ASPEED Technology, Inc.

ASPEED Technology, Inc.

TTPEX:5274
16,010.00
TWD
-505.00
(-3.06%)
132.86EPS
112.78P/E
623.56BMarket Cap
Nov 05Next Earn
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
15.99
22.51
26.03
35.1
46.25
52.41
60.25
74.05
87.67
125.33
75.35
155.39
218.51
276.65
Basic EPS, GAAP
4.63
7.38
8.92
11.63
12.98
16.69
20.16
24.28
31.64
50.65
24.23
61.85
94.47
132.96
Free Cash Flow per Basic Share
4.56
6.09
8.64
11.09
18.37
16
21.35
25.06
37.81
51.67
8.83
70.34
99.92
120.26
Dividend per Share
3.16
3.46
4.83
6.61
9.92
12.4
14.87
18.2
21.5
28.92
40.97
18.2
47.3
- -
Book Value per Share
18.53
22.54
27.54
46.43
50.6
56.5
63.67
72.33
85.27
107.87
92.16
135.55
182.06
187.37
Tangible Book Value per Share
17.49
21.99
27.03
21.52
27.75
36.08
44.06
54.31
69.84
89.67
77.27
118.6
167.45
174.41
Basic Weighted Avg Shares
37
38
38
38
41
41
41
41
41
42
42
42
42
43
Sales/Revenue/Turnover
591
856
993
1,346
1,894
2,154
2,484
3,064
3,638
5,210
3,130
6,460
9,085
11,791
Operating Margin (%)
30.83
35.68
37.08
39.74
34.19
37.14
40.59
41.48
45.42
47
34.49
45.18
51.3
52.53
Depreciation Expense
29
36
39
41
128
138
154
207
219
240
306
256
324
371
Net Income, GAAP
171
281
340
446
531
686
831
1,005
1,313
2,106
1,007
2,571
3,928
5,667
Effective Tax Rate (%)
12.02
13.69
12.66
17.99
15.53
19.68
17.75
18.12
18.46
19.48
15.75
18.82
19.1
19
Profit Margin (%)
28.94
32.8
34.25
33.14
28.05
31.85
33.46
32.79
36.09
40.41
32.16
39.81
43.23
48.06
Working Capital
648
824
988
932
1,089
1,395
1,680
2,086
2,578
3,394
2,744
4,105
5,965
6,324
LT Debt
- -
- -
- -
- -
- -
- -
86
62
38
15
9
172
280
264
Total Equity
706
861
1,055
1,901
2,078
2,329
2,633
3,004
3,546
4,488
3,834
5,639
7,571
7,817
Return on Invested Capital (%)
27.48
31.5
31.46
25.18
23.75
27.56
31.14
33.98
38.12
45.15
20.75
46.67
51.25
68.27
Return on Capital (%)
30.25
34.87
34.73
26.68
24.12
30.81
32.83
34.55
39.29
51.84
24.2
53.1
57.37
84.02
Return on Common Equity (%)
30.24
35.83
35.48
30.17
26.71
31.13
33.5
35.65
40.09
52.42
24.2
54.28
59.47
87.4

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
34
36
36
LT Borrowings
- -
- -
- -
LT Finance Leases
280
274
264
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
42
42
42
Market Capitalization
274,447
404,489
623,555

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
8,408
10,382
12,524
Cash, Cash Equivalents & STI
6,298
7,729
9,364
Accounts Receivable, Net
1,606
2,047
2,503
Inventories
280
353
471
Total Current Liabilities
2,444
6,064
6,201
Payables & Accruals
- -
- -
- -
ST Debt
34
36
36
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
24.01%
22.28%
34.25%
Free Cash Flow
88.98%
148.95%
42.06%
Net Income, GAAP
36.85%
49.41%
52.76%
Sales/Revenue/Turnover
29.77%
33.81%
40.64%
Total Cash Common Dividend
36.58%
39.85%
160%

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1,013
1,356
1,986
2,104
6,460
2025
2,065
2,247
2,330
2,443
9,085
2026
3,147
3,871
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
9.42
12.22
17.55
22.68
61.85
2025
21.33
13.75
29.2
28.8
94.47
2026
34.01
40.25
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
18.2
2025
- -
- -
- -
- -
47.3
2026
- -
- -
- -
- -
- -

Company Description

CEO
Hung Ming Lin
Full Time Employees
45
Sector
Electronic technology
Industry
Semiconductors
Address
No. 1, Gongdao 5th Road Hsinchu HSZ Taiwan 30069
IPO Date
Jan 11, 2012
Business
ASPEED Technology Inc. (5274.TWO) is a fabless integrated circuit design company that develops and markets system-on-chip solutions for cloud computing, enterprise servers, and smart audiovisual applications. The company offers Cloud & Enterprise Solutions, including Baseboard Management Controller (BMC) SoCs for remote server monitoring and management with 2D graphics and logic control; Bridge ICs with integrated memory and storage; Platform Firmware Resilience (PFR) ICs for enterprise firmware security; and I/O expanders; as well as Smart AV Solutions such as AV over IP (AVoIP) extension SoCs, Cupola360 spherical image stitching processors for 360-degree cameras, and the companion Cupola360+ software kit. It also provides research and development, technical support, software design services, and engages in wholesale of information software, international trade, intellectual property management, and product design. Founded in 2004 and headquartered in Hsinchu City, Taiwan, ASPEED operates primarily in Taiwan, China, the United States, and internationally, targeting data centers, cloud service providers, smart factories, smart cities, and consumer electronics manufacturers. In 2016, the company acquired Broadcom's Emulex Pilot remote server management chip business, establishing its leadership as the world's top BMC SoC provider. More recently, in May 2024, ASPEED partnered with Schneider Electric and Millitronic to launch a smart panoramic visual management platform for data centers using Cupola360 technology. In November 2025, its board approved the spin-off of the Reality Remote Management (RRM) business—formerly Smart AV, encompassing Cupola360 panoramic cameras, AVoIP, and related SoCs—into a wholly owned subsidiary, Cupola360 Inc., effective tentatively December 31, 2025, to enhance specialization in cloud and enterprise solutions while maintaining 100% ownership with no impact on shareholders.