Xiamen Hengkun New Material Technology Co., Ltd. Class A
SSSE:68872734.98
CNY
-2.28
(-6.12%)
ISIN
CNE100007D58
Return %
Stock
S&P 500
1Y
- -
14.20
3Y
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81.12
5Y
- -
68.34
Capital Structure
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in mil. unless spec.Growth Rates
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in mil. unless spec.Quarterly Revenue
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Company Description
- CEO
- Rong Kun Yi
- Full Time Employees
- 399
- Sector
- Electronic technology
- Industry
- Electronic components
- Address
- Xiamen China
- IPO Date
- Nov 18, 2025
- Website
- hengkun.com
- Similar Companies
- Business
- Xiamen Hengkun New Material Technology Co., Ltd. is a China-based company engaged in the research, development, manufacture, and distribution of advanced electronic materials and specialty chemicals for the semiconductor and integrated circuit (IC) manufacturing industries. The company specializes in providing critical process materials utilized in photolithography and thin-film deposition for 12-inch semiconductor wafer fabrication, advanced memory chip production (including 3D NAND and DRAM), and logic chip fabrication at technology nodes of 90 nanometers and below. Its comprehensive product portfolio comprises photolithography materials, including spin-on carbon (SOC) hardmask coatings, bottom anti-reflective coatings (BARC), KrF excimer laser photoresists, i-Line photoresists, ArF immersion photoresists, silicon anti-reflective coatings (SiARC), and top coating formulations; ultra-high-purity precursor materials, including tetraethyl orthosilicate (TEOS), high-purity silicon-based precursors, and metal precursors utilized in chemical vapor deposition (CVD) and atomic layer deposition (ALD) processes; and specialized electronic formulation chemicals and process gases engineered for integrated circuit fabrication, automotive electronics, and intelligent terminal applications. The company operates specialized research, development, and manufacturing complexes across China, organizing its operations through regional operating subsidiaries. Its production network includes an advanced photolithography materials production base in Hefei, Anhui Province, operated by Anhui Hengkun New Material Technology Co., Ltd.; an ultra-high-purity electronic precursor manufacturing base in Dalian, Liaoning Province, operated by Dalian Hengkun New Material Technology Co., Ltd.; and an advanced photoresist formulation facility in Fujian Province operated by Fujian Hongguang New Material Technology Co., Ltd. The company also maintains research facilities, product introduction centers, and technical service hubs across Xiamen, Shanghai, Wuhan, and Japan to support leading integrated circuit foundries and IDMs across domestic and international markets. Xiamen Hengkun New Material Technology Co., Ltd. was founded on December 10, 2004, and is headquartered in Xiamen, Fujian Province, China. In recent corporate developments, Xiamen Hengkun New Material Technology Co., Ltd. completed its initial public offering (IPO) and listed its Class A shares on the Science and Technology Innovation Board (STAR Market) of the Shanghai Stock Exchange in November 2025 under ticker symbol 688727, raising approximately CNY 1.01 billion to finance the expansion of production lines and advanced material research facilities. Operationally, the company has expanded its commercial engagements across tier-one 12-inch wafer manufacturing facilities, successfully advancing its proprietary ArF immersion photoresists, SiARC coatings, and next-generation precursor materials through customer verification stages into volume commercial delivery, further solidifying its position in critical semiconductor materials localization.