- CEO
- Yung Hui Chang
- Full Time Employees
- 197
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- No. 45, 15th, 10th, Wangjianli Taoyuan Taiwan 327
- IPO Date
- Jan 2, 2002
- Business
- New Era Electronics Co., Ltd. (4909.TWO) manufactures and sells specialized printed circuit boards (PCBs) primarily for high-frequency microwave communications, satellite applications, telecommunications equipment, and automotive systems. The company produces microwave RF PCBs used in base station antennas, low noise blocks (LNBs), and telecom equipment; heavy copper, metal core bonding, and copper coin insertion PCBs applied in workstation power supplies, base station transceivers, server accessories, remote radio heads, and small cells; FR-4 PCBs for computer accessories and communication equipment; mixed dielectric PCBs for telecom equipment, power amplifiers, VSAT transceivers, and remote radio heads; hydrocarbon ceramic and PTFE composite PCBs with low dielectric constant (Dk) and low dissipation factor (Df); thermally conductive PCB solutions; and RF automobile PCBs for blind spot detection, lane departure warning, emergency braking, advanced driver assistance systems (ADAS), and forward/rear collision warning. These products serve the telecommunications, satellite communications, 5G infrastructure, power electronics, and automotive industries, with operations focused in Taiwan and international markets.
Founded in 1984 and headquartered in Taoyuan City, Taiwan, New Era Electronics specializes in high multilayer, fine line, and advanced thermal management PCB technologies, holding certifications including ISO9001, IATF16949, and UL.
In recent developments, the company benefits from surging demand for high-frequency and thermal dissipation PCBs driven by satellite communications including LNBs and VSAT systems, as well as 5G base station upgrades, which have upgraded its revenue structure over the past two years through investments in high-end processes, coin copper thermal technologies, and metal composite printing to improve yield and value. It continues to expand capacity in RF and HDI multilayer boards to meet growth in these sectors, with third-quarter 2025 earnings reflecting ongoing operational adjustments amid market dynamics.