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    Semiconductors
Vanguard International Semiconductor Corp

Vanguard International Semiconductor Corp

TTPEX:5347
161.00
TWD
-5.50
(-3.30%)
4.61EPS
44.24P/E
405.72BMarket Cap
Nov 05Next Earn
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
13.18
14.54
14.05
15.56
15.01
17.43
17.04
19.96
26.48
31.14
23.35
26.31
26.42
27.67
Basic EPS, GAAP
2.72
3.3
2.51
3.34
2.71
3.72
3.53
3.8
7.12
9.21
4.5
4.21
4.3
4.88
Free Cash Flow per Basic Share
4.09
2.14
3.41
4.03
2.38
3.33
-0.4
4.17
4.78
9.07
1.06
5.24
-20.96
-26.22
Dividend per Share
0.97
1.75
2.57
2.57
2.96
2.96
3.16
3.16
3.46
4.44
4.5
4.4
4.57
- -
Book Value per Share
15.11
16.6
16.51
17.29
16.79
17.74
17.79
17.81
21.19
27.32
27.54
34.34
34.21
33.53
Tangible Book Value per Share
15.1
16.58
16.49
17.27
16.78
17.72
17.58
17.64
21.07
27.16
27.38
32.61
32.56
31.32
Basic Weighted Avg Shares
1,604
1,646
1,660
1,660
1,660
1,660
1,660
1,660
1,660
1,660
1,639
1,675
1,839
1,846
Sales/Revenue/Turnover
21,135
23,931
23,320
25,829
24,910
28,928
28,286
33,131
43,951
51,694
38,273
44,055
48,591
51,070
Operating Margin (%)
22.89
25.93
19.78
23.62
20.99
24.73
24.43
22.38
32.09
34.45
15.09
16.14
16
17.02
Depreciation Expense
2,277
2,081
2,319
2,053
2,034
1,823
2,141
3,500
3,984
5,542
7,852
8,622
8,552
8,721
Net Income, GAAP
4,371
5,440
4,158
5,538
4,505
6,166
5,860
6,306
11,820
15,280
7,370
7,046
7,908
9,011
Effective Tax Rate (%)
13.66
16.26
15.81
11.54
14.69
17.48
20.36
16.67
17.29
18.94
16.57
19.48
16
14.57
Profit Margin (%)
20.68
22.73
17.83
21.44
18.09
21.32
20.72
19.03
26.89
29.56
19.26
15.99
16.27
17.65
Working Capital
17,858
19,723
20,539
20,186
18,495
18,614
10,038
10,783
19,212
25,162
29,971
64,836
15,293
17,350
LT Debt
- -
- -
- -
- -
- -
- -
1,105
1,464
6,825
14,329
20,197
24,410
21,182
27,144
Total Equity
24,430
27,546
27,410
28,699
27,876
29,439
29,532
29,558
35,165
45,351
45,713
68,667
83,590
92,911
Return on Invested Capital (%)
18.14
19.55
13.77
18.5
15.41
19.92
16.71
17.66
29.56
27.02
7.38
7.03
6.18
6.38
Return on Capital (%)
19.23
20.93
15.13
19.74
15.93
21.52
18.55
18.8
31.33
30.22
12.01
9.19
7.98
8.33
Return on Common Equity (%)
19.23
20.93
15.13
19.74
15.93
21.52
19.88
21.34
36.52
37.96
16.19
12.83
12.36
13.89

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
10,756
14,446
12,977
LT Borrowings
17,860
24,387
23,941
LT Finance Leases
3,322
3,219
3,203
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
1,867
1,867
1,878
Market Capitalization
171,987
216,618
405,721

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
66,897
71,174
67,501
Cash, Cash Equivalents & STI
41,158
42,098
42,111
Accounts Receivable, Net
6,748
7,203
8,080
Inventories
6,937
7,505
7,848
Total Current Liabilities
51,604
47,890
50,152
Payables & Accruals
- -
- -
- -
ST Debt
10,756
14,446
12,977
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
12.85%
24.13%
21.73%
Free Cash Flow
-136.19%
-23.22%
-539.03%
Net Income, GAAP
12.68%
14.56%
12.22%
Sales/Revenue/Turnover
8.8%
9.95%
10.3%
Total Cash Common Dividend
- -
- -
13.89%

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
9,633
11,065
11,804
11,553
44,055
2025
11,949
11,699
- -
12,594
48,591
2026
12,532
14,245
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.78
1.1
1.3
1.04
4.21
2025
1.31
1.11
- -
0.94
4.3
2026
1.22
1.62
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
4.4
2025
- -
- -
- -
- -
4.57
2026
- -
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Leuh Fang
Full Time Employees
6,641
Sector
Electronic technology
Industry
Semiconductors
Address
Hsinchu Science Park Hsinchu TP Taiwan 300096
IPO Date
Mar 25, 1998
Website
vis.com.tw
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Business
Vanguard International Semiconductor Corporation (VIS) (5347.TWO) is a leading Taiwanese specialty integrated circuit (IC) foundry service provider that manufactures, sells, packages, tests, and designs semiconductor devices for industrial, automotive, consumer electronics, renewable energy, IoT, AI, and cloud computing markets. The company offers a wide range of foundry process technologies, including high voltage; ultra high voltage; bipolar-CMOS-DMOS (BCD); silicon-on-insulator (SOI); discrete; logic; mixed-signal; analog; high precision analog; embedded memory; micro-electro-mechanical systems (MEMS); radio frequency ICs (RFICs); and embedded nonvolatile solutions, along with backend services such as multiple project wafers, mask making and repair, front-side metallization, wafer-level chip-scale packaging (WLCSP), redistribution layers (RDL), and automotive-grade solutions. VIS operates five 8-inch wafer fabrication facilities in Taiwan and Singapore, with sales offices in major cities worldwide including the United States and China; it was founded in December 1994 and is headquartered at Park Avenue-3rd, Hsinchu Science Park, Hsinchu City, Taiwan. In 2024, VIS formed a joint venture, VisionPower Semiconductor Manufacturing Company (VSMC), with NXP Semiconductors to build a $7.8 billion 300mm wafer fab in Singapore, where VIS holds a 60% stake, broke ground in the third quarter, and plans production as early as late 2026 to enhance geographic resilience and mature chip capacity. The company also maintains a strategic agreement with Episil Technologies for silicon carbide (SiC) wafer research, development, and production. VIS, affiliated with Taiwan Semiconductor Manufacturing Co., listed on the Taipei Exchange in 1998 and continues to invest in niche process technologies for customer competitiveness.