Microcosm Technology Co., Ltd. (3354.TWO) engages in the research, development, manufacture and sale of functional polyimides and high-performance flexible copper clad laminates (FCCL) for semiconductors, displays and flexible printed circuit boards (FPCB). The company offers liquid photosensitive polyimide (PI) insulation; customized transparent polyimide; low phase difference, bending resistant and high modulus transparent polyimide for display materials; positive and negative photosensitive PI; redistribution layer (RDL) alkali soluble and peelable PI for semiconductors; photosensitive dielectric insulating materials; 5G high-speed FPC materials; flex board materials; and spray type solder mask ink products for FPC/PCB applications; as well as colorless and transparent polyimide, alkaline removable peelable materials, bonding sheets, coverlays, and photosensitive polyimide (PSPI). Founded in 1996 and headquartered in Tainan City, Taiwan, Microcosm Technology operates primarily in Taiwan with a subsidiary, Microcosm Technology (Suzhou) Co., Ltd., established in 2003 in Suzhou, China to support production and expansion. The company listed publicly on the Taipei Exchange in September 2003, enhanced its R&D capabilities with a dedicated center in Taiwan in 2012, and continues to innovate in advanced polyimide materials for high-tech industries amid steady dividend payouts including NT$0.20 per share declared for 2025.