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    Electronic components
Huizhou CEE Technology Inc. Class A

Huizhou CEE Technology Inc. Class A

SSZSE:002579
13.77
CNY
-0.76
(-5.23%)
-0.14EPS
13.28BMarket Cap
Apr 23Next Earn
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
1.05
1.66
1.32
1.85
2.27
3.96
4.71
5.76
4.97
5.12
4.21
4.69
4.59
5.06
Basic EPS, GAAP
0.03
0.07
0.07
0.26
0.05
0.18
0.33
0.4
0.25
-0.3
-0.22
-0.14
0.04
-0.13
Free Cash Flow per Basic Share
-0.28
-0.85
-0.02
-0.3
0.01
-0.14
0.09
-1.53
-2.26
-0.6
0.04
0.15
-0.04
- -
Dividend per Share
0.01
0.04
0.04
0.05
0.09
0.17
0.19
0.18
0.12
0.23
0.25
0.14
0.11
0.13
Book Value per Share
1.45
1.49
1.55
2.19
2.17
2.26
2.98
4.49
4.7
4.38
4.07
3.92
3.93
3.76
Tangible Book Value per Share
1.34
1.39
1.48
2.07
2.05
1.62
2.28
3.96
4.04
3.57
3.17
3.04
3.06
2.9
Basic Weighted Avg Shares
426
290
439
430
475
445
446
406
592
597
624
625
684
610
Sales/Revenue/Turnover
446
483
579
794
1,077
1,761
2,099
2,340
2,945
3,054
2,624
2,932
3,141
3,089
Operating Margin (%)
2.3
3.33
2.68
4.63
4.58
8.56
10.49
10.98
6.88
-2.82
-1.25
0.16
4.07
1.55
Depreciation Expense
22
23
46
50
56
82
107
118
161
259
260
283
267
- -
Net Income, GAAP
12
19
29
111
24
82
149
162
148
-179
-137
-87
27
-77
Effective Tax Rate (%)
7.26
6.53
12.62
23.6
26.44
12.98
10.69
10.24
4.2
- -
- -
- -
- -
- -
Profit Margin (%)
2.65
4.01
5.05
13.97
2.21
4.63
7.08
6.94
5.03
-5.86
-5.23
-2.98
0.87
-2.48
Working Capital
258
-78
-110
173
109
-4
218
996
-129
-200
-495
-1,306
-794
-864
LT Debt
40
32
56
19
15
315
373
655
1,098
1,405
1,140
364
999
1,126
Total Equity
608
631
653
972
982
1,197
1,340
2,678
2,851
2,685
2,693
2,599
2,591
2,480
Return on Invested Capital (%)
1.8
2.51
1.27
10.81
2.26
6.24
8.2
5.52
3.56
- -
- -
- -
- -
- -
Return on Capital (%)
2.04
2.98
4.87
12.09
2.49
6.71
8.7
7.04
4.43
- -
- -
- -
- -
- -
Return on Common Equity (%)
1.96
3.13
4.57
13.68
2.43
8.19
12.65
8.09
5.36
-6.46
-5.3
-3.57
1.14
-3.25

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
1,603
1,539
1,705
LT Borrowings
997
1,056
1,125
LT Finance Leases
2
2
2
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
613
613
613
Market Capitalization
7,462
6,843
13,282

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
2,290
2,272
2,352
Cash, Cash Equivalents & STI
668
689
563
Accounts Receivable, Net
800
778
876
Inventories
661
683
786
Total Current Liabilities
3,084
3,049
3,216
Payables & Accruals
- -
- -
- -
ST Debt
1,603
1,539
1,705
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
18.06%
-0.57%
-0.3%
Free Cash Flow
-228.37%
27.09%
-125.77%
Net Income, GAAP
11.54%
-84.13%
-131.3%
Sales/Revenue/Turnover
20.14%
6.87%
7.11%
Total Cash Common Dividend
25.28%
8.66%
-14%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
662
672
741
857
2,932
2025
743
875
- -
739
3,141
2026
699
775
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-0.08
-0.04
-0.03
0.01
-0.14
2025
0.01
0.02
- -
- -
0.04
2026
0.01
-0.16
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.03
0.03
0.03
0.05
0.14
2025
0.06
0.03
- -
-0.05
0.11
2026
0.03
0.11
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Zhen Wen
Full Time Employees
5,411
Sector
Electronic technology
Industry
Electronic components
Address
No. 1 Zhongjing Road Huizhou GD China 516029
IPO Date
Apr 25, 2011
Website
ceepcb.com
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Business
Huizhou CEE Technology Inc. (002579.SZ) engages in the research, development, production, sales, and service of printed circuit boards principally in China and internationally. The company manufactures rigid printed circuit boards (RPCBs), high-density interconnect boards (HDI), flexible printed circuit boards (FPC), rigid-flex printed circuit boards (R-F), flexible printed circuit board assemblies (FPCA), integrated circuit packaging substrates, multilayer boards, and aluminum substrate boards; its products serve consumer electronics, network communications, automotive electronics, new displays, security and industrial control, medical health, artificial intelligence, big data and cloud computing, Internet of Things, biometrics, smart wearables, smart homes, and unmanned aerial vehicles. Founded in 2000 and headquartered in Huizhou, Guangdong Province, China, the company operates production facilities domestically, employs approximately 4,700 people, and maintains a modern integrated system for research, manufacturing, and customer service targeting high-end PCB markets. In June 2024, the company changed its name from Huizhou China Eagle Electronic Technology Inc. to Huizhou CEE Technology Inc.; it announced plans in 2025 to raise up to CNY 700 million through a private placement of A-shares to specific investors for capacity expansion, technological upgrades, and working capital replenishment, while disclosing a preliminary issuance plan and reporting Q1 2025 revenue growth of 12.19% amid high order saturation exceeding 90% in high-end segments. CEE continues to expand into emerging areas such as the low-altitude economy and electromobility applications, including long flexible circuit boards for battery management systems, and holds recognitions as a national high-tech enterprise, green factory, and leader in China's PCB industry.