Shenzhen Strongteam Decoration Engineering Co., Ltd. (002989.SZ) provides batch fine decoration construction and design services primarily for real estate developers in China. The company offers residential bulk fine decoration services, including hardcover and maintenance for commodity housing, affordable housing, and long-term rental apartments; non-residential batch fine decoration for schools and hotels; indoor and outdoor decoration design services for communities, public buildings, chain stores, and office buildings; and other services such as government welfare housing rental. Holding National Building Decoration Professional Grade 1 Qualification and Building Decoration Design Class B Qualification, it operates exclusively in China, with approximately 80% of revenue from listed real estate companies, including 80% of China's top 20 real estate firms, and delivers over 50,000 refined decoration units annually on a direct-operation basis without subcontracting. Founded on September 28, 2000, and headquartered at Shenye Tairan Building in Shenzhen's Futian District, the company employs around 321 people. In recent developments, it established a holding subsidiary, Shenzhen Weifeng Technology Co., Ltd., in May 2025, to focus on special equipment for advanced semiconductor packaging; invested in partnership Zhongjing Xinjie (17.38% stake) targeting the advanced semiconductor packaging field; expanded its business scope in January 2025 to include sales of semiconductor device special equipment, electronic core devices, and integrated circuit manufacturing and sales; and announced plans to sell non-core assets (properties, vehicles, low-value consumables) up to RMB 400 million to optimize its structure and fund high-quality development amid real estate market challenges. These strategic shifts aim to cultivate a second growth curve in semiconductors while maintaining core decoration capabilities, with its participating enterprise Coris Semiconductor Technology commencing FCBGA high-end packaging substrate operations in September 2025 for CPUs, GPUs, AI, and automotive chips.