- CEO
- Min Lin
- Full Time Employees
- 7,531
- Sector
- Electronic technology
- Industry
- Electronic components
- Address
- No. 12, Longjiang Road Shantou GD China 515065
- IPO Date
- Oct 8, 1997
- Business
- Guangdong Goworld Co., Ltd. (000823.SZ) manufactures and sells electronic components and ultrasonic electronic instruments principally in China with exports to the United States, European Union, Japan, South Korea, Australia, Hong Kong, and other international markets; its core products include printed circuit boards such as double-sided and multilayer boards plus 1-6 layer arbitrary-layer HDI boards in mass production, liquid crystal displays and touch screens for communications, automotive electronics, network products, computers, industrial control, mobile phones, radar, industrial automation, medical equipment, and instruments; ultra-thin and special copper clad laminates including lead-free variants and prepregs; and ultrasonic electronic instruments encompassing non-destructive testing equipment like flaw detectors, transducers in PE, PA, TOFD, ECT, EMAT, and PU types plus over 80 models and 300 transducer variants under the Shantou brand. Founded in 1997 and headquartered at No. 12 Longjiang Road, Longhu District, Shantou, Guangdong Province, China, the company operates through subsidiaries including Shantou Ultrasonic Printed Circuit Board companies and Shantou Ultrasonic Display companies focused on PCBs, displays, copper clad plates, and ultrasonic products. Recent developments encompass the establishment of wholly-owned subsidiary Shantou Ultrasonic Copper Clad Laminate Technology Co., Ltd. in 2022 for copper clad production, capital increases in controlling subsidiary Shantou Ultrasonic Printed Circuit Board Co., Ltd. by USD 6 million in September 2024 with the company contributing USD 4.5 million for 75% and Hong Kong Shan Hua Development Co., Ltd. contributing USD 1.5 million for 25%, completion of controlling shareholder Shantou Ultrasonic Electronics (Group) Co., Ltd.'s share repurchase plan, mass production capabilities for advanced HDI printed circuit boards suitable for AR applications as confirmed in November 2025, release of 2025 half-year and first-quarter reports alongside convertible bond adjustments, and inclusion of a project in Guangdong's 2023 Science and Technology Innovation Global Strategy Special program.