1. Taiwan Stocks

  2. •

    Consumer durables

  3. •

    Electronics/Appliances
AMPLE Electronic Technology Co., Ltd.

AMPLE Electronic Technology Co., Ltd.

TTPEX:4760
324.50
TWD
-22.00
(-6.35%)
10.88BMarket Cap
Nov 10Next Earn
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
24.41
22.52
17.73
22.25
25.71
25.7
18.96
40.4
55.03
29.54
33.26
47.18
60.29
- -
Basic EPS, GAAP
0.88
1.44
0.68
1.18
1.43
2.02
0.95
4.51
6.38
2.94
3.72
6
7.05
- -
Free Cash Flow per Basic Share
-0.38
0.22
2.83
-3.37
2.36
-1.41
0.66
-3.37
3.03
13.38
-2.39
-1.35
2.43
- -
Dividend per Share
- -
0.09
0.32
0.26
0.44
0.72
1.33
0.73
3.02
4.34
2.09
2.57
3.52
- -
Book Value per Share
9.14
11.45
11.14
12.09
13.95
15.38
15.56
19.86
26.19
23.36
25.99
29.25
32.77
41.85
Tangible Book Value per Share
9.12
11.43
11.13
12.09
13.95
15.37
15.54
19.8
26.14
23.28
25.91
29.15
32.64
41.73
Basic Weighted Avg Shares
19
23
24
24
24
28
31
30
32
31
31
32
32
32
Sales/Revenue/Turnover
464
524
434
533
613
713
589
1,214
1,735
928
1,045
1,492
1,906
- -
Operating Margin (%)
4.18
7.67
4.73
7.57
6.85
9.52
6.67
13.61
14.09
11.28
12.33
14.88
15.12
- -
Depreciation Expense
9
8
9
11
12
15
18
19
21
25
24
24
23
- -
Net Income, GAAP
17
33
17
28
34
56
29
136
201
92
117
190
223
- -
Effective Tax Rate (%)
16.92
18.37
20.16
18.03
19.17
20.76
20.53
18.91
19.09
20.67
18.47
20.2
19.94
- -
Profit Margin (%)
3.59
6.39
3.81
5.32
5.56
7.86
4.99
11.17
11.6
9.95
11.17
12.72
11.69
- -
Working Capital
36
101
93
119
205
209
243
473
549
442
479
582
628
1,021
LT Debt
52
50
39
31
33
31
26
127
4
1
- -
- -
1
454
Total Equity
209
262
272
294
387
433
467
600
833
731
822
925
1,056
1,348
Return on Invested Capital (%)
- -
6.77
3.38
6.61
5.88
8.09
4.39
15.76
17.39
7.61
10.71
14.93
16.05
- -
Return on Capital (%)
- -
8.25
4.37
6.52
6.72
9.25
4.66
16.86
18.57
9.1
12.85
16.98
16.64
- -
Return on Common Equity (%)
- -
14.22
6.19
10
10
13.67
6.54
25.41
28.07
11.81
15.04
21.73
22.51
- -

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
473
963
637
LT Borrowings
- -
- -
454
LT Finance Leases
1
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
32
32
32
Market Capitalization
5,375
6,213
10,877

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
1,327
1,840
2,082
Cash, Cash Equivalents & STI
135
194
222
Accounts Receivable, Net
764
895
1,021
Inventories
412
430
529
Total Current Liabilities
699
1,273
1,061
Payables & Accruals
- -
- -
- -
ST Debt
473
963
637
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
15.35%
13.14%
14.14%
Free Cash Flow
-159.88%
-59.15%
-279.84%
Net Income, GAAP
57.01%
20.14%
17.47%
Sales/Revenue/Turnover
22.25%
15.92%
27.79%
Total Cash Common Dividend
58.55%
77.09%
37.04%

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
266
368
431
427
1,492
2025
412
433
- -
578
1,906
2026
627
711
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1.18
1.77
1.17
1.84
6
2025
1.92
0.47
- -
2.39
7.05
2026
2.55
2.71
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
2.57
2025
- -
- -
- -
- -
3.52
2026
- -
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Tsung I Tseng
Full Time Employees
115
Sector
Consumer durables
Industry
Electronics/Appliances
Address
No.32, Dayou 3rd Street Kaohsiung City KH Taiwan 83163
IPO Date
Oct 8, 2015
Website
ampletec.com.tw
Similar Companies
GoPro, Inc. (NASDAQ:GPRO)
Arcelik A.S. (BIST:ARCLK)
Richtech Robotics Inc. (NASDAQ:RR)
Aditya Infotech Limited (NSE:CPPLUS)
Whirlpool Of India Limited (NSE:WHIRLPOOL)
LG Electronics India Limited (NSE:LGEINDIA)
Business
Ample Electronic Technology Co., Ltd. (4760.TWO) researches, develops, designs, manufactures, and sells thick-film conductive materials primarily in Taiwan. The company offers high-temperature termination and inner silver conductive pastes; copper pastes; low-temperature termination silver epoxy pastes; silver rear paste for photovoltaic cells; conductive silver pastes for touch panels, membrane switches, LED and IC packages, and antennas; aluminum paste for solar panels; and advanced thermal interface materials including TIM1 thermal paste for cooling AI chips and high-frequency applications. Founded in June 2007 and headquartered at No. 32, Dayou 3rd Street, Daliao District, Kaohsiung City, Taiwan, it operates in the semiconductor materials and equipment industry, serving passive component manufacturers, solar cell producers, and high-tech sectors with global shipments to major factories worldwide. In recent developments, the company accelerates new product launches such as low-temperature silver pastes for mini molding chokes and membrane switches, achieves record revenues in 2025 with October sales at TWD 189 million up 12.1% year-over-year, deepens penetration into Japanese and high-end international clients including major Chinese passive component makers, and optimizes capacity for AI-driven material upgrades and high-speed transmission demands.