Shenzhen Fastprint Circuit Tech Co. Ltd. Class A

Shenzhen Fastprint Circuit Tech Co. Ltd. Class A

SSZSE:002436
34.42
CNY
+0.09
(+0.26%)
-0.07EPS
664.04P/E
86.60BMarket Cap
Oct 29Next Earn
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
0.97
1.24
1.51
1.98
2.19
2.26
2.61
2.71
3.41
3.36
3.3
3.52
4.27
4.43
Basic EPS, GAAP
0.09
0.09
0.1
0.13
0.11
0.14
0.2
0.35
0.42
0.33
0.13
-0.12
0.08
0.08
Free Cash Flow per Basic Share
-0.06
0.04
-0.25
0.06
0.17
0.04
0.11
-0.05
-0.33
-1.03
-1.08
-0.46
-0.54
- -
Dividend per Share
0.06
0.04
0.05
0.04
0.05
0.06
0.1
0.12
0.12
0.14
0.14
0.13
0.14
0.14
Book Value per Share
1.21
1.28
1.47
1.58
1.61
1.73
1.9
2.21
2.53
3.87
3.16
2.92
3.15
3.32
Tangible Book Value per Share
1.16
1.23
1.19
1.3
1.34
1.48
1.64
1.97
2.27
3.61
2.82
2.52
2.74
2.93
Basic Weighted Avg Shares
1,347
1,347
1,402
1,482
1,498
1,534
1,460
1,490
1,480
1,593
1,625
1,652
1,687
1,739
Sales/Revenue/Turnover
1,301
1,674
2,119
2,940
3,283
3,473
3,804
4,035
5,040
5,354
5,360
5,817
7,195
7,706
Operating Margin (%)
10.13
8.97
6.12
8.51
8.79
9.75
11.46
12.79
15.4
9.21
1.2
-3.85
1.69
2.26
Depreciation Expense
83
122
136
159
181
178
193
199
226
269
380
589
681
- -
Net Income, GAAP
114
126
140
193
165
215
292
522
621
526
211
-198
135
133
Effective Tax Rate (%)
9.61
9.39
- -
7.83
11.61
12.68
8.96
10.16
8.47
2.82
- -
- -
- -
- -
Profit Margin (%)
8.8
7.51
6.62
6.55
5.02
6.18
7.67
12.93
12.33
9.82
3.94
-3.41
1.88
1.73
Working Capital
41
-13
137
283
755
681
970
1,036
1,059
1,250
1,818
595
1,410
1,687
LT Debt
9
- -
258
140
518
566
657
701
1,007
1,242
3,207
2,899
3,674
4,332
Total Equity
1,623
1,714
2,270
2,452
2,475
2,676
2,966
3,579
4,286
7,029
6,307
5,576
5,744
5,901
Return on Invested Capital (%)
5.97
5.44
- -
6
5.6
6.62
8.23
11.93
10.14
5.84
- -
- -
- -
- -
Return on Capital (%)
6.91
7.12
- -
5.67
4.93
6.52
8.17
11.92
11.54
7.97
- -
- -
- -
- -
Return on Common Equity (%)
7.15
7.54
7.18
8.49
6.95
8.65
10.81
17.04
17.63
10.21
3.56
-3.86
2.62
2.5

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
1,556
1,772
1,954
LT Borrowings
3,657
4,103
4,316
LT Finance Leases
17
12
16
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
1,700
1,700
1,700
Market Capitalization
35,982
34,078
86,598

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
5,526
5,979
6,418
Cash, Cash Equivalents & STI
1,163
1,380
1,647
Accounts Receivable, Net
2,216
2,258
2,635
Inventories
982
1,153
1,250
Total Current Liabilities
4,116
4,334
4,731
Payables & Accruals
- -
- -
- -
ST Debt
1,556
1,772
1,954
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
11.35%
12.98%
3%
Free Cash Flow
77.77%
154.62%
21.72%
Net Income, GAAP
-25.02%
-83.6%
-168.05%
Sales/Revenue/Turnover
13.52%
12.69%
23.68%
Total Cash Common Dividend
14.32%
5.28%
2.69%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1,388
1,493
1,470
1,466
5,817
2025
1,580
1,846
- -
1,822
7,195
2026
1,818
2,220
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.01
- -
-0.03
-0.1
-0.12
2025
0.01
0.01
- -
- -
0.08
2026
0.01
0.05
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.01
0.07
0.02
0.02
0.13
2025
0.03
0.05
- -
0.02
0.14
2026
0.02
0.05
- -
- -
- -

Company Description

CEO
Xing Ya Qiu
Full Time Employees
7,761
Sector
Electronic technology
Industry
Electronic components
Address
Block A, Buliding No 2 Shenzhen GD China 518057
IPO Date
Jun 1, 2010
Business
Shenzhen Fastprint Circuit Tech Co., Ltd. engages in the design, research, development, production, and sale of advanced printed circuit boards (PCBs) and semiconductor products. The company offers a comprehensive product portfolio including high-density interconnect (HDI) PCBs, high-frequency PCBs, high-speed PCBs; rigid-flex and flexible PCB boards; load boards; probe cards; BIB (Burn-In Boards); interposer semiconductor test boards; and integrated circuit (IC) substrates. It primarily serves customers in communication devices, automotive electronics, medical electronics, rail transit, computers and peripherals, industrial control, and semiconductor integrated circuits sectors. Founded in 1999 and headquartered in Shenzhen, China, the company operates manufacturing campuses in Guangzhou, Yixing, and Shenzhen with a strong global footprint spanning over 30 countries and regions. Recent major developments include the completion of the first phase of production capacity for FCBGA packaging substrates at its Guangzhou base, alongside significant strategic investment in semiconductor capabilities marked by the acquisition of a 24% stake in Guangzhou Xinke Semiconductor. Shenzhen Fastprint has delivered robust financial performance with a strong revenue growth trajectory supported by product innovation and capacity expansion. The company continues to advance its technology standards to meet international benchmarks and deepen partnerships with high-tech R&D and manufacturing enterprises globally. Its latest quarterly results demonstrated a profit notably exceeding analyst expectations, while forecasts project a substantial revenue increase and continued profitability into 2026. Industry-wise, Shenzhen Fastprint operates primarily in the electronic components, semiconductor, and advanced PCB segments, catering to electronics manufacturing and high-tech industries. It maintains a strategic focus on both traditional PCB manufacturing and expanding semiconductor business lines, reinforcing its position as a one-stop solution provider for hardware and semiconductor testing needs. The company emphasizes quick-turn prototype production and high-mix low-volume PCB manufacturing, which supports diverse customer requirements across communications, industrial control, consumer electronics, and automotive sectors. Shenzhen Fastprint’s ongoing operational expansions and technological advancements reinforce its competitive strength in the global PCB and semiconductor industry.