1. Taiwan Stocks

  2. •

    Producer manufacturing

  3. •

    Metal fabrication
Microcosm Technology Co., Ltd.

Microcosm Technology Co., Ltd.

TTPEX:3354
49.95
TWD
-5.55
(-10.00%)
1.91BMarket Cap
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
10.32
9.78
6.75
5.84
8.08
7.13
6.3
4.13
2.85
2.22
1.57
1.82
1.41
- -
Basic EPS, GAAP
0.02
0.43
0.24
0.11
0.45
1.09
0.5
-0.74
-0.74
-0.3
-1.19
-0.34
-0.84
- -
Free Cash Flow per Basic Share
0.21
2.08
3.13
0.58
0.62
1.29
-0.27
-2.84
3.09
0.82
-0.84
-1.02
-1.2
- -
Dividend per Share
0.24
0.01
0.38
0.24
0.11
0.4
0.5
0.5
0.3
0.3
0.2
0.2
0.2
- -
Book Value per Share
15.91
16.35
16.04
16.46
16.58
17.17
17
15.76
14.75
14.2
12.76
12.3
11.3
11.08
Tangible Book Value per Share
15.77
16.23
15.94
16.34
16.43
16.98
16.81
15.54
14.52
13.96
12.53
12.06
11.06
10.85
Basic Weighted Avg Shares
82
82
82
78
69
69
70
70
70
70
70
70
70
71
Sales/Revenue/Turnover
851
806
557
453
561
496
440
290
200
155
110
128
99
- -
Operating Margin (%)
-0.02
2.78
0.12
-2.84
10.8
9.87
7.97
-14.16
-40.62
-63.75
-120.66
-80.92
-92
- -
Depreciation Expense
62
67
58
46
40
42
50
50
47
45
45
41
37
- -
Net Income, GAAP
1
36
20
9
31
76
35
-52
-52
-21
-84
-24
-59
- -
Effective Tax Rate (%)
91.11
35.86
7.99
- -
15.46
21.58
17.5
- -
- -
- -
- -
- -
- -
- -
Profit Margin (%)
0.16
4.41
3.62
1.9
5.51
15.33
8.01
-17.86
-25.82
-13.64
-76.2
-18.44
-59.5
- -
Working Capital
639
709
714
709
705
674
620
538
484
472
397
392
322
320
LT Debt
- -
- -
- -
- -
- -
- -
84
86
84
56
55
59
58
63
Total Equity
1,312
1,348
1,323
1,144
1,152
1,193
1,192
1,105
1,034
995
895
863
792
777
Return on Invested Capital (%)
- -
0.99
0.04
- -
3.66
2.6
1.91
- -
- -
- -
- -
- -
- -
- -
Return on Capital (%)
0.1
2.51
1.47
- -
2.39
5.41
2.57
- -
- -
- -
- -
- -
- -
- -
Return on Common Equity (%)
0.1
2.67
1.51
0.7
2.7
6.48
2.95
-4.51
-4.82
-2.09
-8.86
-2.68
-7.09
- -

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
3
3
4
LT Borrowings
- -
- -
- -
LT Finance Leases
58
63
63
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
70
70
70
Market Capitalization
2,012
1,662
1,911

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
347
341
352
Cash, Cash Equivalents & STI
285
274
272
Accounts Receivable, Net
30
36
44
Inventories
19
20
25
Total Current Liabilities
25
23
32
Payables & Accruals
- -
- -
- -
ST Debt
3
3
4
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
-4.87%
-6.4%
-8.14%
Free Cash Flow
41.55%
-89.24%
17.5%
Net Income, GAAP
36.05%
62.6%
149.28%
Sales/Revenue/Turnover
-14.09%
-17.81%
-22.74%
Total Cash Common Dividend
- -
- -
0.04%

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
32
35
34
27
128
2025
26
23
- -
24
99
2026
29
37
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-0.04
-0.09
-0.22
0.02
-0.34
2025
-0.15
-0.53
- -
-0.13
-0.84
2026
-0.17
-0.11
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
0.2
2025
- -
- -
- -
- -
0.2
2026
- -
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Tang Chieh Huang
Full Time Employees
80
Sector
Producer manufacturing
Industry
Metal fabrication
Address
No. 8, Nanke 9th Road Tainan TQ Taiwan 741
IPO Date
Jun 24, 2004
Website
microcosm.com.tw
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Business
Microcosm Technology Co., Ltd. (3354.TWO) engages in the research, development, manufacture and sale of functional polyimides and high-performance flexible copper clad laminates (FCCL) for semiconductors, displays and flexible printed circuit boards (FPCB). The company offers liquid photosensitive polyimide (PI) insulation; customized transparent polyimide; low phase difference, bending resistant and high modulus transparent polyimide for display materials; positive and negative photosensitive PI; redistribution layer (RDL) alkali soluble and peelable PI for semiconductors; photosensitive dielectric insulating materials; 5G high-speed FPC materials; flex board materials; and spray type solder mask ink products for FPC/PCB applications; as well as colorless and transparent polyimide, alkaline removable peelable materials, bonding sheets, coverlays, and photosensitive polyimide (PSPI). Founded in 1996 and headquartered in Tainan City, Taiwan, Microcosm Technology operates primarily in Taiwan with a subsidiary, Microcosm Technology (Suzhou) Co., Ltd., established in 2003 in Suzhou, China to support production and expansion. The company listed publicly on the Taipei Exchange in September 2003, enhanced its R&D capabilities with a dedicated center in Taiwan in 2012, and continues to innovate in advanced polyimide materials for high-tech industries amid steady dividend payouts including NT$0.20 per share declared for 2025.