LAPLACE Renewable Energy Technology Co. Ltd. Class A
SSSE:68872637.76
CNY
+0.45
(+1.21%)
ISIN
CNE100006PN3
Return %
Stock
S&P 500
1Y
-13.89
14.20
3Y
- -
81.12
5Y
- -
68.34
Capital Structure
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in mil. unless spec.Growth Rates
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in mil. unless spec.Quarterly Revenue
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Company Description
- CEO
- Jia Ji Lin
- Full Time Employees
- 2,388
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- Shenzhen China
- IPO Date
- Oct 29, 2024
- Website
- laplace-tech.cn
- Similar Companies
- Business
- LAPLACE Renewable Energy Technology Co. Ltd. is a China-based high-tech manufacturing company primarily engaged in the research, development, production, and sale of advanced thermal processing and thin-film deposition equipment for photovoltaic solar cells and third-generation semiconductor materials. Founded in 2016 and headquartered in Shenzhen, Guangdong Province, China, the company operates specialized research, development, and manufacturing facilities across China, providing industrial equipment and engineering solutions to leading clean energy manufacturers and semiconductor device producers across domestic and overseas markets. LAPLACE Renewable Energy Technology Co. Ltd. organizes its core product and service portfolio into: photovoltaic manufacturing equipment, including low-pressure chemical vapor deposition (LPCVD) equipment, boron diffusion furnaces, phosphorus diffusion equipment, oxidation and annealing furnaces, and plasma-enhanced chemical vapor deposition (PECVD) systems engineered for high-efficiency n-type TOPCon, XBC back-contact, and perovskite-silicon tandem solar cell production lines; semiconductor equipment, comprising ultra-high-temperature oxidation furnaces, annealing systems, and chemical vapor deposition equipment designed for third-generation silicon carbide (SiC) and gallium nitride (GaN) power semiconductor substrate and epi-wafer fabrication; automated material handling solutions, encompassing automated wafer loading and unloading equipment, intelligent wafer transfer mechanisms, and factory automation integration systems; and engineering and technical services, including customized equipment engineering, process optimization, on-site installation, commissioning, maintenance, and technical training. In recent developments, the company completed its initial public offering and listed its Class A shares on the Science and Technology Innovation Board (STAR Market) of the Shanghai Stock Exchange under ticker 688726 in October 2024, deploying capital toward advanced R&D and capacity expansion for next-generation solar and wide-bandgap semiconductor equipment. Additionally, the company has deepened strategic supply partnerships with tier-one photovoltaic module manufacturers to accelerate the commercial mass adoption of advanced back-contact (BC) and tandem cell technologies, while expanding its semiconductor equipment portfolio to support the growing industrialization of silicon carbide power electronics.