12.55
7.76
7.53
4.74
4.23
9.35
137.26
Profit Margin (%)
3.62
-7.53
13.92
32.13
33.29
33.59
20.23
20.21
-2.42
Working Capital
177
495
462
559
819
953
2,332
2,779
2,668
LT Debt
- -
95
6
100
308
217
178
612
600
Total Equity
287
482
592
803
979
1,325
2,830
3,004
2,861
Return on Invested Capital (%)
- -
- -
7.44
20.14
21.79
18.28
5.08
4.71
-0.33
Return on Capital (%)
- -
- -
7.98
19.54
21.71
18
4.67
4.33
-0.9
Return on Common Equity (%)
- -
-2.78
8.94
25.58
32.09
27.22
5.93
5.31
-0.59

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
201
127
122
LT Borrowings
600
600
591
LT Finance Leases
12
8
9
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
637
637
637
Market Capitalization
29,289
27,187
24,258

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
3,300
3,187
3,079
Cash, Cash Equivalents & STI
845
672
633
Accounts Receivable, Net
1,189
1,172
1,171
Inventories
844
922
971
Total Current Liabilities
521
448
411
Payables & Accruals
- -
- -
- -
ST Debt
201
127
122
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
42.54%
6.16%
Free Cash Flow
- -
94.04%
227.93%
Net Income, GAAP
- -
61.12%
25.73%
Sales/Revenue/Turnover
- -
23.37%
25.85%
Total Cash Common Dividend
- -
153.69%
-71.23%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
139
140
143
181
604
2025
156
199
- -
242
760
2026
103
147
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.1
0.02
0.02
0.05
0.2
2025
0.03
0.02
- -
0.14
0.24
2026
-0.11
-0.09
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
0.12
- -
- -
0.13
2025
- -
- -
- -
- -
0.04
2026
0.01
0.01
- -
- -
- -

Company Description

CEO
Ce Wang
Full Time Employees
990
Sector
Electronic technology
Industry
Semiconductors
Address
Chengdu China
IPO Date
Feb 7, 2024
Business
Chengdu Sino-Microelectronics Tech. Co., Ltd. is a China-based semiconductor company primarily engaged in the research, design, development, testing, and distribution of specialized high-reliability digital and analog integrated circuits. The company offers a comprehensive portfolio of semiconductor products and engineering solutions, comprising programmable logic devices, including field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), system-on-a-programmable chips (SoPCs), and radio-frequency FPGAs (RF-FPGAs); system-on-chip (SoC) and system-in-package (SiP) devices; microcontrollers (MCUs); non-volatile memory devices, including NOR Flash and EEPROM; time-sensitive networking (TSN) chips; high-speed and high-precision data converters, encompassing analog-to-digital converters (ADCs) and digital-to-analog converters (DACs); interface and bus driver circuits; power management integrated circuits; and custom application-specific integrated circuit (ASIC) design solutions. Additionally, the company provides specialized testing and validation services, including electrical parameter testing, environmental screening, failure analysis, reliability evaluation, wafer testing, and technical advisory services. Its products and solutions cater to mission-critical applications across industrial automation, communication networks, aerospace, energy management, automotive electronics, intelligent robotics, artificial intelligence of things (AIoT), and medical equipment. Founded in 2000 and headquartered in Chengdu, Sichuan Province, China, the company operates domestic research, design, and testing facilities serving clients throughout China, operating as a subsidiary of China Zhenhua Electronics Group Co., Ltd. under the ultimate control of China Electronics Corporation (CEC). In recent developments, Chengdu Sino-Microelectronics completed its initial public offering on the Shanghai Stock Exchange STAR Market in February 2024 under ticker 688709. The company has since accelerated its commercial expansion into high-tier industrial, edge AI, and medical sectors, launching cutting-edge devices including an ultra-high-speed 10-bit 128 GSPS single-chip ADC, introducing high-precision 18-bit successive approximation register (SAR) ADCs for industrial instrumentation, and deploying its advanced MCU and computing chips into embodied AI robotics and intelligent computing platforms.