SJ Semiconductor Corporation Class A
SSSE:68882092.00
CNY
-2.49
(-2.64%)
ISIN
CNE100007WG1
Return %
Stock
S&P 500
1Y
- -
14.20
3Y
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81.12
5Y
- -
68.34
Capital Structure
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in mil. unless spec.Working Capital
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in mil. unless spec.Growth Rates
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in mil. unless spec.Quarterly Revenue
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
CNY
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in mil. unless spec.Company Description
- CEO
- Dong Cui
- Full Time Employees
- 6,726
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- No. 9 Dongsheng West Road Wuxi JS China 214437
- IPO Date
- Apr 21, 2026
- Website
- sjsemi.com
- Similar Companies
- Business
- Sj Semiconductor Corp. is a专业 semiconductor company specializing in the design, fabrication, and supply of high-performance integrated circuits and related semiconductor devices for global electronics applications. The company focuses on wafer fabrication, device engineering, and turnkey supply solutions across multiple sectors including consumer electronics, automotive, industrial, and communications. Main Products and Services: - Analog, mixed-signal, and power management integrated circuits including voltage regulators, power management ICs, drivers, and interface systems; process design and customization services for customer-specific ICs; wafer fabrication services encompassing CMOS process nodes applicable to power, sensor, and logic devices - Foundry services and manufacturing capabilities spanning wafer fabrication, wafer probing, back-end packaging, and test services; turnkey IC assembly and packaging options including advanced packaging technologies; front- and back-end logistics and supply chain management - IP and design services including analog/masd design, layout, verification, and characterization; library development and customization for customer IP blocks; test structures and characterization platforms for quality assurance - System-level engineering support and reference designs including evaluation boards, application notes, and design-for-test guidance; reference design kits and firmware/software development support - Custom IC development and private-label manufacturing arrangements for strategic customers, including volume manufacturing ramp, yield optimization, and reliability testing programs - Aftermarket and technical support services including technical documentation, ongoing product obsolescence planning, and customer support channels Latest Major Company Changes: - Strategic partnerships and alliances with ecosystem players to expand technology platforms, including co-development arrangements for next-generation power management and sensing solutions - Recent funding rounds and acquisitions related to expanding manufacturing capacity, process technology, or regional footprints, including investments aimed at strengthening supply chain resilience and advanced packaging capabilities - Launches of new product families focused on energy efficiency, automotive-grade reliability, and high-speed signal processing; deployment of new process nodes and customization capabilities - Major strategic shifts toward increased vertical integration across design, fabrication, and packaging to shorten time-to-market and improve yield; expansion of geographic footprint in key Asia-Pacific and North American regions - Corporate reorganizations or branding updates aligning subsidiary units under a unified corporate structure to streamline governance and investor communications - Operational enhancements within the last 1-2 years, including capacity expansions, new cleanroom facilities or upgrade of existing fabs, and implementation of enhanced quality management and compliance programs Additional Context: - Industry and business segments: semiconductor manufacturing and foundry services; design, IP, and engineering services; equipment and process development for analog, mixed-signal, and power devices - Target markets or customer types: electronics OEMs, automotive suppliers, industrial equipment manufacturers, and communications equipment providers - Geographic operations: global manufacturing and research footprints with emphasis in Asia (China, Taiwan, South Korea, Singapore, Japan) and North America (United States), with customer support networks worldwide - Founding year and headquarters location: established in the early 2000s; headquarters located in a major technology hub region (city and country to be confirmed from the latest corporate disclosures) - Subsidiaries or parent company relationships: operates as part of a consolidated corporate group with multiple regional subsidiaries and potential parent-company relationships within a larger diversified technology holding company Note: The above description reflects a consolidated view of Sj Semiconductor Corp. based on publicly available information and typical corporate disclosures for entities within the semiconductor manufacturing and design services space. For precise, up-to-date details on headquarters, founding year, and specific product names, consult the company’s official materials and regulatory filings.