- CEO
- Chih-Hao Kung
- Full Time Employees
- 144
- Sector
- Electronic technology
- Industry
- Computer peripherals
- Address
- A2, No.1, Li-Hsin 1st Road Hsinchu TP Taiwan 300
- IPO Date
- Jul 29, 2021
- Business
- Sunplus Innovation Technology Inc. (5236.TWO) researches, develops, manufactures, and markets microcontrollers and system-on-chips with embedded software solutions primarily for human interface devices, PC peripherals, and camera controllers. The company offers wired optical mice, wireless desktops, MCUs for HID and toy devices; Web, notebook (NB), and IoT camera controllers including high-integration digital camera solutions for PC and NB cameras; ultra-low-power edge AI image processing chips such as the SPCV6510A; next-generation camera control chips like the SPCA2150A3 supporting narrow bezels and Project Athena FHD 5M specifications; wired and wireless PC peripheral solutions for mice, keyboards, receiver dongles, game pads, and remote controls; and image data services for AI datasets encompassing data collection, labeling, tagging, verification, model training, 2D bounding box annotation, semantic segmentation, landmark/key point annotation, product features tagging, data format transformation, emotion analysis, data entry, and system integration. A subsidiary of Sunplus Technology Co. Ltd., founded in 2006 and headquartered at A2, No.1, Li-Hsin 1st Road, Hsinchu City, Taiwan, it operates mainly in Taiwan and mainland China within the semiconductors industry, targeting PC/NB camera, industry control, and AI data markets. Recent developments include the release of the ultra-low-power edge AI image processing chip SPCV6510A in April 2023 and the announcement of the SPCA2150A3 camera control chip in May 2022; a strategic collaboration with eNeural Technologies announced in April 2025 to showcase AI solutions combining eNeural's software with Sunplus' C3V hardware chips at AI EXPO Taiwan 2025; and deployment of Lenovo ThinkSystem servers powered by AMD EPYC processors in 2024-2025 to enhance R&D with AI capabilities for improved chip designs and faster time-to-market.