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    Electrical products
Asia Electronic Material Co., Ltd.

Asia Electronic Material Co., Ltd.

TTPEX:4939
72.20
TWD
-5.70
(-7.32%)
0.86EPS
74.51P/E
6.31BMarket Cap
Asia Electronic Material Co., Ltd.
TPEX:4939
(Taipei Exchange)

Recent

price

72.20

P/E

ratio

74.51

div

yld

- -

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
TWD
16.64
20.65
19.34
19.99
21.35
15.86
14.58
16.32
19.9
19.16
17.75
19.93
16.78
15.77
15.7
14.44
15.04
Revenue per Share
1.21
1.87
0.55
1.05
0.9
-1.85
0.13
1.21
1.14
0.36
1.61
1.76
0.35
0.37
0.19
-0.43
0.86
Basic EPS, GAAP
-2.06
-2.91
-2.82
2.56
-1.45
2.19
1.96
2.52
-0.74
-1.39
1.06
1.35
1.42
-0.27
-0.01
-0.27
-1.71
Free Cash Flow per Basic Share
0.05
0.09
0.34
0.14
0.67
0.7
- -
- -
0.5
0.5
0.25
1.25
1.4
0.48
0.5
0.5
- -
Dividend per Share
9.84
12.64
12.85
14.39
15.74
14.61
12.47
13.49
15.4
14.32
16.02
16.4
15.72
15.46
15.77
13.77
15.45
Book Value per Share
9.69
12.62
12.83
14.37
15.73
14.6
12.46
13.48
15.39
14.31
15.86
16.27
15.6
15.36
15.68
13.69
15.38
Tangible Book Value per Share
80
83
90
90
91
98
98
98
98
98
98
98
98
98
98
98
98
Basic Weighted Avg Shares
1,334
1,722
1,732
1,790
1,939
1,556
1,432
1,603
1,954
1,882
1,743
1,957
1,648
1,549
1,542
1,418
1,479
Sales/Revenue/Turnover
11.68
11.2
6.5
6.11
3.92
-7.62
4.4
7.63
10.36
6.41
12
13.15
6.69
5.31
3.11
2.64
5.79
Operating Margin (%)
44
42
47
60
67
66
60
46
43
47
44
54
66
65
69
65
69
Depreciation Expense
97
156
50
94
82
-181
13
119
112
36
158
173
34
36
19
-42
85
Net Income, GAAP
28.09
27.77
32.55
34.08
18.39
- -
26.47
17.3
37.88
25.72
30.27
34.46
34.38
27.22
39.62
- -
28.7
Effective Tax Rate (%)
7.27
9.04
2.86
5.23
4.21
-11.66
0.89
7.41
5.72
1.89
9.09
8.84
2.09
2.35
1.24
-2.99
5.74
Profit Margin (%)
531
909
958
721
1,012
589
785
933
1,016
811
815
928
681
777
686
647
586
Working Capital
- -
50
363
41
235
- -
- -
- -
29
141
9
101
4
103
- -
156
5
LT Debt
792
1,132
1,151
1,288
1,532
1,271
1,224
1,324
1,512
1,406
1,573
1,611
1,544
1,518
1,549
1,352
1,517
Total Equity
9.66
8.67
3.53
3.06
2.49
- -
2.39
5.68
6.6
3.82
6.57
7.11
3.03
2.58
0.93
- -
2.69
Return on Invested Capital (%)
9.25
10.56
3.1
4.94
4.25
- -
1.18
7.34
6.19
2.57
7.81
7.54
1.89
2.51
1.52
- -
4.61
Return on Capital (%)
12.67
16.19
4.34
7.68
5.8
-12.94
1.02
9.32
7.88
2.44
10.64
10.87
2.18
2.37
1.24
-2.92
6.23
Return on Common Equity (%)

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
714
665
859
LT Borrowings
150
150
- -
LT Finance Leases
6
5
5
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
98
98
98
Market Capitalization
3,614
2,681
6,314

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
1,592
1,754
1,860
Cash, Cash Equivalents & STI
536
409
411
Accounts Receivable, Net
554
498
587
Inventories
203
408
421
Total Current Liabilities
944
1,067
1,274
Payables & Accruals
- -
- -
- -
ST Debt
714
665
859
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
0.94%
-2.82%
-12.7%
Free Cash Flow
141.75%
323.19%
1,796.72%
Net Income, GAAP
55.89%
-86.93%
-321.86%
Sales/Revenue/Turnover
-0.32%
-3.61%
-8.05%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
357
401
410
374
1,542
2025
335
353
377
353
1,418
2026
314
435
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.13
0.04
0.11
-0.1
0.19
2025
0.06
-0.82
0.23
0.1
-0.43
2026
0.24
0.29
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
0.5
2025
- -
- -
- -
- -
0.5
2026
- -
- -
- -
- -
- -
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Business
Asia Electronic Material Co., Ltd. (4939.TWO) manufactures and sells electronic materials, primarily flexible copper clad laminates, coverlays, stiffeners, bonding sheets, polyimide composite films and electromagnetic interference shielding films for flexible printed circuit boards. The company offers adhesive and non-adhesive flexible copper clad laminates including single-sided and double-sided variants in common, halogen-free and high-performance series; coverlay series encompassing PI coverlay, PET coverlay, halogen-free coverlay and high-performance coverlay; stiffeners and bonding sheets with excellent heat resistance and adhesive properties; and polyimide composite films noted for solder heat resistance and chemical resistance. These products serve applications in mobile phones, smartphones, digital cameras, laptops, tablet PCs, LCD monitors, printers, hard drive heads, flat panel displays, touch modules, antenna panels, batteries and LED backlight modules. Founded in 2003 and headquartered in Hsinchu, Taiwan, the company operates manufacturing bases in Kunshan and Dongtai, China, and distributes products domestically and internationally. Recent developments include multiple patent awards such as inventions for printed circuit board protective films, coverlays with thermal conductivity and polyimide composite films, alongside certifications like SONY Green Partner and high-tech enterprise status for its Kunshan subsidiary. In 2011, the company listed on the Taiwan GreTai Securities Market, expanding its capital base through issuances and surplus transfers.