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Tianshui Huatian Technology Co., Ltd. Class A

Tianshui Huatian Technology Co., Ltd. Class A

SSZSE:002185
16.19
CNY
+0.64
(+4.12%)
0.41EPS
59.41P/E
74.22BMarket Cap
Oct 31Next Earn
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
1.3
1.71
1.88
2.3
2.94
2.99
3.2
3.06
4.29
3.72
3.52
4.51
5.33
5.99
Basic EPS, GAAP
0.11
0.15
0.15
0.16
0.21
0.16
0.11
0.26
0.5
0.24
0.07
0.19
0.22
0.38
Free Cash Flow per Basic Share
-0.07
-0.02
-0.1
-0.26
-0.38
-0.21
-0.08
-0.36
-0.74
-0.78
-0.41
-0.59
-0.83
- -
Dividend per Share
0.03
0.03
0.04
0.03
0.03
0.05
0.08
0.06
0.09
0.11
0.1
0.12
0.16
0.17
Book Value per Share
0.94
1.19
1.95
2.06
2.24
2.45
2.84
3.1
4.7
4.93
4.95
5.2
5.46
5.72
Tangible Book Value per Share
0.85
1.1
1.86
1.97
2.17
2.37
2.38
2.64
4.33
4.56
4.57
4.82
5.08
5.36
Basic Weighted Avg Shares
1,889
1,934
2,057
2,384
2,383
2,378
2,529
2,740
2,817
3,204
3,206
3,205
3,230
3,265
Sales/Revenue/Turnover
2,447
3,305
3,874
5,475
7,010
7,122
8,103
8,382
12,097
11,906
11,298
14,462
17,214
19,556
Operating Margin (%)
9.94
9.51
8.03
7.4
9.24
7.19
6.97
11.83
17.5
8.59
0.71
3.87
5.61
6.82
Depreciation Expense
216
276
364
436
581
738
1,214
1,439
1,837
2,300
2,433
2,603
2,971
- -
Net Income, GAAP
199
298
319
391
495
390
287
702
1,416
754
226
616
711
1,226
Effective Tax Rate (%)
11.42
12.2
12.95
13.6
13.33
10.63
18.4
9.65
9.26
4.38
- -
4.76
8.84
11.29
Profit Margin (%)
8.14
9.02
8.22
7.14
7.06
5.47
3.54
8.37
11.7
6.33
2
4.26
4.13
6.27
Working Capital
668
339
2,502
1,341
877
1,159
763
1,075
3,277
1,750
1,531
2,180
-524
-1,304
LT Debt
675
157
357
76
409
1,374
1,506
2,076
3,173
2,798
4,157
7,199
6,223
6,363
Total Equity
1,973
2,525
5,286
5,505
5,996
6,524
9,919
11,625
17,964
19,198
19,124
20,314
21,484
22,787
Return on Invested Capital (%)
7.08
8.47
4.82
6.08
8.45
5.04
2.47
5.67
8.63
4.08
- -
2.14
2.35
3.66
Return on Capital (%)
9.42
10.66
7.47
6.48
7.09
4.81
3.47
4.72
6.38
2.69
- -
2.8
2.64
3.8
Return on Common Equity (%)
12.07
14.26
9.03
8.18
9.66
6.97
4.21
8.62
12.02
4.89
1.43
3.79
4.12
6.87

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
8,494
9,876
10,353
LT Borrowings
5,863
5,890
6,064
LT Finance Leases
360
370
298
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
3,264
3,267
3,327
Market Capitalization
35,807
38,026
74,220

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
13,935
14,803
15,549
Cash, Cash Equivalents & STI
7,090
7,062
6,870
Accounts Receivable, Net
2,774
2,869
3,404
Inventories
2,843
3,262
3,695
Total Current Liabilities
14,459
16,394
16,854
Payables & Accruals
- -
- -
- -
ST Debt
8,494
9,876
10,353
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
16.41%
14.6%
5.76%
Free Cash Flow
71.67%
34.05%
40.51%
Net Income, GAAP
31.9%
34.52%
15.3%
Sales/Revenue/Turnover
17.29%
16.93%
19.03%
Total Cash Common Dividend
24.04%
25.48%
30.51%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
3,106
3,612
3,813
3,930
14,462
2025
3,569
4,211
- -
4,834
17,214
2026
4,800
5,711
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.02
0.05
0.04
0.08
0.19
2025
-0.01
0.08
- -
0.05
0.22
2026
0.03
0.22
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.02
0.05
0.03
0.02
0.12
2025
0.04
0.07
- -
0.02
0.16
2026
0.04
0.04
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Tie Cheng Zhang
Full Time Employees
33,887
Sector
Electronic technology
Industry
Semiconductors
Address
No. 14, Shuangqiao Road Tianshui GS China 741000
IPO Date
Nov 21, 2007
Website
ht-tech.com
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Business
Tianshui Huatian Technology Co., Ltd. (002185.SZ) engages primarily in the research, development, production, packaging, testing, and sales of semiconductor integrated circuits in China and internationally. The company provides one-stop services including package design, packaging simulation, leadframe packaging, substrate packaging, system in package (SiP), wafer level fan-out (WLP), wafer level packaging (WLP), memory packaging, micro-electromechanical systems (MEMS), sensor packaging, bumping, flip chip (FC), and multi-chip module (MCM/MCP) packaging products such as DIP/SDIP, SOT, SOP, SSOP, TSSOP/ETSSOP, QFP/LQFP/TQFP, QFN/DFN, and BGA/LGA; chip probing (CP) and final testing (FT), reliability testing, failure analysis, and co-design simulation services; logistics and distribution; as well as light-emitting diodes, engineering, mechanical and electrical installations, import-export trade, and investment activities. Its products serve applications in computers, network communications, consumer electronics, smart mobile terminals, Internet of Things (IoT), industrial automation control, automotive electronics, and other intelligent electronic systems, targeting domestic and global semiconductor manufacturers. Founded in 2003 and headquartered in Tianshui, Gansu Province, China, the company listed on the Shenzhen Stock Exchange in 2007 and operates production facilities primarily in China with export markets worldwide. In recent developments, Tianshui Huatian Technology partnered with investors in September 2025 to establish a semiconductor partnership fund valued at CNY 206 million and invested CNY 80 million in a separate semiconductor investment fund; it also announced plans in September 2025 for a share issuance and cash acquisition of assets related to a Beijing real estate project in Shunyi District's Dongfeng Mall area, alongside related-party fundraising not constituting major restructuring.