Tokyo Electron Limited
Other OTCCapital Structure
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in mil. unless spec.Working Capital
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in mil. unless spec.Growth Rates
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in mil. unless spec.Quarterly Revenue
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
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in mil. unless spec.- CEO
- Tony Kawai
- Full Time Employees
- 20,236
- Sector
- Technology
- Industry
- Semiconductors
- Address
- Akasaka Biz Tower Tokyo TY Japan 107-6325
- IPO Date
- Jan 5, 2010
- CIK
- 0001443276
- Website
- tel.com
- Similar Companies
- Business
- Tokyo Electron Limited develops, manufactures and sells semiconductor production equipment and flat panel display production equipment worldwide. The company offers coaters/developers; plasma etch systems; thermal processing systems; single wafer deposition systems; cleaning systems including cryogenic aerosol and batch spray types; wafer probers; test systems; wafer bonders/debonders; wafer edge trimming systems; SiC epitaxial CVD systems; gas cluster ion beam systems for dimension modification and corrective etching; 3D integration systems such as extreme laser lift off; and plasma etch/ash systems for flat panel displays along with inkjet printing systems for OLED displays. It operates through three segments comprising semiconductor production equipment, flat panel display production equipment and other services including logistics, facilities management and insurance, with primary customers in semiconductor fabrication for integrated circuits, flat panel displays and photovoltaic cells across Japan, North America, Europe, Taiwan, China, South Korea, Southeast Asia and other regions. Founded in 1963 and headquartered at Akasaka Biz Tower in Minato-ku, Tokyo, Japan, the company maintains a global network of 26 consolidated entities across 18 countries and regions. In recent developments, Tokyo Electron formed a strategic partnership with Tata Electronics in September 2024 to supply semiconductor equipment and services for facilities in Dholera, Gujarat, and Jagiroad, Assam, including workforce training and R&D support; invested 47 billion yen in a new Process Development Building in Kumamoto, Japan, announced in 2025 to enhance 3D packaging, advanced cleaning and AI-driven manufacturing capacity as part of a 170 billion yen capital expenditure plan; and continues workforce expansion plans targeting 10,000 new global hires over five years with a focus on emerging markets like India.
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