Shennan Circuit Co., Ltd. Class A
SSZSE:002916282.98
CNY
-1.32
(-0.46%)
ISIN
CNE100003373
Return %
Stock
S&P 500
1Y
46.08
13.14
3Y
485.32
80.78
5Y
312.41
67.74
Capital Structure
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in mil. unless spec.Working Capital
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in mil. unless spec.Growth Rates
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in mil. unless spec.Quarterly Revenue
CNY
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
CNY
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in mil. unless spec.Company Description
- CEO
- Zhi Qin Yang
- Full Time Employees
- 21,211
- Sector
- Electronic technology
- Industry
- Electronic components
- Address
- 1639 Yanlong Avenue Shenzhen GD China 518117
- IPO Date
- Dec 13, 2017
- Website
- scc.com.cn
- Similar Companies
- Business
- Shennan Circuit Company Limited specializes in the design, manufacture, and marketing of electronic interconnection products with a focus on printed circuit boards (PCBs), packaging substrates, and electronic assembly services. The company offers a broad product portfolio including high and medium-end PCBs, packaging substrates for semiconductor applications, and surface-mount technology (SMT) product assembly services. Its manufacturing capabilities encompass the entire production cycle from initial sample development to small and medium batch runs and large-scale mass production. Shennan Circuit operates advanced manufacturing facilities across China and maintains branch offices in the US and Europe to provide technical and sales support globally. The company serves diverse industries such as automotive, 5G telecommunications, Internet of Things (IoT), medical devices, and heavy industrial applications. Founded in 1984 and headquartered in Shenzhen, China, Shennan Circuit pursues a unique “3-In-One” business strategy integrating printed circuit boards, packaging substrates, and electronic assembly. It has established itself as a leading enterprise in China’s PCB industry and a pioneer in packaging substrates. The company is recognized as a key high-tech enterprise under China’s Torch Program and holds national technological innovation demonstration and enterprise technology center status within the PCB sector. Recent major developments include a notable increase in revenue by 32.4% year-over-year in fiscal 2024 to RMB 17.9 billion, driven by strong demand in AI-related products and expanding capacity utilization at its Guangzhou factory. Shennan Circuit is ramping up production capacity amid rising material costs and strategic investments. It has also maintained a stable gross profit margin improvement in core segments such as PCBs and packaging substrates. Additionally, Shennan Circuit has engaged in strategic cooperation agreements to enhance its technology offerings, including partnerships for intelligent equipment and high-precision machining to support 5G product mass production. The company continues to emphasize innovation and operational scale expansion to capitalize on growing markets like data centers, automotive electronics, and AI applications. Shennan Circuit’s products are categorized into three main segments: printed circuit board assembly, packaging substrates, and printed circuit boards, enabling it to provide end-to-end solutions across the electronic interconnection value chain. This comprehensive approach supports diverse customer needs from prototype through to volume production, positioning the company as a world-class technology and solution integrator in the electronics manufacturing industry. Its geographic operations span primarily China with growing international presence via its overseas offices catering to a global customer base. Overall, Shennan Circuit Company Limited leverages advanced manufacturing technologies, strategic partnerships, and product innovation to sustain its leadership in the PCB and packaging substrate markets while expanding its electronic assembly capabilities to serve high-growth sectors worldwide.