- CEO
- Chuan Sheng Chien
- Full Time Employees
- 273
- Sector
- Electronic technology
- Industry
- Computer peripherals
- Address
- No. 237, Datong Road New Taipei City TP Taiwan 221
- IPO Date
- Oct 5, 2012
- Business
- Innodisk Corporation (5289.TWO), founded in 2005 and headquartered in Xizhi District, New Taipei City, Taiwan, manufactures and sells industrial-grade embedded flash storage devices, dynamic random-access memory (DRAM) modules, embedded peripheral modules, and related software and technical services for enterprise, industrial, aerospace, and edge AI applications. The company offers core products including industrial solid-state drives such as SATADOM, nanoSSD, E1.S SSDs, and InnoAGE SSDs with technologies like iSLC, InnoOSR firmware, and OOB management; DRAM solutions encompassing DDR5 RDIMMs up to 7200 MT/s and 64GB capacity, DDR5 CAMM2, LPDDR5X CAMM2, ultra-temperature DRAM, and CXL memory modules; embedded peripherals like M.2 10GbE LAN modules, I/O expansion, embedded cameras with MIPI over Type-C, and sensors; as well as edge AI computing systems, machine-learning inference tools, iCAP cloud management platform, and turnkey intelligence solutions across nine categories including sensing, data, connecting, extended, computing, machine-learning, management, applied, and collective intelligence. Innodisk operates globally through subsidiaries and offices in the United States (Fremont, CA; Round Rock, TX; Edison, NJ), China (Shenzhen, Shanghai, Beijing, Chengdu), Japan (Tokyo), and Europe (Netherlands, France, Germany), serving sectors such as manufacturing, transportation, surveillance, data centers, retail, logistics, communication, healthcare, entertainment, and aerospace; it maintains group subsidiaries including Aetina (AI computing), Millitronic (network solutions), Sysinno (air sensors), and Antzer Tech (vehicle communications). Recent developments include the launch of Phase II Yilan R&D and Manufacturing Center in July 2024 to boost production capacity for AI projects; acquisition of a new office in Japan in Q4 2024 to strengthen international operations; introduction of the "Architect Intelligence" brand initiative in 2024; release of DDR5 7200 RDIMM, DDR5/LPDDR5X CAMM2 modules, and CXL memory modules with shipments starting in Q1 2025; three Taiwan Excellence Awards in 2024 for CXL Memory, DDR5 Dual-cooling Memory, and E1.S SSD; a new edge AI strategy announced in October 2025 targeting high-growth markets; and a "Best of Show" award at FMS 2025 for CXL innovation, alongside ongoing collaborations with NVIDIA, Aetina, Microsoft, and ecosystem partners to expand AIoT, computer vision, and data center offerings.