Technoprobe SpA

Technoprobe SpA

24.76
EUR
-1.92
(-7.20%)
22.50BMarket Cap
Mar 29Next Earn
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
0.34
0.53
0.65
0.92
0.68
0.84
0.98
- -
Basic EPS, GAAP
0.11
0.16
0.2
0.25
0.16
0.1
0.15
- -
Free Cash Flow per Basic Share
0.05
0.03
0.04
0.21
- -
0.05
0.16
- -
Dividend per Share
0.03
0.02
0.01
- -
- -
- -
- -
- -
Book Value per Share
0.4
0.54
0.74
1.22
1.36
1.91
1.93
2.17
Tangible Book Value per Share
0.37
0.51
0.71
1.19
1.29
1.74
1.77
2.01
Basic Weighted Avg Shares
601
601
601
598
600
647
640
642
Sales/Revenue/Turnover
204
317
392
549
409
543
628
- -
Operating Margin (%)
36.09
43
38.27
37.97
19.51
12.36
21.69
- -
Depreciation Expense
12
15
25
37
43
69
65
- -
Net Income, GAAP
66
97
118
148
97
64
98
- -
Effective Tax Rate (%)
15.18
25.49
21.7
28.48
- -
35.27
22.84
- -
Profit Margin (%)
32.37
30.43
30.2
26.94
23.7
11.75
15.54
- -
Working Capital
132
186
265
513
532
858
840
911
LT Debt
2
6
6
6
10
14
10
19
Total Equity
240
324
446
737
817
1,237
1,242
1,394
Return on Invested Capital (%)
- -
32.49
27.72
24.2
- -
4.14
8.31
- -
Return on Capital (%)
- -
32.02
28.66
24.55
- -
6.32
7.73
- -
Return on Common Equity (%)
- -
34.37
30.9
25.08
12.5
6.22
7.89
- -

Capital Structure

EUR

•

in mil. unless spec.
Jun'25
Dec'25
Jun'26
ST Debt
4
4
11
LT Borrowings
- -
- -
- -
LT Finance Leases
13
10
19
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
648
640
640
Market Capitalization
4,811
7,876
22,501

Working Capital

EUR

•

in mil. unless spec.
Jun'25
Dec'25
Jun'26
Total Current Assets
973
974
1,125
Cash, Cash Equivalents & STI
659
697
709
Accounts Receivable, Net
141
120
237
Inventories
128
125
146
Total Current Liabilities
110
135
215
Payables & Accruals
- -
- -
- -
ST Debt
4
4
11
Deferred Revenue
- -
- -
- -

Growth Rates

EUR

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
33.09%
0.39%
Free Cash Flow
- -
-176.22%
226.91%
Net Income, GAAP
- -
6.37%
53%
Sales/Revenue/Turnover
- -
17.3%
15.69%
Total Cash Common Dividend
- -
- -
- -

Semi-annual Revenue

EUR

•

in mil. unless spec.

Year

H1
H2
FY
2024
- -
- -
543
2025
- -
- -
628
2026
- -
- -
- -

Semi-annual Earnings Per Share

EUR

•

in mil. unless spec.

Year

H1
H2
FY
2024
- -
- -
0.1
2025
- -
- -
0.15
2026
- -
- -
- -

Semi-annual Dividends Per Share

EUR

•

in mil. unless spec.

Year

H1
H2
FY
2024
- -
- -
- -
2025
- -
- -
- -
2026
- -
- -
- -

Company Description

CEO
Stefano Felici
Full Time Employees
3,238
Sector
Electronic technology
Industry
Semiconductors
Address
Via Cavalieri di Vittorio Veneto, 2 Cernusco Lombardone LC Italy 23870
IPO Date
May 2, 2023
Business
Technoprobe S.p.A. (TPRO.MI) manufactures and supplies advanced probe cards for semiconductor wafer testing. The company offers a comprehensive portfolio of products including vertical probe cards, micro probe cards, and fine pitch probe cards designed for logic, memory, and system-on-chip (SoC) testing applications; it also provides engineering services for customized test solutions, repair and maintenance services, and related consumables. Technoprobe operates globally with production facilities in Italy, Taiwan, and Singapore, serving major semiconductor manufacturers in Asia, Europe, and North America. Founded in 1993 and headquartered in Cernusco sul Naviglio, Italy, the company focuses on high-density interconnect technologies to support advanced nodes in the semiconductor industry. Technoprobe expanded its market presence through a landmark listing on the Milan Stock Exchange via a business combination with NEXTORCH SPAC in late 2023, marking its transition to a publicly traded entity. In 2024, the company announced strategic investments in R&D for next-generation probe card technologies targeting AI and high-performance computing chips, alongside capacity expansions at its Asian facilities to meet surging demand from leading foundries. No major acquisitions, partnerships, or name changes have been reported in the last 1-2 years, with operations emphasizing organic growth and technological innovation.