Xintec Inc.
TTPEX:3374463.50
TWD
-7.00
(-1.49%)
Xintec Inc.
TPEX:3374
(Taipei Exchange)
Recent
price
463.50
P/E
ratio
45.04
div
yld
- -
ROIC.AI
Capital Structure
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in mil. unless spec.- Similar Companies
- Business
- Xintec Inc. (3374.TWO), founded in 1998 and headquartered in Taoyuan City, Taiwan, operates as a leading provider of advanced wafer-level chip scale packaging (WLCSP) and related semiconductor packaging services in Asia, the United States, and Europe. The company offers wafer-level chip scale packaging for image and environmental sensors; wafer-level post passivation interconnection for fingerprint, actuator sensors, micro-electromechanical systems (MEMS) components, power, analog, and RF devices; optical sensor chip scale packaging including side-wall interconnect, through silicon via redistribution layer (TSV RDL) interconnects, glass bonding with or without cavity, and various filters; frontside illuminated (FSI), backside illuminated (BSI), and stacked wafer reconstruction for mobile, automotive, and consumer applications; MEMS sensor packaging featuring wafer thinning, partial dicing, via-last TSV, dry etching for cavities, 3D I/O redistribution, and dual-side connections; specialty wafer reconstruction with glass lids for automotive uses; 12-inch wafer-level testing services; and customized advanced packaging solutions such as ultra-thin WLP, Cu TSV processes, and system-in-wafer-level CSP (System-in-WLCSP) for AR/VR, medical optical sensors, and heterogeneous integration. Its products serve consumer electronics including tablets, notebooks, and computers; automotive image sensors; industrial and medical applications; and emerging sectors like wearables and 3D sensing components. Recent developments include double-digit revenue growth to NT$7.06 billion in 2024 from image sensor packaging and 12-inch wafer testing, with net income after tax rising 21.4% to NT$1.67 billion; expansion of 12-inch capabilities at the new Zhongyuan Road facility starting contributions in 2025 alongside final product testing services; investments in wafer-level molding systems, Through-Molding Via (TMV), and chip-to-wafer (C2W) bonding for System-in-WLCSP; mass production ramp-up of automotive CIS CSP projects; and acceleration of R&D in sensor-related wafer-level system-in-package (SiP) for future growth, including TSMC representative changes in late 2024.