Xiamen UX IC Co., Ltd. Class A

Xiamen UX IC Co., Ltd. Class A

SSSE:688807
222.81
CNY
-17.94
(-7.45%)
1.27EPS
298.76P/E
32.19BMarket Cap
Oct 29Next Earn
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
4.24
3.91
9.81
8.11
7.24
Basic EPS, GAAP
1.02
0.9
1.86
1.47
1.35
Free Cash Flow per Basic Share
0.05
0.57
-0.47
1.73
- -
Dividend per Share
0.49
0.01
- -
0.3
- -
Book Value per Share
5.56
8.46
12.09
22.07
22.6
Tangible Book Value per Share
5.43
8.26
11.98
22.03
22.26
Basic Weighted Avg Shares
80
80
42
60
75
Sales/Revenue/Turnover
339
313
411
486
545
Operating Margin (%)
25.62
24.9
20.87
18.57
17.07
Depreciation Expense
16
22
22
25
- -
Net Income, GAAP
81
72
78
88
101
Effective Tax Rate (%)
8.86
0.43
0.84
1.82
1.73
Profit Margin (%)
24.01
23.02
18.97
18.13
18.59
Working Capital
262
287
451
1,593
1,569
LT Debt
- -
1
- -
1
1
Total Equity
334
507
725
1,766
1,808
Return on Invested Capital (%)
- -
17.1
12.62
7.09
7.8
Return on Capital (%)
- -
17.05
12.56
7.06
7.8
Return on Common Equity (%)
- -
17.14
12.64
7.08
7.83

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
2
2
10
LT Borrowings
- -
- -
- -
LT Finance Leases
1
1
1
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
80
80
80
Market Capitalization
14,984
16,709
32,194

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
1,690
1,646
1,638
Cash, Cash Equivalents & STI
1,151
893
853
Accounts Receivable, Net
136
140
159
Inventories
141
145
150
Total Current Liabilities
98
52
69
Payables & Accruals
- -
- -
- -
ST Debt
2
2
10
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
- -
143.53%
Free Cash Flow
- -
- -
-623.49%
Net Income, GAAP
- -
- -
13.18%
Sales/Revenue/Turnover
- -
- -
18.41%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
104
109
411
2025
118
121
119
129
486
2026
138
159
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
0.21
0.19
1.86
2025
0.37
0.31
0.43
0.19
1.47
2026
0.33
0.42
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
0.3
- -
- -
- -
0.3
2026
- -
- -
- -
- -
- -

Company Description

CEO
Teng Long Ke
Full Time Employees
157
Sector
Electronic technology
Industry
Semiconductors
Address
Xiamen China
IPO Date
Dec 19, 2025
Business
Xiamen UX IC Co., Ltd. Class A designs, develops, and markets high-speed analog and mixed-signal integrated circuits for optical communication and data transmission applications. The company offers a comprehensive portfolio of optical transceiver front-end chips and semiconductor solutions, including transimpedance amplifiers (TIAs); limiting amplifiers (LAs) and post-amplifiers; laser diode drivers (LDDs) supporting continuous-mode and burst-mode operations; highly integrated combo transceiver ICs combining receiver and driver functionalities; clock and data recovery (CDR) circuits; optical power monitoring and control ICs; and high-speed serializer/deserializer (SerDes) interface chipsets. Its product lines support data rates spanning from 1.25 Gbps to 800 Gbps and are deployed across fiber-to-the-home and broadband optical access networks (FTTx/PON, including GPON, EPON, 10G-EPON, XG-PON, XGS-PON, and 50G-PON); 4G and 5G wireless telecommunication fronthaul, midhaul, and backhaul infrastructure; hyperscale data center optical interconnects; cloud computing networks; enterprise storage area networks; and artificial intelligence computing clusters. In addition, the company provides custom ASIC design, wafer testing, application engineering, and technical support services to optical transceiver module manufacturers and telecommunications equipment original equipment manufacturers (OEMs). Founded in 2003, Xiamen UX IC Co., Ltd. is headquartered in Xiamen, Fujian Province, China, with regional research, development, sales, and customer support facilities across major technology hubs in East Asia and international markets. In recent developments, the company has completed its initial public offering on the Science and Technology Innovation Board (STAR Market) of the Shanghai Stock Exchange, launched commercial shipments of its next-generation 50G-PON optical front-end chipset family, advanced the development of high-bandwidth PAM4-driven ICs and silicon photonics driver solutions for 400G and 800G optical modules, and established strategic cooperative alliances with leading optical communication module vendors to expand its presence across global data center interconnect and AI infrastructure supply chains.