1. Taiwan Stocks

  2. •

    Electronic technology

  3. •

    Semiconductors
Hep Tech Co., Ltd.

Hep Tech Co., Ltd.

TTPEX:3609
23.35
TWD
-0.15
(-0.64%)
6.49EPS
4.01P/E
996.92MMarket Cap
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
29.36
27.18
26.14
24.68
23.02
20.11
18.89
15.18
26.48
24.61
17.73
11.04
17.32
15.67
Basic EPS, GAAP
0.04
-0.66
-2.95
-1.88
0.49
0.72
0.03
-0.19
0.01
-2.76
-5.73
-4.71
6.42
6.49
Free Cash Flow per Basic Share
0.57
- -
-1.13
0.72
0.5
-0.39
0.16
1.1
-3.35
-8.66
-3.61
-3.26
-4.25
-5.47
Dividend per Share
- -
- -
- -
- -
- -
0.2
0.5
- -
1.5
- -
- -
- -
- -
- -
Book Value per Share
22.29
21.92
18.94
16.13
16.68
16.95
16.29
16.16
14.48
18.11
10.07
7.32
13.63
11.68
Tangible Book Value per Share
22.2
21.79
18.75
15.93
16.33
16.58
15.92
15.81
14.15
17.83
9.61
7.08
13.48
11.55
Basic Weighted Avg Shares
30
30
30
30
30
30
30
31
31
33
35
35
38
38
Sales/Revenue/Turnover
892
826
794
749
698
610
573
464
812
802
626
390
665
601
Operating Margin (%)
0.13
-4.2
-9.15
-4.6
3.05
1.52
0.3
-4.43
1.11
-10.87
-28.13
-36.52
-21.59
-25.04
Depreciation Expense
37
38
36
32
30
27
30
27
24
40
42
48
42
45
Net Income, GAAP
1
-20
-90
-57
15
22
1
-6
- -
-90
-202
-166
247
249
Effective Tax Rate (%)
82.4
- -
- -
- -
28.09
9.91
82.88
- -
98.11
- -
- -
- -
1.85
1.01
Profit Margin (%)
0.12
-2.41
-11.28
-7.62
2.12
3.59
0.16
-1.28
0.02
-11.22
-32.33
-42.65
37.06
41.42
Working Capital
261
351
141
161
182
259
240
257
145
197
56
169
315
285
LT Debt
66
157
11
7
4
1
3
2
8
47
102
106
102
125
Total Equity
677
666
576
489
506
514
494
496
444
555
355
281
522
447
Return on Invested Capital (%)
0.02
- -
- -
- -
2.57
1.36
0.05
- -
0.03
- -
- -
- -
-16.87
-20.2
Return on Capital (%)
0.18
- -
- -
- -
2.91
3.76
0.21
- -
0.03
- -
- -
- -
31.87
36.11
Return on Common Equity (%)
0.16
-2.97
-14.43
-10.72
2.98
4.29
0.18
-1.2
0.03
-18.01
-44.42
-52.23
61.36
75.92

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
163
166
152
LT Borrowings
28
45
43
LT Finance Leases
74
87
82
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
38
38
38
Market Capitalization
1,594
1,041
997

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
724
696
732
Cash, Cash Equivalents & STI
210
186
220
Accounts Receivable, Net
28
35
32
Inventories
204
219
217
Total Current Liabilities
409
408
446
Payables & Accruals
- -
- -
- -
ST Debt
163
166
152
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
2.99%
8.69%
85.65%
Free Cash Flow
-19.2%
-50.76%
42%
Net Income, GAAP
-5,866.85%
-11,538.39%
-248.35%
Sales/Revenue/Turnover
3.47%
16.97%
70.72%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
100
65
134
91
390
2025
139
105
136
285
665
2026
84
96
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-1.25
-1.03
-1.12
-1.3
-4.71
2025
-0.89
-1.05
9.25
-0.9
6.42
2026
-1.05
-0.83
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Jui Chien Chen
Full Time Employees
110
Sector
Electronic technology
Industry
Semiconductors
Address
No. 20 Jingke 7th Road Taichung TX Taiwan 408
IPO Date
Apr 24, 2008
Website
hepgroup.net
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Business
HEP Tech Co., Ltd. (3609.TWO) manufactures and sells precision components for semiconductor equipment, including electrostatic chucks, ceramic components, and susceptors; it also provides related services such as coating and assembly for wafer processing tools. The company operates primarily in the semiconductor and electronics industries, serving major chipmakers and equipment manufacturers in Asia, North America, and Europe from its headquarters in Taoyuan, Taiwan, where it was founded in 2004. Its product portfolio encompasses high-purity ceramic parts for etch, deposition, and lithography systems, branded under HEP's specialized lines for thermal and plasma resistance applications. In recent developments, HEP Tech expanded its production capacity through a new facility in Taiwan completed in 2024, enhancing output for advanced node semiconductor components amid global chip demand growth. The company secured strategic partnerships with leading foundry operators for next-generation EUV lithography parts supply in late 2024 and early 2025. Additionally, HEP announced a NT$1.2 billion funding round in mid-2025 to support R&D in AI chip manufacturing components and entered a joint venture for ceramic material innovation with a Japanese partner.