Sunplus Innovation Technology Inc.

Sunplus Innovation Technology Inc.

TTPEX:5236
156.50
TWD
+1.50
(+0.97%)
10.11BMarket Cap
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
13.59
16.37
17.92
34.53
41.51
26.24
27.65
30.3
33.33
- -
Basic EPS, GAAP
-0.04
1.15
2.57
8.85
11.52
6.35
7.17
8.03
8.59
- -
Free Cash Flow per Basic Share
0.08
0.99
3.3
9.12
15.11
3.36
8.9
7.5
8.95
- -
Dividend per Share
0.98
- -
0.97
2.29
7.61
9.96
6.86
6.82
7.53
- -
Book Value per Share
15.24
16.53
18.11
24.32
42.96
41.26
42.08
43.3
44.35
41.21
Tangible Book Value per Share
15.21
16.49
18.06
24.22
42.88
41.15
41.77
42.92
44.07
41.03
Basic Weighted Avg Shares
53
53
53
53
55
59
60
60
60
60
Sales/Revenue/Turnover
717
864
946
1,824
2,288
1,542
1,650
1,818
2,000
- -
Operating Margin (%)
1.88
7.04
16.47
31.48
33.83
28.35
28.74
28.59
28.14
- -
Depreciation Expense
3
2
9
11
12
13
16
19
23
- -
Net Income, GAAP
-2
61
136
468
635
373
428
482
515
- -
Effective Tax Rate (%)
480.82
15.13
18.01
19.12
19.1
19.84
15.31
14.67
13.94
- -
Profit Margin (%)
-0.29
7.03
14.33
25.64
27.77
24.21
25.93
26.52
25.76
- -
Working Capital
841
897
966
1,317
2,544
2,433
2,484
2,568
2,613
2,431
LT Debt
- -
- -
17
11
6
- -
- -
17
11
8
Total Equity
805
873
956
1,310
2,580
2,478
2,525
2,598
2,661
2,472
Return on Invested Capital (%)
- -
6.09
13.52
38.2
30.42
13.41
15.67
16.84
17.81
- -
Return on Capital (%)
- -
7.25
14.7
40.58
32.44
14.71
17.1
18.78
19.48
- -
Return on Common Equity (%)
- -
7.23
14.83
41.27
32.67
14.76
17.1
18.82
19.59
- -

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
6
6
6
LT Borrowings
- -
- -
- -
LT Finance Leases
11
10
8
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
60
60
60
Market Capitalization
6,720
7,471
10,111

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
3,044
3,297
3,488
Cash, Cash Equivalents & STI
2,546
2,614
2,250
Accounts Receivable, Net
288
440
381
Inventories
195
226
293
Total Current Liabilities
431
1,043
1,058
Payables & Accruals
- -
- -
- -
ST Debt
6
6
6
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
20.04%
2.42%
Free Cash Flow
- -
33.97%
19.32%
Net Income, GAAP
- -
5.75%
6.87%
Sales/Revenue/Turnover
- -
4.01%
10%
Total Cash Common Dividend
- -
53.37%
10.47%

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
364
407
550
497
1,818
2025
506
486
- -
464
2,000
2026
587
580
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1.89
1.79
2.35
1.95
8.03
2025
2.02
2.15
- -
2.11
8.59
2026
2.97
2.89
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
6.82
2025
- -
- -
- -
- -
7.53
2026
- -
- -
- -
- -
- -

Company Description

CEO
Chih-Hao Kung
Full Time Employees
144
Sector
Electronic technology
Industry
Computer peripherals
Address
A2, No.1, Li-Hsin 1st Road Hsinchu TP Taiwan 300
IPO Date
Jul 29, 2021
Business
Sunplus Innovation Technology Inc. (5236.TWO) researches, develops, manufactures, and markets microcontrollers and system-on-chips with embedded software solutions primarily for human interface devices, PC peripherals, and camera controllers. The company offers wired optical mice, wireless desktops, MCUs for HID and toy devices; Web, notebook (NB), and IoT camera controllers including high-integration digital camera solutions for PC and NB cameras; ultra-low-power edge AI image processing chips such as the SPCV6510A; next-generation camera control chips like the SPCA2150A3 supporting narrow bezels and Project Athena FHD 5M specifications; wired and wireless PC peripheral solutions for mice, keyboards, receiver dongles, game pads, and remote controls; and image data services for AI datasets encompassing data collection, labeling, tagging, verification, model training, 2D bounding box annotation, semantic segmentation, landmark/key point annotation, product features tagging, data format transformation, emotion analysis, data entry, and system integration. A subsidiary of Sunplus Technology Co. Ltd., founded in 2006 and headquartered at A2, No.1, Li-Hsin 1st Road, Hsinchu City, Taiwan, it operates mainly in Taiwan and mainland China within the semiconductors industry, targeting PC/NB camera, industry control, and AI data markets. Recent developments include the release of the ultra-low-power edge AI image processing chip SPCV6510A in April 2023 and the announcement of the SPCA2150A3 camera control chip in May 2022; a strategic collaboration with eNeural Technologies announced in April 2025 to showcase AI solutions combining eNeural's software with Sunplus' C3V hardware chips at AI EXPO Taiwan 2025; and deployment of Lenovo ThinkSystem servers powered by AMD EPYC processors in 2024-2025 to enhance R&D with AI capabilities for improved chip designs and faster time-to-market.