Xi'an ESWIN Material Technology Co., Ltd. Class A
SSSE:68878320.70
CNY
-1.02
(-4.70%)
ISIN
CNE100007D09
Return %
Stock
S&P 500
1Y
- -
14.20
3Y
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81.12
5Y
- -
68.34
Capital Structure
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in mil. unless spec.Growth Rates
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in mil. unless spec.Quarterly Revenue
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Company Description
- CEO
- Xin Yuan Yang
- Full Time Employees
- 1,859
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- Xi'an China
- IPO Date
- Nov 28, 2025
- Website
- eswinsi.com
- Similar Companies
- Business
- Xi'an ESWIN Material Technology Co., Ltd. Class A is a China-based semiconductor materials company primarily engaged in the research, development, manufacturing, and distribution of 12-inch (300mm) monocrystalline silicon wafers for the global integrated circuit industry. Founded in 2016 and headquartered in Xi'an, Shaanxi Province, China, the company operates as the core semiconductor materials unit of Beijing ESWIN Technology Group. The company's systematic product portfolio comprises 12-inch monocrystalline silicon polished wafers; 12-inch monocrystalline silicon epitaxial wafers; and specialized test and monitor wafers engineered for advanced and mature process fabrication. Its silicon substrates are utilized in the manufacturing of logic integrated circuits; memory devices, including dynamic random-access memory (DRAM) and 3D NAND flash; complementary metal-oxide-semiconductor (CIS) image sensors; display driver integrated circuits (DDICs); and power discrete devices, such as insulated-gate bipolar transistors (IGBTs) and MOSFETs, serving semiconductor foundries and integrated device manufacturers (IDMs) across automotive electronics, artificial intelligence, telecommunications, industrial systems, and consumer electronics sectors. Geographically, the company operates large-scale fabrication facilities at its Xi'an Silicon Industry Base in Shaanxi Province and distributes products to semiconductor manufacturers across China and global markets. In recent corporate developments, the company completed its initial public offering (IPO) on the Shanghai Stock Exchange STAR Market in October 2025 under ticker SSE:688783, raising approximately RMB 4.6 billion to finance the Phase II capacity expansion of its Xi'an Silicon Industry Base. To meet surging demand for domestic silicon substrates, the company has scaled its operational 12-inch wafer manufacturing capacity toward 1.2 million wafers per month and initiated construction of an additional 500,000 wafer-per-month production facility in Wuhan, Hubei Province, targeting a total aggregate capacity exceeding 1.7 million wafers per month.